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7602059 |
Lead pin, circuit, semiconductor device, and method of forming lead pin
A lead pin of a circuit includes a pin, an insulator that surrounds the pin, and a conductor that surrounds the insulator, the conductor including non-uniformity.
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7589414 |
I/O Architecture for integrated circuit package
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive...
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RE40887 |
Semiconductor chip with redistribution metal layer
A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor...
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7557452 |
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
A conductive structure configured to connect a contact pad of a semiconductor device with a corresponding contact pad of a substrate. The conductive structure includes two interconnectable members,...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550836 |
Structure of package on package and method for fabricating the same
A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins....
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7531895 |
Integrated circuit package and method of manufacture thereof
An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7479680 |
Method and apparatus that provides differential connections with improved ESD protection and routing
The present invention provides a single ESD device package that can be used to provide ESD protection to multiple high-speed lines, in particular multiple high-speed differential lines. The present...
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7449772 |
Chip-type electronic component including thin-film circuit elements
A chip-type electronic component includes a substrate, a common potential layer formed on an upper side of the substrate, an insulating film formed on the common potential layer, and provided to...
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7436052 |
Repatterned integrated circuit chip package
A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection...
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7372169 |
Arrangement of conductive pads on grid array package and on circuit board
The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are...
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7371687 |
Electronic circuit device
An electronic circuit device has a high-density mount board ( 2 ), on which are disposed a microcomputer ( 3 ) and random access memory ( 7 ) which are connected to each other through an exclusive...
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7365419 |
Surface-mount packaging for chip
A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very...
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7358603 |
High density electronic packages
A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of...
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7348661 |
Array capacitor apparatuses to filter input/output signal
An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package...
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7323776 |
Elevated heat dissipating device
The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate....
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7323775 |
Memory module
A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation,...
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7319269 |
Semiconductor device power interconnect striping
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to...
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7309916 |
Semiconductor package and method for its manufacture
A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one...
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7297563 |
Method of making contact pin card system
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly...
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7277274 |
Keypad of portable wireless terminal and fabrication method thereof
A keypad of a portable wireless terminal includes a sheet having a plurality of holes, a plurality of keys inserted into respective ones of the holes, and a silicon adhesive layer on a lower...
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7271047 |
Test structure and method for measuring the resistance of line-end vias
A test structure and methods of using and making the same are provided. In one aspect, a test structure is provided that includes a first conductor that has a first end and a second conductor that...
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7259453 |
Hexagonal array structure for ball grid array packages
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the...
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7242083 |
Substrate for IC package
A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and...
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7239024 |
Semiconductor package with recess for die
A semiconductor package is disclosed with a recess ( 51 ) for an integrated circuit die ( 52 ). The recess is made by bending or deforming all layers of a package substrate, and therefore the...
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7215030 |
Lead-free semiconductor package
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1...
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7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
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7211886 |
Three-dimensional multichip stack electronic package structure
The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at...
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7193305 |
Memory card ESC substrate insert
A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts...
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7161251 |
Partially populated ball grid design to accommodate landing pads close to the die
Methods and structures to reduce in semiconductor packages the length of critical electrical connections between bond pads on one or multiple semiconductor chips and wire landing pads on a...
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7129562 |
Dual-height cell with variable width power rail architecture
A standard cell architecture with a basic cell that spans multiple rows of the standard cell. This multi-row basic cell may be a dual-height cell that spans two rows, or it may span more than two...
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7119448 |
Main power inductance based on bond wires for a switching power converter
A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between...
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7102230 |
Circuit carrier and fabrication method thereof
A circuit carrier adapted for a pin grid array (PGA) package is disclosed. The circuit carrier comprises a substrate, at least one pin pad, at least one solder mask layer, at least one solder...
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7095107 |
Ball assignment schemes for integrated circuit packages
The present disclosure is directed to ball assignment schemes for ball grid array packages in integrated circuits with increased signal count. The ball assignment scheme includes an array of...
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7079390 |
System and method for heat dissipation and air flow redirection in a chassis
An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The...
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7064421 |
Wire bonding package
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed...
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7045443 |
Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus
A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be...
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7023076 |
Multiple chip semiconductor packages
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active...
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6989591 |
Method for making an integrated circuit of the surface-mount type and resulting circuit
The invention relates to a method for making an integrated circuit ( 40 ) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array...
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6960837 |
Method of connecting core I/O pins to backside chip I/O pads
An integrated circuit, comprising: a predefined block of functional circuitry having a plurality of I/O pins; and a backside I/O pad electrically connected to each I/O pin through a backside via of...
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6956285 |
EMI grounding pins for CPU/ASIC chips
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a...
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6953892 |
Connection housing for an electronic component
A connection housing includes a base body with lateral walls, which extend around the base body on top and which enclose the component to be inserted as well as inner contacts that are arranged...
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6949823 |
Method and apparatus for high electrical and thermal performance ball grid array package
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film...
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6946725 |
Electronic device having microscopically small contact areas and methods for producing the electronic device
An electronic device and a method for producing the electronic device which has at least one microscopically small contact area for an electronic circuit having interconnects that are on a surface...
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6933602 |
Semiconductor package having a thermally and electrically connected heatspreader
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one...
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6922344 |
Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device
The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency...
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6914326 |
Solder ball landpad design to improve laminate performance
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary...
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6911726 |
Microelectronic packaging and methods for thermally protecting package interconnects and components
Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is...
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6897557 |
Integrated electrical connector
An electrical connector is formed from a sheet of electrically conductive material that lies in between the two layers of nonconducting material that comprise the casing of an electrical chip. The...
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