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9041189 Semiconductor package and method of fabricating the same  
A method of fabricating a semiconductor package is provided, including: providing a carrier having a plurality of chip areas defined thereon, and forming a connection unit on each of the chip...
9041190 Semiconductor package  
A semiconductor package, wherein, in bonding of members constituting the semiconductor package, by using bonding layers containing 98 wt % or more of one metallic element such as silver having a...
9035450 Semiconductor device and interconnect substrate  
A semiconductor substrate includes a semiconductor chip and an interconnect substrate. The interconnect substrate has an interconnect region between a first main surface formed with plural orderly...
9035189 Circuit board with flexible region and method for production thereof  
A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9029928 Semiconductor device comprising a passive component of capacitors and process for fabrication  
A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with...
9030002 Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer  
A semiconductor device includes an interface layer, a smooth conductive layer disposed over the interface layer, and a first insulating layer disposed over a first surface of the smooth conductive...
9030017 Z-connection using electroless plating  
An assembly includes a substrate having a substrate conductor and a contact at a first surface and a terminal at a second surface for electrically interconnecting the assembly with a component...
9024446 Element mounting substrate and semiconductor module  
Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had...
9017808 Composite thermal interface material system and method using nano-scale components  
A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a...
9018537 Surface-mountable electronic device  
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion....
9018752 Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards  
Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to...
9006884 Three dimensional semiconductor device including pads  
A semiconductor device includes a substrate in which a cell region and a contact region are defined, a pad structure including a plurality of first conductive layers and a plurality of first...
9001520 Microelectronic structures having laminated or embedded glass routing structures for high density packaging  
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a...
9000587 Wafer-level thin chip integration  
A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded...
8999753 Semiconductor mounting device and method for manufacturing semiconductor mounting device  
A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first...
8987884 Package assembly and methods for forming the same  
A device includes a first package component, and a second package component underlying the first package component. The second package component includes a first electrical connector at a top...
8987060 Method for making circuit board  
A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate...
8987885 Packaged microdevices and methods for manufacturing packaged microdevices  
Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors...
8982574 Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing  
Contactless differential coupling structures can be used to communicate signals between circuits located on separate chips or from one chip to a probing device. The contactless coupling structures...
8981464 Wafer level chip scale package and process of manufacture  
Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of...
8975742 Printed wiring board  
A printed wiring board includes a substrate, a first buildup formed on a first surface of the substrate and including the outermost conductive layer, and a second buildup layer formed on a second...
8975741 Process for forming package-on-package structures  
A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach...
8969733 High power RF circuit  
The present invention is directed to an RF device that includes a ceramic layer characterized by a ceramic layer dielectric constant and includes an RF circuit arrangement having a predetermined...
8963319 Semiconductor chip with through hole vias  
According to one embodiment, a semiconductor chip includes a semiconductor substrate, a via and an insulating layer. The semiconductor substrate has a first major surface and a second major...
8957520 Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts  
A microelectronic assembly may include a substrate containing a dielectric element having first and second opposed surfaces. The dielectric element may include a first dielectric layer adjacent...
8956967 Method of forming an interconnection structure  
A method of forming an interconnection structure includes forming an opening in an insulation film by a dry etching process that uses an etching gas containing fluorine; cleaning a bottom surface...
8957321 Printed circuit board, mount structure thereof, and methods of producing these  
A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an...
8952507 Wiring board and method for manufacturing wiring board  
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the...
8952522 Wafer level package and fabrication method  
A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising...
8952526 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry  
A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry. The heat spreader...
8946884 Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product  
A substrate-less interposer for a stacked silicon interconnect technology (SSIT) product, includes: a plurality of metallization layers, at least a bottom most layer of the metallization layers...
8946886 Shielded electronic component package and method  
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a...
8941243 Semiconductor device and method of manufacturing thereof  
A semiconductor device includes a substrate, a plurality of signal lines, and at least one power line. The substrate includes an integrated circuit unit. The signal lines are disposed on the...
8941227 Package structure and method for manufacturing same  
An exemplary package substrate includes a package substrate, a first connection substrate, a first chip, a dielectric adhesive sheet, a second chip, and a second connection substrate. The package...
8933556 Wiring board  
A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from...
8929092 Circuit board, and semiconductor device having component mounted on circuit board  
A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is...
8928144 3D non-volatile memory device, memory system including the same, and method of manufacturing the same  
A three-dimensional 3D nonvolatile memory device includes vertical channel layers protruding from a substrate; interlayer insulating layers and conductive layer patterns alternately deposited...
8921984 Through silicon via in semiconductor device  
In a connecting portion between an interconnection and a first bump which is a part of a through electrode penetrating a semiconductor chip and which penetrates a semiconductor substrate, a...
8917340 Circuit board assembly and camera module using same  
A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A...
8912076 Crack deflector structure for improving semiconductor device robustness against saw-induced damage  
An integrated circuit containing a crack deflecting scribe seal which separates an interior region of the integrated circuit from a scribeline immediately outside the integrated circuit and a...
8912639 IC package with embedded transformer  
Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a...
8912642 Packaging substrate and fabrication method thereof  
A packaging substrate includes a first dielectric layer, a first circuit layer, a first metal bump, and a built-up structure. The first metal bump and the first circuit layer are embedded in and...
8907467 PCB based RF-power package window frame  
A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal attached to the die attach region, and a second terminal...
8906801 Processes for forming integrated circuits and integrated circuits formed thereby  
Processes for forming integrated circuits and integrated circuits formed thereby are provided in which a first dielectric layer including a first dielectric material is formed on an underlying...
8907463 Semiconductor device including stacked semiconductor chips  
A semiconductor device comprising a plurality of semiconductor chips and a plurality of through-line groups is disclosed. Each of the through-line groups consists of a unique number of...
8906743 Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods  
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the...
8907471 Window interposed die packaging  
A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic...
8900989 Method of fabricating an air gap using a damascene process and structure of same  
The present disclosure provides a method for forming a semiconductor device. The method includes forming first conductive layer structures in a first dielectric layer on a substrate; forming a...
8896129 Semiconductor device and manufacturing method for the same  
A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of...