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9041187 Power semiconductor package with multiple dies  
A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to...
9041186 Encapsulated semiconductor chips with wiring including controlling chip and method of making the same  
Disclosed is a semiconductor device including first and second semiconductor elements, first and second external connection terminals and a sealing member. The first external connection terminal...
9041160 Semiconductor integrated circuit device  
A semiconductor integrated circuit device includes: a rectangular shaped semiconductor substrate; a metal wiring layer formed on or over the semiconductor substrate; and a passivation layer...
9041185 Semiconductor device and connection checking method for semiconductor device  
A semiconductor device includes a substrate, a first land formed in a first surface of the substrate, a second land formed in a second surface of the substrate, a first terminal coupled to the...
9035194 Circuit board with integrated passive devices  
Embodiments of the present disclosure are directed towards a circuit board having integrated passive devices such as inductors, capacitors, resistors and associated techniques and configurations....
9035449 Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member  
[Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face...
9035472 Semiconductor device  
In a semiconductor device, a conductor pattern is disposed in a position overlapped by a semiconductor chip in a thickness direction over the mounting surface (lower surface) of a wiring board. A...
9022632 LED package and a backlight unit unit comprising said LED package  
A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the...
9018750 Thin film structure for high density inductors and redistribution in wafer level packaging  
Disclosed is a package that includes a wafer substrate and a metal stack seed layer. The metal stack seed layer includes a titanium thin film outer layer. A resist layer is provided in contact...
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9006879 Semicondutor device package placed within fitting portion of wiring member and attached to heat sink  
The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the...
9000579 Integrated circuit package system with bonding in via  
An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit...
8994156 Semiconductor device packages with solder joint enhancement elements  
Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements...
8994165 Power semiconductor device  
A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for...
8987912 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end...
8987064 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an...
8982561 Lightweight audio system for automotive applications and method  
A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio...
8981540 Electronic device and package structure thereof  
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an...
8981552 Power converter, semiconductor device, and method for manufacturing power converter  
This power converter includes a first substrate, a second substrate, a power conversion element, and a case portion, and the case portion includes a first connection terminal connected to a first...
8981539 Packaged power semiconductor with interconnection of dies and metal clips on lead frame  
A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the...
8975740 Semiconductor module  
A semiconductor module has a metallic base plate; an insulated circuit board fixed on the metallic base plate; a semiconductor element mounted on the insulated circuit board; a resin case to house...
8956915 Method of manufacturing a three-dimensional packaging semiconductor device  
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a...
8952261 Interconnect-use electronic component and method for producing same  
The present invention enables additional processes required for forming vertical wiring and rewiring in a double face package (DFP) or a wafer level chip size package (WLCSP) to be implemented...
8952523 Integrated circuit package lid configured for package coplanarity  
An integrated circuit package apparatus includes a packaging substrate, an integrated circuit coupled to an upper side of the packaging substrate, an array of contacts coupled to an underside of...
8952520 Power semiconductor device  
A power semiconductor device with improved productivity, reduced size and reduction of amounting area therefore is provided. In the provided power semiconductor device, an external terminal does...
8952521 Semiconductor packages with integrated antenna and method of forming thereof  
In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The...
8946884 Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product  
A substrate-less interposer for a stacked silicon interconnect technology (SSIT) product, includes: a plurality of metallization layers, at least a bottom most layer of the metallization layers...
8946875 Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems  
A packaged semiconductor device includes at least first and second lead-fingers. A molded structure forms a cavity and is molded around portions of each of the first and second lead-fingers to...
8941228 Semiconductor module and manufacturing method thereof  
A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal...
8933554 Semiconductor device and method for manufacturing semiconductor device  
A semiconductor device has an insulation substrate formed with a conductive pattern; an independent terminal, which is an externally leading terminal, soldered to the conductive pattern of the...
8928049 High efficiency module  
A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode....
8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing  
An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of...
8922011 Mounting structure of electronic component with joining portions and method of manufacturing the same  
A mounting structure of an electronic component includes a plurality of joining portions that join a plurality of first electrode terminals on the electronic component to a plurality of second...
8921987 Semiconductor device and measurement device having an oscillator  
A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first...
8921989 Power electronics modules with solder layers having reduced thermal stress  
Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface,...
8917522 Semiconductor device  
A semiconductor device that can suppress variation of GND potential of a control board and prevent malfunction of IC without restricting a mounting direction of the IC of the control board is...
8907469 Integrated circuit package assembly and method of forming the same  
An integrated circuit package assembly includes a first integrated circuit package and a second integrated circuit package disposed under the first integrated circuit package. Solder bumps are...
8907470 Millimeter wave wafer level chip scale packaging (WLCSP) device and related method  
Various embodiments include wafer level chip scale package (WLCSP) structures and methods of tuning such structures. In some embodiments, the WLCSP structure includes: a printed circuit board...
8907471 Window interposed die packaging  
A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic...
8907468 Semiconductor device  
A semiconductor device includes a substrate having external connection terminals, and a semiconductor chip mounted over a semiconductor-chip mounting portion of the substrate. The external...
8898894 Capacitor-circuit board interface for welding system components  
A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an...
8890301 Packaging and methods for packaging  
A packaged integrated device can include a die attach pad having a top surface and a bottom surface. A plurality of leads physically and electrically separated from the die attach pad can be...
8876225 Actuator control unit and electric-mechanical brake unit  
The invention achieves a further downsizing of an actuator control unit. The actuator control unit has a control circuit controlling an actuator, and a bus bar electrically connected to the...
8878356 Package structure having micro-electro-mechanical system element and method of fabrication the same  
A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically...
8878229 Light emitting device package including a substrate having at least two recessed surfaces  
Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer...
8853708 Stacked multi-die packages with impedance control  
A microelectronic assembly may include microelectronic devices arranged in a stack and having device contacts exposed at respective front surfaces. Signal conductors having substantial portions...
8853694 Chip on film package including test pads and semiconductor devices including the same  
Provided are a chip on film (COF) package and semiconductor having the same. The COF package can include a flexible film having first and second surfaces opposite to and facing each other and...
8853842 Semiconductor device sealed with a resin molding  
An apparatus provides good bonding between a package structure and a substrate and extended solder bonding life, even under heat stress. Of a lead frame to be used for a package structure having a...
8841762 Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus  
A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the...
8841774 Semiconductor device including a first wiring having a bending portion a via  
A first wiring (1) has a bending portion (2), a first wiring region (1a) extending from the bending portion (2) in the X direction, and a second wiring region (1b) extending from the bending...