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7626266 |
Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption
A semiconductor integrated circuit device includes a functional circuit block, a power supply for supplying power to the functional circuit block, a power supply interruption circuit disposed...
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7622750 |
Optical device package and optical semiconductor device using the same
An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die...
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7619316 |
Semiconductor package and method for manufacturing the same
A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal...
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7615860 |
Rigid-flex printed circuit board with weakening structure
A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral...
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7615835 |
Package for semiconductor acceleration sensor
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof,...
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7615482 |
Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength
Disclosed is a structure and method for forming a structure including a SiCOH layer having increased mechanical strength. The structure includes a substrate having a layer of dielectric or...
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7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
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7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a...
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7592704 |
Etched interposer for integrated circuit devices
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected...
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7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7579684 |
Methods for packing microfeature devices and microfeature devices formed by such methods
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one...
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7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
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7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically...
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7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
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7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect...
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7564131 |
Semiconductor package and method of making a semiconductor package
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on...
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7563651 |
Method of fabricating a substrate with a concave surface
Bending generated in a side of a device mounting surface of an organic resin substrate after an assembly process for a semiconductor device is inhibited, thereby providing an improved production...
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7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads
A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which...
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7557449 |
Flexible via design to improve reliability
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via...
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7554193 |
Semiconductor device
A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without...
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7550845 |
Ball grid array package with separated stiffener layer
In a ball grid array (BGA) package, a first stiffener is attached to a surface of a substrate. A second stiffener is attached to the surface of the substrate to be co-planar with the first...
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7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
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7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers...
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7545029 |
Stack microelectronic assemblies
A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface...
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7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same
A wafer level package may include a semiconductor substrate supporting an electrode pad. A first insulating layer may be provided on the semiconductor substrate. The first insulating layer may...
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7538417 |
Semiconductor device with signal line having decreased characteristic impedance
A semiconductor device includes a semiconductor chip, electrodes pads, first and second insulating layers, first and second conductive patterns and external terminals. The electrode pads are formed...
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7535095 |
Printed wiring board and method for producing the same
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among...
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7534649 |
Thermoset polyimides for microelectronic applications
Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are...
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7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer
An integrated circuit having post passivation interconnections with a second connection pattern is disclosed. A passivation layer (preferably made of a non-oxide material) is formed over the...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7525192 |
Printed circuit board with quartz crystal oscillator
A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the...
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7525190 |
Printed wiring board with wiring pattern having narrow width portion
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d , and a wiring pattern 58 is...
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7525188 |
Multilayer circuit board and production method for same
In a multilayer circuit board of the present invention, a plurality of circuit substrates configured by forming a circuit pattern on an insulating base material are stacked via an insulating layer,...
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7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
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7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film
A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface...
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7514781 |
Circuit substrate and manufacturing method thereof
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric...
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7511368 |
Carrier device for electronic chip
A surface mount electronic chip ( 10 ) is mounted on a holder ( 70 ) and electrically connected to holder terminals ( 74,76, 80 ) by the use of a carrier device ( 30 ). The carrier device has clips...
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7511365 |
Thermal enhanced low profile package structure
A thermal enhanced low profile package structure and a method for fabricating the same are provided. The package structure typically includes a metallization layer with an electronic component...
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7508072 |
Semiconductor device with pad electrode for testing and manufacturing method of the same
The invention prevents a pad electrode for external connection of a semiconductor device from being damaged. An electronic circuit, a first pad electrode connected to the electronic circuit, and a...
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7508067 |
Semiconductor insulation structure
A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in...
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7504735 |
Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
A wiring board for manufacturing a resin-molding type semiconductor device includes a plurality of element regions each having a mount region on which a semiconductor element is mounted and an...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7501701 |
Rewiring substrate strip having a plurality of semiconductor component positions
A rewiring substrate strip ( 100 ) has a plurality of semiconductor component positions ( 2 ) for semiconductor components ( 3 ). The semiconductor component positions are arranged in rows and...
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7501695 |
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same are disclosed. Presented HFIC assembly method has the optimized structure for minimizing the...
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7498670 |
Semiconductor structures having electrophoretically insulated vias
Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting...
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7495337 |
Dual-gate device and method
A dual-gate device is formed over and insulated from a semiconductor substrate which may include additional functional circuits that can be interconnected to the dual-gate device. The dual-gate...
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7489036 |
Thin-film device
A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked...
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7489032 |
Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of...
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7485976 |
Tamper resistant packaging and approach
A tamper-resistant packaging approach protects non-volatile memory. According to an example embodiment of the present invention, an array of magnetic memory elements ( 130 - 132 ) in an integrated...
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7485955 |
Semiconductor package having step type die and method for manufacturing the same
A variety of non-rectangular IC chips having a stepped or modified periphery or edge profile including one or more recessed or indented peripheral regions are provided for incorporation in modified...
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