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7629677 |
Semiconductor package with inner leads exposed from an encapsulant
Provided is a semiconductor package including a high integration semiconductor chip and having a minimum area to be mounted on a circuit board. The semiconductor package includes a semiconductor...
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7615857 |
Modular three-dimensional chip multiprocessor
A chip multiprocessor die supports optional stacking of additional dies. The chip multiprocessor includes a plurality of processor cores, a memory controller, and stacked cache interface circuitry....
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7615854 |
Semiconductor package that includes stacked semiconductor die
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.
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7615406 |
Electronic device package manufacturing method and electronic device package
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space...
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7608863 |
Submount assembly and method of preparing optical module
The present invention relates to a submount on which at least one optical component is mounted. The submount has a mounted portion that is mounted onto a substrate or base, and a protruding portion...
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7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
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7595550 |
Flex-based circuit module
A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7592681 |
Solid-state imaging apparatus
A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end...
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7589414 |
I/O Architecture for integrated circuit package
A circuit package may include an upper surface of first conductive elements and second conductive elements. The first conductive elements may receive input/output signals from respective conductive...
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7589413 |
Semiconductor device comprising a vertical semiconductor component and method for producing the same
A semiconductor device ( 1; 25 ) has a vertical semiconductor component ( 2 ), a first metalization ( 8 ) and a second metalization ( 13 ). The second metalization ( 13 ) has an integral film with...
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7589412 |
Semiconductor device
One of the aspects of the present invention is to provide a semiconductor device, which includes a base plate, an insulating substrate on the base plate, and a wiring patterned layer on the...
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7586186 |
Ball grid array
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
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7586185 |
Semiconductor device having a functional surface
A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has...
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7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
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7569923 |
Recyclying faulty multi-die packages
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7563647 |
Integrated circuit package system with interconnect support
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7550838 |
Semiconductor device
A semiconductor device includes a first power supply which is disposed in a first direction, a first pad array which is disposed in the first direction, adjacent to the first power supply line, a...
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7547965 |
Package and package module of the package
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is...
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7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
A semiconductor device includes a semiconductor substrate having a main surface, the main surface including a first and second areas formed with a high-frequency circuit element, and a third area...
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7525200 |
Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
A semiconductor chip is provided comprising a semiconductor substrate on which an integrated circuit is formed. The semiconductor chip, which is provided on the semiconductor substrate in an area...
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7514800 |
Semiconductor device and wire bonding method therefor
A semiconductor device ( 10 ) that may have a wire bonding structure having reduced interference between bond wires and a path of a capillary has been disclosed. Semiconductor device ( 10 ) may...
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7511369 |
BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same
A three dimensional electronic module is disclosed. Conventional TSOP packages are modified to expose internal lead frame interconnects, thinned and stacked on a reroute substrate. The reroute...
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7508680 |
Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate
An adjustable-inductance (AI) filter, a tape distribution substrate including the filter, and a display panel assembly including the tape distribution substrate are provided. The...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7495341 |
Methods and apparatus for packaging integrated circuit devices
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and...
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7495329 |
Semiconductor memory card
A semiconductor memory card includes a nonvolatile memory chip mounted on an upper surface of a circuit board. The memory chip has first bonding pads formed close to a first side of the memory chip...
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7489021 |
Lead frame with included passive devices
An semiconductor device package ( 10 ) includes a semiconductor device (die) ( 12 ) and passive devices ( 14 ) electrically connected to a common lead frame ( 17 ). The lead frame ( 17 ) is formed...
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7488994 |
Coiled circuit device and method of making the same
A coiled circuit device is produced by forming a circuit layer on a substrate. Optional insulator layers may be disposed above and below the circuit layer. The circuit layer, which may be memory,...
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7485959 |
Structure for joining a semiconductor package to a substrate using a solder column
A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating...
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7482680 |
Customized non-volatile memory device packages
Non-volatile data memory cards, flash drives and other memory devices are customized by manufacturing core memory units all the same and then covering them by outer skins which may be made to have...
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7476965 |
Electronic device with integrated heat distributor
The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components....
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7468549 |
Method for producing a package for an electronic circuit and a substrate for a package
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region...
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7462940 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same
A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one...
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7456494 |
Surface mount electronic component and process for manufacturing same
A surface mount electronic component includes a set of a first lead terminal 2 a and a second lead terminal 3 b , a semiconductor element 6 a die-bonded to an island portion 4 a integrally...
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7449370 |
Production process for manufacturing such semiconductor package
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
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7446403 |
Carrier structure stacking system and method
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7429797 |
Electronic device and carrier substrate
Consistent with an example embodiment, an electronic device comprises a semiconductor device, particularly an integrated circuit, and a carrier substrate with conductive layers on the first side...
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7425758 |
Metal core foldover package structures
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
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7425757 |
Semiconductor power module
A semiconductor power module includes a filter element made of a magnetic material that can be exchanged as required, while providing a package having a compact size. The power module can be used...
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7414307 |
Electronic device and pressure sensor
An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses...
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7414306 |
Preamplifier integrated circuit on flex circuit for magnetic media storing devices
A preamplifier integrated circuit (IC) for a magnetic storage device includes a plurality of channels, each including at least one preamplifier and one or more interconnecting layers. A passivation...
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7397116 |
Semiconductor apparatus and production method thereof suitable for electric power devices
A semiconductor apparatus is characterized in that it comprises a semiconductor module having a plurality of semiconductor elements and an external connection terminal for externally connecting...
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7394164 |
Semiconductor device having bumps in a same row for staggered probing
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of...
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7394151 |
Semiconductor package with plated connection
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting...
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7391108 |
Package of solid-state imaging device
Disclosed herein is a package of solid-state imaging device for enclosing the solid-state imaging device having a plurality of signal output pads for outputting image signals, provided...
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