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7635910 |
Semiconductor package and method
A semiconductor package is disclosed. In one embodiment, the semiconductor package includes a leadframe including a chip position and a plurality of leadfingers. Each leadfinger includes a cutout...
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7635915 |
Apparatus and method for use in mounting electronic elements
Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a...
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7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or...
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7615851 |
Integrated circuit package system
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
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7615852 |
Semiconductor component in a housing with mechanically inforcing flat conductor webs
The standard housing ( 27 ) of a semiconductor component ( 21 ), preferably a power semiconductor component features a plurality of external leads ( 1 - 5 ). Between adjacent external leads ( 2 - 3...
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7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same
Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that...
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7612457 |
Semiconductor device including a stress buffer
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
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7612445 |
Circuit apparatus and method of fabricating the apparatus
The likelihood of exfoliation of a sealing resin layer at a pad electrode part is reduced so that the reliability of a circuit apparatus is improved. A circuit apparatus includes a wiring layer, a...
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7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
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7602052 |
Semiconductor device
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according...
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7602630 |
Configurable inputs and outputs for memory stacking system and method
Embodiments of the present invention relate to configurable inputs and/or outputs for memory and memory stacking applications. More specifically, embodiments of the present invention include memory...
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7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a...
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7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
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7576437 |
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same
Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving...
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7576418 |
Lead frame structure and applications thereof
A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first...
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7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite...
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7566963 |
Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe
A stacked assembly of semiconductor packages primarily comprises a plurality of stacked semiconductor packages. Each semiconductor package includes an encapsulant, at least a chip, and a plurality...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7554184 |
Image sensor chip package
A chip package ( 200 ) includes a carrier ( 20 ), a chip ( 22 ), a second conductive means ( 26 ) and a transparent cover ( 28 ). The carrier ( 20 ) includes a base ( 24 ). The chip is mounted on...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7541669 |
Semiconductor device package with base features to reduce leakage
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
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7538415 |
Semiconductor chip assembly with bumped terminal, filler and insulative base
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a filler, a connection joint that...
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7534654 |
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7535086 |
Integrated circuit package-on-package stacking system
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and...
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7535084 |
Multi-chip package with a single die pad
A multi-chip package with a single die pad is provided. The multi-chip package includes a leadframe having a die pad and a plurality of leads surrounding the die pad. Each of the leads includes an...
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7531895 |
Integrated circuit package and method of manufacture thereof
An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a...
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7531893 |
Power semiconductor devices having integrated inductor
An electronic device ( 100 ) with one or more semiconductor chips ( 102 ) has an inductor ( 101 ) assembled on or under the chips. The inductor includes a ferromagnetic body ( 111 ) and a wire (...
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7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die...
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7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
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7514768 |
Package structure for a semiconductor device incorporating enhanced solder bump structure
A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering...
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7508061 |
Three-dimensional semiconductor module having multi-sided ground block
The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7504715 |
Packaging of a microchip device
The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically...
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7495327 |
Chip stacking structure
An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active...
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7476962 |
Stack semiconductor package formed by multiple molding and method of manufacturing the same
Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages...
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7476966 |
Semiconductor module
One of the aspects of the present invention is to provide a semiconductor module, which includes at least one semiconductor device including a semiconductor element molded with a resin package...
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7466016 |
Bent lead transistor
A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and...
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7466013 |
Semiconductor die structure featuring a triple pad organization
A semiconductor die featuring vertical rows of bonding pad structures is disclosed. The rows of bonding pad structures are located vertically in the Y direction, or traversing the width of the...
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7459770 |
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second...
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7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package
Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output...
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7453140 |
Semiconductor chip assembly with laterally aligned filler and insulative base
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a filler, a connection joint that electrically...
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7452786 |
Method for manufacturing thin film integrated circuit, and element substrate
Application form of and demand for an IC chip formed with a silicon wafer are expected to increase, and further reduction in cost is required. An object of the invention is to provide a structure...
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7440263 |
Image sensor and method for manufacturing the same
An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the...
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7420216 |
Reflection type light-emitting diode device
A reflection type light-emitting diode device of a kind capable of emitting rays of light to the outside after having been reflected by a reflecting surface includes a recessed casing ( 22 ) having...
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7417310 |
Circuit module having force resistant construction
Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably...
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7414301 |
Printed circuit board with soldering lands
The present invention provides a printed circuit board having an area of non-resist portion, where each non-resist portion expands gradually toward the back end of a land array in the dipping...
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7414308 |
Integrated circuit with offset pins
An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins...
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7399990 |
Wafer-level package having test terminal
A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip terminals...
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7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
A semiconductor integrated circuit package having a leadframe ( 108 ) that includes a leadframe pad ( 103 a ) disposed under a die ( 100 ) and a bonding metal area ( 101 a ) that is disposed over...
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