|
Match
|
Document |
Document Title |
|
|
7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a...
|
|
|
7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs
The standard housing ( 27 ) of a semiconductor component ( 21 ), preferably a power semiconductor component features a plurality of external leads ( 1 - 5 ). Between adjacent external leads ( 2 - 3...
|
|
|
7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
|
|
|
7615406 |
Electronic device package manufacturing method and electronic device package
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space...
|
|
|
7612457 |
Semiconductor device including a stress buffer
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
|
|
|
7612441 |
Image-sensing chip package module adapted to dual-side soldering
An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using...
|
|
|
7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
|
|
|
7612333 |
Imaging apparatus and photoelectric conversion element package retaining unit
A photoelectric conversion element package retaining unit includes a photoelectric conversion element package having electrodes formed on a rear surface of a light-receiving surface, a printed...
|
|
|
7608863 |
Submount assembly and method of preparing optical module
The present invention relates to a submount on which at least one optical component is mounted. The submount has a mounted portion that is mounted onto a substrate or base, and a protruding portion...
|
|
|
7608789 |
Component arrangement provided with a carrier substrate
A component arrangement includes a carrier substrate having at least one component arranged thereon. The carrier substrate contains at least one layer of glass film and an intermediate layer, which...
|
|
|
7605463 |
Interposer and method for producing the same and electronic device
An interposer includes a substrate made of an inorganic material; a through wiring including conductors embedded in through holes; and an upper wiring and (or)a lower wiring. The through wiring,...
|
|
|
7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
|
|
|
7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a...
|
|
|
7592702 |
Via heat sink material
The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be...
|
|
|
7589415 |
Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip
A semiconductor chip in which a through hole penetrating through its surface and reverse surface is formed in a scribe line region in the vicinity of an active region where a functional device is...
|
|
|
7589414 |
I/O Architecture for integrated circuit package
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive...
|
|
|
7589411 |
Device for electrical connection of an integrated circuit chip
A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the...
|
|
|
7586187 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic...
|
|
|
7586181 |
Semiconductor device and method for manufacturing
A semiconductor device and method has trenches for raising reliability. An electrode pad, with a protective film and an interlayer film which form an opening on top, are on a substrate. A rewiring...
|
|
|
7582961 |
Package structure with circuits directly connected to semiconductor chip
A package structure with circuit directly connected to semiconductor chip, which comprises: a carrier board, a semiconductor chip, and at least a built-up structure. The carrier board is formed...
|
|
|
7576422 |
Semiconductor device
The present invention enhances the reliability of a semiconductor device. The semiconductor device includes a package substrate having a dry resist film which covers some conductive portions out of...
|
|
|
7573135 |
Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
The present invention includes the steps of forming a first resin film uncured on a wiring substrate including a wiring pattern, burying an electronic parts having a connection terminal on an...
|
|
|
7566969 |
Semiconductor device with improved arrangement of a through-hole in a wiring substrate
To miniaturize a semiconductor device, a package substrate is provided having terminals formed on the main surface, lands formed on the back surface, through holes formed by laser beam machining...
|
|
|
7566960 |
Interposing structure
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass...
|
|
|
7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the...
|
|
|
7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
|
|
|
7554189 |
Wireless communication module
A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic...
|
|
|
7554187 |
Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
A connecting structure between a circuit and another electronic component, includes a first electrode and a second electrode, and a dielectric material interposed between the first and second...
|
|
|
7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
|
|
|
7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
|
|
|
7547965 |
Package and package module of the package
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is...
|
|
|
7547961 |
IC card with bonding wire connections of different lengths
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
|
|
|
7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
|
|
|
7545035 |
Semiconductor device having several assembled integrated-circuit chips and method of assembling and electrically connecting the integrated-circuit chips
A semiconductor device includes several assembled integrated-circuit chips. A main integrated-circuit chip has at least one cavity in which electrical contacts are provided. A secondary...
|
|
|
7541662 |
Packaging chip having inductor therein
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a...
|
|
|
7535106 |
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material...
|
|
|
7535094 |
Substrate structure, a method and an arrangement for producing such substrate structure
The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a...
|
|
|
7535093 |
Method and apparatus for packaging circuit devices
A hermetically sealed package includes a lid ( 14 ) hermetically bonded to a wafer or substrate ( 12 ), with a chamber therebetween defined by a recess ( 16 ) in the lid. A circuit device ( 26 )...
|
|
|
7535090 |
LSI package provided with interface module
A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting...
|
|
|
7535087 |
Semiconductor device with lead frames
By disposing a rear surface of a first island 12 and a top surface of a second island 13 so as to at least partially overlap each other, a first semiconductor chip on the first island and a...
|
|
|
7528474 |
Stacked semiconductor package assembly having hollowed substrate
A stackable package substrate has an opening shaped and dimensioned to accommodate a mold cap of a package upon which the stackable package is to be mounted. On the die attach surface, the frame...
|
|
|
7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
|
|
|
7525189 |
Semiconductor device, wiring board, and manufacturing method thereof
A wiring board ( 20 ) includes a first wiring portion ( 10 ) having a plurality of wiring layers ( 1 ) and a plurality of external connecting bumps ( 5 ), and a second wiring portion ( 15 )...
|
|
|
7525188 |
Multilayer circuit board and production method for same
In a multilayer circuit board of the present invention, a plurality of circuit substrates configured by forming a circuit pattern on an insulating base material are stacked via an insulating layer,...
|
|
|
7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die...
|
|
|
7521807 |
Semiconductor device with inclined through holes
A semiconductor device has a semiconductor substrate with an inclined through hole extending between its two major surfaces in a peripheral part of the substrate, providing an electrical...
|
|
|
7521788 |
Semiconductor module with conductive element between chip packages
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the...
|
|
|
7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
|
|
|
7518248 |
Inductive filters and methods of fabrication therefor
A series of plated through hole (PTH) vias are interconnected by traces that alternate between a top surface and a bottom surface of a dielectric board. The PTH vias in the series can be positioned...
|
|
|
7518230 |
Semiconductor chip and semiconductor device
A semiconductor chip according to the present invention is a semiconductor chip having a circuit forming region, in which an internal circuit including a function element is formed, on the middle...
|