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7372169 Arrangement of conductive pads on grid array package and on circuit board  
The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are...
7371687 Electronic circuit device  
An electronic circuit device has a high-density mount board ( 2 ), on which are disposed a microcomputer ( 3 ) and random access memory ( 7 ) which are connected to each other through an exclusive...
7365419 Surface-mount packaging for chip  
A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very...
7358603 High density electronic packages  
A high-density electrical package utilizing an array of high performance demountable electrical contacts such as UEC, T-Spring, F-Spring and their equivalent contained in a carrier in the form of...
7348661 Array capacitor apparatuses to filter input/output signal  
An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package...
7339259 Semiconductor device  
A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side...
7323776 Elevated heat dissipating device  
The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate....
7323775 Memory module  
A memory module comprises a base plate and one or more IC embedding seats formed thereon to provide IC memory chip being installed in detachable manner taking the advantage of easy installation,...
7319269 Semiconductor device power interconnect striping  
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to...
7309916 Semiconductor package and method for its manufacture  
A semiconductor package includes a metal plate in which one or more openings are formed, the metal plate mounting a semiconductor chip and a printed wire pattern substrate, e.g. a PCB, mounting one...
7301234 Stack type semiconductor package module utilizing solder coated stacking protrusions and method for manufacturing the same  
The stack type semiconductor package module includes a lower semiconductor package having a main substrate, a chip mounted on the main substrate and electrically connected to the main substrate...
7297563 Method of making contact pin card system  
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly...
7277274 Keypad of portable wireless terminal and fabrication method thereof  
A keypad of a portable wireless terminal includes a sheet having a plurality of holes, a plurality of keys inserted into respective ones of the holes, and a silicon adhesive layer on a lower...
7271047 Test structure and method for measuring the resistance of line-end vias  
A test structure and methods of using and making the same are provided. In one aspect, a test structure is provided that includes a first conductor that has a first end and a second conductor that...
7259453 Hexagonal array structure for ball grid array packages  
Solder balls may be arranged in hexagonal array on an integrated circuit package. The hexagonal array may increase the solder ball density, reducing solder ball fatigue. In some embodiments, the...
7242083 Substrate for IC package  
A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and...
7239024 Semiconductor package with recess for die  
A semiconductor package is disclosed with a recess ( 51 ) for an integrated circuit die ( 52 ). The recess is made by bending or deforming all layers of a package substrate, and therefore the...
7235872 Bow control in an electronic package  
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one...
7215030 Lead-free semiconductor package  
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1...
7211888 Encapsulation of pin solder for maintaining accuracy in pin position  
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
7211886 Three-dimensional multichip stack electronic package structure  
The present invention relates to a three-dimensional multichip stack electronic package structure and method for making the same, including a main substrate having at least a pin-hole set and at...
7193305 Memory card ESC substrate insert  
A memory card comprising a leadframe having a die pad, and an insert having a plurality of contacts. Attached to the die pad is a semiconductor die which is electrically connected to the contacts...
7183644 Integrated circuit package with improved power signal connection  
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of...
7161251 Partially populated ball grid design to accommodate landing pads close to the die  
Methods and structures to reduce in semiconductor packages the length of critical electrical connections between bond pads on one or multiple semiconductor chips and wire landing pads on a...
7161236 Bow control in an electronic package  
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one...
7129562 Dual-height cell with variable width power rail architecture  
A standard cell architecture with a basic cell that spans multiple rows of the standard cell. This multi-row basic cell may be a dual-height cell that spans two rows, or it may span more than two...
7119448 Main power inductance based on bond wires for a switching power converter  
A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between...
7102230 Circuit carrier and fabrication method thereof  
A circuit carrier adapted for a pin grid array (PGA) package is disclosed. The circuit carrier comprises a substrate, at least one pin pad, at least one solder mask layer, at least one solder...
7095107 Ball assignment schemes for integrated circuit packages  
The present disclosure is directed to ball assignment schemes for ball grid array packages in integrated circuits with increased signal count. The ball assignment scheme includes an array of...
7079390 System and method for heat dissipation and air flow redirection in a chassis  
An apparatus for heat dissipation in a chassis housing an electronic system, and a method for implementing the same. The apparatus comprises a heat sink base for collecting thermal heat. The...
7064421 Wire bonding package  
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed...
7045443 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus  
A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be...
7023076 Multiple chip semiconductor packages  
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active...
7005753 Optimization of routing layers and board space requirements for a ball grid array land pattern  
A method, system, and apparatus for optimizing routing layers and board space requirements for a ball grid array land pattern is described. The land pattern includes a plurality of conductive pads...
7005736 Semiconductor device power interconnect striping  
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to...
7002244 Semiconductor device  
There is a need to provide a semiconductor device in which strain in a bonding member resulting from the difference in thermal deformation between a lead electrode and a semiconductor chip, which...
6989591 Method for making an integrated circuit of the surface-mount type and resulting circuit  
The invention relates to a method for making an integrated circuit ( 40 ) of the surface-mount type the comprising, first of all, manufacture of a package having a rear face and a pin grid array...
6974765 Encapsulation of pin solder for maintaining accuracy in pin position  
Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts.
6960837 Method of connecting core I/O pins to backside chip I/O pads  
An integrated circuit, comprising: a predefined block of functional circuitry having a plurality of I/O pins; and a backside I/O pad electrically connected to each I/O pin through a backside via of...
6956285 EMI grounding pins for CPU/ASIC chips  
An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a...
6953892 Connection housing for an electronic component  
A connection housing includes a base body with lateral walls, which extend around the base body on top and which enclose the component to be inserted as well as inner contacts that are arranged...
6949823 Method and apparatus for high electrical and thermal performance ball grid array package  
A high electrical and thermal performance thick film ceramic ball grid array package with a laser cut die cavity is presented. The thick film ceramic ball grid array package may have a thick film...
6946726 Chip carrier substrate with a land grid array and external bond terminals  
A carrier for a semiconductor die has a substrate with a cavity formed in the substrate. The cavity has a bottom and sidewalls, and the sidewalls have a stepped tier. Electrically conductive...
6946725 Electronic device having microscopically small contact areas and methods for producing the electronic device  
An electronic device and a method for producing the electronic device which has at least one microscopically small contact area for an electronic circuit having interconnects that are on a surface...
6933602 Semiconductor package having a thermally and electrically connected heatspreader  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one...
6922344 Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device  
The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency...
6914326 Solder ball landpad design to improve laminate performance  
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary...
6911726 Microelectronic packaging and methods for thermally protecting package interconnects and components  
Apparatus and methods are provided wherein the reflowable electrically conductive interconnect material coupling the interconnects and/or land-side components of a microelectronic package is...
6897557 Integrated electrical connector  
An electrical connector is formed from a sheet of electrically conductive material that lies in between the two layers of nonconducting material that comprise the casing of an electrical chip. The...
6897556 I/O architecture for integrated circuit package  
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive...
Matches 1 - 50 out of 389 1 2 3 4 5 6 7 8 >