Match Document Document Title
9040388 Chip assembly with a coreless substrate employing a patterned adhesive layer  
A patterned adhesive layer including holes is employed to attach a coreless substrate layer to a stiffener. The patterned adhesive layer is confined to kerf regions, which are subsequently removed...
9040359 Molded interposer package and method for fabricating the same  
A method for fabricating a molded interposer package includes performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby...
9041182 Semiconductor package and method of manufacturing the same  
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side...
9041185 Semiconductor device and connection checking method for semiconductor device  
A semiconductor device includes a substrate, a first land formed in a first surface of the substrate, a second land formed in a second surface of the substrate, a first terminal coupled to the...
9035437 Packaged device comprising non-integer lead pitches and method of manufacturing the same  
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package...
9035439 Apparatus, system and method for use in mounting electronic elements  
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said...
9030000 Mold cap for semiconductor device  
A semiconductor package has a substrate with a solder mask layer, and upper and lower surfaces. Conductive traces and electrical contacts are formed on the substrate, and vias are formed in the...
9030001 Microelectronic packages with nanoparticle joining  
A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component,...
9029983 Metal-insulator-metal (MIM) capacitor  
In one embodiment, a chip comprises a capacitor and a resistor. The capacitor comprises a first capacitor terminal, a second capacitor terminal, and a dielectric layer between the first and second...
9029903 Light emitting diode package and method of manufacturing the same  
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips,...
9029894 Lead frame for optical semiconductor device and optical semiconductor device using the same  
The present invention relates to a lead frame for an optical semiconductor device including: a lead frame having a first plate part and a second plate part disposed so as to oppose to the first...
9024431 Semiconductor die contact structure and method  
A system and method for forming a semiconductor die contact structure is disclosed. An embodiment comprises a top level metal contact, such as copper, with a thickness large enough to act as a...
9018768 Integrated circuit having through silicon via structure with minimized deterioration  
A semiconductor device includes a circuit pattern over a first surface of a substrate, an insulating interlayer covering the circuit pattern, a TSV structure filling a via hole through the...
9018749 Stacked packages using laser direct structuring  
Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold...
9006911 Method for forming patterns of dense conductor lines and their contact pads, and memory array having dense conductor lines and contact pads  
A method for forming patterns of dense conductor lines and their contact pads is described. Parallel base line patterns are formed over a substrate. Each of the base line patterns is trimmed....
9000579 Integrated circuit package system with bonding in via  
An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit...
9000571 Surface-mounting light emitting diode device and method for manufacturing the same  
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces...
9000576 Package structure and manufacturing method thereof  
The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame...
8994157 Circuit system in a package  
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame...
8994161 Semiconductor device package and methods for producing same  
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate...
8994164 Semiconductor device and semiconductor device manufacturing method  
A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8987877 Semiconductor device  
A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first...
8987889 Semiconductor package with integrated interference shielding and method of manufacture thereof  
An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a...
8987912 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end...
8987875 Balanced stress assembly for semiconductor devices  
An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the...
8987888 Semiconductor package and semiconductor package module having the same  
Disclosed herein is a semiconductor package including: a semiconductor chip having a bonding pad; and a first substrate including a rerouting layer having short type rerouting patterns...
8987890 Flexible chip set encapsulation structure  
A flexible chip set encapsulation structure includes a chip set. The chip set comprises a plurality of spaced chips and a fixing film. The fixing film is adapted to wrap and fix the chips. The...
8981551 Semiconductor device comprising a crack stop structure  
A semiconductor device may include at least one pad adjacent a top surface of the device, and a metal crack stop structure below the at least one pad. The metal crack structure may have an inner...
8981540 Electronic device and package structure thereof  
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an...
8981539 Packaged power semiconductor with interconnection of dies and metal clips on lead frame  
A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the...
8975752 Multiple access over proximity communication  
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on...
8975738 Structure for microelectronic packaging with terminals on dielectric mass  
A structure may include a spacer element overlying a first portion of a first surface of a substrate; first terminals at a second surface of the substrate opposite the first surface; and second...
8975739 Package structure and method for manufacturing thereof  
The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation...
8971044 Semiconductor device  
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output...
8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster...
8963316 Semiconductor device and method for manufacturing the same  
The present invention relates to a semiconductor device and a method for making the same. The semiconductor device includes a substrate, a first redistribution layer and a conductive via. The...
8957507 Technology of reducing radiation noise of semiconductor device  
A first lead frame group is constituted by a plurality of lead frames that are connected to the first circuit, terminals of the plurality of lead frames being provided on a first side of the...
8957515 Integrated circuit package system with array of external interconnects  
An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for...
8957509 Integrated circuit packaging system with thermal emission and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a lead array having an innermost space with an innermost lead having an inner lead profile different around an...
8952519 Chip package and fabrication method thereof  
A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate, having a first surface and an opposing second surface. A spacer is disposed under...
8946880 Packaged semiconductor device having multilevel leadframes configured as modules  
A semiconductor system (100) has a first planar leadframe (101) with first leads (102) and pads (103) having attached electronic components (120), the first leadframe including a set of elongated...
8946763 Semiconductor light-emitting device  
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame....
8946705 Semiconductor device  
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed...
8941166 Multiple patterning method  
An integrated circuit memory comprises a set of lines each line having parallel X direction line portions in a first region and Y direction line portions in a second region. The second region is...
8941241 Semiconductor device and method of manufacturing the same  
A semiconductor device includes at least 4 conductive line groups arranged in parallel over one memory cell block and each configured to include conductive lines. First contact pads may be coupled...
8937390 Semiconductor device having a liquid cooling module  
A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said...
8937372 Integrated circuit package system with molded strip protrusion  
An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded...
8928136 Lead frame semiconductor device  
A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting...
8921984 Through silicon via in semiconductor device  
In a connecting portion between an interconnection and a first bump which is a part of a through electrode penetrating a semiconductor chip and which penetrates a semiconductor substrate, a...