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7619316 |
Semiconductor package and method for manufacturing the same
A semiconductor package includes: a build-up wiring layer including a metal wiring layer and an insulation resin layer; and a low thermal expansion material layer having a coefficient of thermal...
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7615411 |
Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
A semiconductor package includes a base plate, at least one semiconductor constructing body which is formed on one surface of the base plate and has a plurality of external connection electrodes...
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7607560 |
Semiconductor die attachment for high vacuum tubes
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting...
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7605464 |
Semiconductor device
A semiconductor device includes: a semiconductor substrate having an integrated circuit formed thereon and an electrode electrically coupled to the integrated circuit; a passivation film formed on...
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7605463 |
Interposer and method for producing the same and electronic device
An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring,...
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7605460 |
Method and apparatus for a power distribution system
A method and apparatus is provided to reduce the spreading inductance and increase the distributed capacitance of power planes within the power distribution system of a semiconductor package...
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7605075 |
Multilayer circuit board and method of manufacturing the same
A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7595997 |
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7589424 |
Thin silicon based substrate
Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build...
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7589416 |
Substrate, electronic component, and manufacturing method of these
To fill a conductive material in an opening portion formed in a base of an electronic component, a groove is formed to surround an opening in an upper conductor, and the upper conductor is divided...
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7582973 |
Flip-chip type assembly
A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly...
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7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7582961 |
Package structure with circuits directly connected to semiconductor chip
A package structure with circuit directly connected to semiconductor chip, which comprises: a carrier board, a semiconductor chip, and at least a built-up structure. The carrier board is formed...
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RE40887 |
Semiconductor chip with redistribution metal layer
A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor...
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7576424 |
Semiconductor device
A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a...
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7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
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7572681 |
Embedded electronic component package
A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in...
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7569925 |
Module with built-in component
A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing...
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7569924 |
Semiconductor device and manufacturing method thereof
A semiconductor chip 11 comprising an element formation layer which is formed on a first main surface 35 A of a semiconductor substrate 35 and has a semiconductor element, through electrodes ...
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7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
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7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
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7564131 |
Semiconductor package and method of making a semiconductor package
Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on...
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7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the...
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7557455 |
System and apparatus that reduce corrosion of an integrated circuit through its bond pads
A bond pad structure has a first conductive layer and an anti-reflective coating layer disposed on the first conductive layer. The first conductive layer includes first and second portions (which...
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7557449 |
Flexible via design to improve reliability
An integrated circuit includes a metallization layer, a first metal line in the metallization layer, and a first via electrically connected to the first metal line. The first via has a first via...
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7557440 |
Wiring board and ceramic chip to be embedded
A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated...
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7554176 |
Integrated circuits having a multi-layer structure with a seal ring
A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon...
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7550847 |
Packaged microelectronic devices and methods for packaging microelectronic devices
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a...
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7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
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7547957 |
Thin film capacitors and methods of making the same
An apparatus including a first electrode; a second electrode; a first and second ceramic material disposed between the first electrode and the second electrode, the second ceramic material having a...
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7545663 |
Semiconductor storage device
Data transfer speed is increased in a semiconductor storage device in which the core unit and the interface unit are separate chips. The device has a plurality of core chips through in which a...
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7541670 |
Semiconductor device having terminals
The power semiconductor package includes a semiconductor mounting substrate, a mother case having an opening and containing the semiconductor mounting substrate therein, a securing member having a...
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7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
A first conductive layer is formed. An insulating layer is formed so that at least a part of the insulating layer is disposed on the first conductive layer. A second conductive layer is formed so...
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7538415 |
Semiconductor chip assembly with bumped terminal, filler and insulative base
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that...
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7535106 |
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material...
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7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure
The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a...
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7528480 |
Circuit board, semiconductor device, and manufacturing method of circuit board
A circuit board includes a semiconductor substrate which has a plurality of through holes passing from an upper surface to a lower surface thereof. A plurality of wiring lines are provided on the...
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7528479 |
Multilayer substrate for digital tuner and multilayer substrate
Mounting components such as LSIs, which emit noise to the outside and are subjected to the influence of external noise, on the top-most layer and the bottom-most layer respectively, a co-existing...
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7528478 |
Semiconductor devices having post passivation interconnections and a buffer layer
An integrated circuit having post passivation interconnections with a second connection pattern is disclosed. A passivation layer (preferably made of a non-oxide material) is formed over the...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7525190 |
Printed wiring board with wiring pattern having narrow width portion
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58 b, 58 c and 58 d , and a wiring pattern 58 is...
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7525189 |
Semiconductor device, wiring board, and manufacturing method thereof
A wiring board ( 20 ) includes a first wiring portion ( 10 ) having a plurality of wiring layers ( 1 ) and a plurality of external connecting bumps ( 5 ), and a second wiring portion ( 15 )...
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7521796 |
Method of making the semiconductor device, circuit board, and electronic instrument
A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device ( 150 ) has a...
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7521795 |
Semiconductor package
A semiconductor package has: a semiconductor chip having first and second main electrodes arranged on two principal surfaces being opposite to each other; a first main wiring plate connected to the...
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7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
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7518231 |
Differential chip performance within a multi-chip package
A multi-chip package comprising at least a first die and a second die, wherein each die comprises an integrated circuit (IC) disposed thereon. Each of the first die and the second die comprise a...
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7514780 |
Power semiconductor device
A power semiconductor device, having a first semiconductor region, and a second semiconductor region; mounted with a first electrode pad on a semiconductor substrate main surface at the inside...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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