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9041161 Semiconductor device with a chip prevention member  
There is provided a semiconductor device including a semiconductor layer, a protective layer including a transparent material, and a transparent resin layer that seals a gap between the...
9041182 Semiconductor package and method of manufacturing the same  
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side...
9035444 Semiconductor device having penetration electrodes penetrating through semiconductor chip  
Disclosed herein is a semiconductor device that includes: a first circuit formed on a chip having a main surface; first to nth penetration electrodes penetrating through the chip, where n is an...
9029988 Through silicon via in n+ epitaxy wafers with reduced parasitic capacitance  
A semiconductor device includes an epitaxy layer formed on semiconductor substrate, a device layer formed on the epitaxy layer, a trench formed within the semiconductor substrate and including a...
9024422 Package structure having embedded semiconductor component and fabrication method thereof  
A package structure having an embedded semiconductor component, includes: a chip having an active surface with electrode pads and an inactive surface opposite to the active surface; a first...
9024427 Multiple helix substrate and three-dimensional package with same  
A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes...
9018750 Thin film structure for high density inductors and redistribution in wafer level packaging  
Disclosed is a package that includes a wafer substrate and a metal stack seed layer. The metal stack seed layer includes a titanium thin film outer layer. A resist layer is provided in contact...
9018742 Electronic device and a method for fabricating an electronic device  
An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the...
9018751 Semiconductor module system having encapsulated through wire interconnect (TWI)  
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire...
9013033 Multiple die face-down stacking for two or more die  
A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction,...
9006901 Thin power device and preparation method thereof  
A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back...
9000573 Package on package structure and method for manufacturing same  
A package on package structure includes a connection substrate having a main body and electrically conductive posts, the main body includes a first surface and an opposite second surface, and each...
9000587 Wafer-level thin chip integration  
A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded...
8993381 Method for forming a thin semiconductor device  
A method for forming a thin semiconductor device is disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is provided on the lead frame and the at...
8994172 Connection of a chip provided with through vias  
A chip provided with through vias wherein the vias are formed of an opening with insulated walls coated with a conductive material and filled with an easily deformable insulating material,...
8994165 Power semiconductor device  
A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for...
8994182 Dielectric solder barrier for semiconductor devices  
The present disclosure relates to a dielectric solder barrier for a semiconductor die. In one embodiment, a semiconductor die includes a substrate, a semiconductor body on a first surface of the...
8994150 Systems and methods for lowering interconnect capacitance  
Methods and apparatus for lowering the capacitance of an interconnect, are disclosed. An example apparatus may include an interconnect formed in at least one integrated circuit and configured to...
8987885 Packaged microdevices and methods for manufacturing packaged microdevices  
Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors...
8987868 Method and apparatus for programmable heterogeneous integration of stacked semiconductor die  
Method and apparatus for programmable heterogeneous integration of stacked semiconductor die are described. In some examples, a semiconductor device includes a first integrated circuit (IC) die...
8981466 Multilayer dielectric structures for semiconductor nano-devices  
Multilayer dielectric structures are provided having silicon nitride (SiN) and silicon oxynitride (SiNO) films for use as capping layers, liners, spacer barrier layers, and etch stop layers, and...
8981572 Conductive pad on protruding through electrode semiconductor device  
To form a semiconductor device, a through electrode is formed in a semiconductor die, and a dielectric layer is then formed to cover the through electrode. The dielectric layer has an opening by...
8975747 Wiring material and semiconductor module using the same  
There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad...
8975761 Organic light-emitting display comprising a substrate having a fan-out unit configured to connect a display region with a pad unit  
A display apparatus and an organic display apparatus are disclosed. In one aspect, the display apparatus includes a display substrate divided into a display region for displaying an image via a...
8970011 Method and structure of forming backside through silicon via connections  
A structure including a substrate having a backside, a first through silicon via having sides, a bottom surface, and a first height protruding from the backside of the substrate, and a first...
8969200 Apparatus and method for integration of through substrate vias  
An apparatus and method are provided for integrating TSVs into devices prior to device contacts processing. The apparatus includes a semiconducting layer; one or more CMOS devices mounted on a top...
8970027 Metallization mixtures and electronic devices  
One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture...
8963317 Thermal dissipation through seal rings in 3DIC structure  
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the...
8963314 Packaged semiconductor product and method for manufacture thereof  
Packaged semiconductor product (2) including a first semiconductor device (4A) and a packaging structure with a protective envelope (6) and a first and second external electrode (8,10). The first...
8963318 Packaged semiconductor device  
A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first...
8959760 Printed wiring board and method for manufacturing same  
A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming...
8963316 Semiconductor device and method for manufacturing the same  
The present invention relates to a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a first redistribution layer and a conductive via. The...
8956973 Bottom-up plating of through-substrate vias  
According to one embodiment of the present invention, a method of plating a TSV hole in a substrate is provided. The TSV hole may include an open end terminating at a conductive pad, a stack of...
8953330 Security protection device and method  
A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further...
8952521 Semiconductor packages with integrated antenna and method of forming thereof  
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The...
8946079 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof  
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least...
8946886 Shielded electronic component package and method  
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a...
8946072 No-flow underfill for package with interposer frame  
Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package,...
8941230 Semiconductor package and manufacturing method  
A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the...
8937392 Semiconductor device  
A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first...
8933546 Electronic assembly with improved thermal management  
An electronic assembly includes a leadframe (2), a semiconductor component (3), and an electrically conductive connecting element (4) made of a composite material (5). The connecting element (4)...
8933556 Wiring board  
A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from...
8933555 Semiconductor chip package  
A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An encapsulation layer covers the...
8928130 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same  
A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to...
8927996 OLED display device that prevents shorting of interconnections during manufacture thereof  
An organic light emitting diode (OLED) display device, including a first substrate and a second substrate facing each other, a sealant arranged between the first and second substrates to adhere...
8927427 Anticipatory implant for TSV  
A method including introducing a dopant into a region of a substrate, etching a deep trench in the substrate through the region, gettering impurities introduced during etching of the deep trench...
8927410 Methods of forming through substrate interconnects  
A method of forming a through substrate interconnect includes forming a via into a semiconductor substrate. The via extends into semiconductive material of the substrate. A liquid dielectric is...
8921984 Through silicon via in semiconductor device  
In a connecting portion between an interconnection and a first bump which is a part of a through electrode penetrating a semiconductor chip and which penetrates a semiconductor substrate, a...
8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing  
An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of...
8922011 Mounting structure of electronic component with joining portions and method of manufacturing the same  
A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second...