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7615854 |
Semiconductor package that includes stacked semiconductor die
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.
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7612457 |
Semiconductor device including a stress buffer
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
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7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
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7608922 |
Semiconductor device including amplifier and frequency converter
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF VCO...
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7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
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7605460 |
Method and apparatus for a power distribution system
A method and apparatus is provided to reduce the spreading inductance and increase the distributed capacitance of power planes within the power distribution system of a semiconductor package...
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7602058 |
Flip-chip semiconductor device with improved power pad arrangement
A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction...
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7602056 |
On-die termination method for multi-chip packages
An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or...
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7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
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7595561 |
Semiconductor device including multiple rows of peripheral circuit units
In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge of...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7592250 |
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor...
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7589400 |
Inverter and vehicle drive unit using the same
The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first...
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7586186 |
Ball grid array
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
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7579683 |
Memory interface optimized for stacked configurations
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that...
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7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area
In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the...
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7573107 |
Power module
A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.
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7571415 |
Layout of power device
A layout of a power device is provided. The layout includes a substrate, a unit array, a plurality of first, second, third and fourth signal paths, and a first, second, third and fourth port. The...
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7569923 |
Recyclying faulty multi-die packages
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.
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7569916 |
Separable network interconnect systems and assemblies
Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower...
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7569428 |
Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same
Disclosed is a method for manufacturing a method for manufacturing a semiconductor device which comprises a substrate, a semiconductor chip and a plurality of terminals. The method comprises...
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7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect...
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7560808 |
Chip scale power LDMOS device
A semiconductor device includes at least one macro-cell device, the macro-cell device comprising a plurality of LDMOS devices. A first conductive layer is formed over the substrate, the first...
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7557444 |
Power-via structure for integration in advanced logic/smart-power technologies
A via structure is disclosed for use in a multi-layered semiconductor device, for forming electrical contacts between prescribed layers of the vertically aligned structures. The via structures...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7554181 |
Semiconductor device with non-overlapping chip mounting sections
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
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7554133 |
Pad current splitting
An integrated circuit with a monolithic semiconducting substrate formed in a chip, where the chip has a peripheral edge, a backside, and an opposing top on which circuitry is formed. A first ring...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7547964 |
Device packages having a III-nitride based power semiconductor device
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a...
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7547961 |
IC card with bonding wire connections of different lengths
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7525183 |
Surface mount multichip devices
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead...
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7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
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7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side...
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7514794 |
Semiconductor integrated circuit and the method of designing the layout
The semiconductor integrated circuit of the present invention comprises: a standard cell group including a power supply wiring group or a ground wiring group, which is arranged at an interval based...
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7514778 |
Power semiconductor device
A power semiconductor device is disclosed. In one embodiment, the power semiconductor device includes a plurality of device components that are contact-connected by bonding wires having different...
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7514774 |
Stacked multi-chip package with EMI shielding
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each...
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7511370 |
Power gridding scheme
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically...
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7508061 |
Three-dimensional semiconductor module having multi-sided ground block
The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The...
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7504721 |
Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips
Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7501709 |
BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance
A Ball Grid Array (BGA) integrated circuit package having (i) an additional dedicated ground ring on the package substrate which provides a reduced area return current loop path to reduce wire bond...
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7498671 |
Power semiconductor module
A semiconductor module of the present invention comprises a first conductive layer (film) and a second conductive layer (film) which are separately formed on the main surface of a packed substrate,...
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7495329 |
Semiconductor memory card
A semiconductor memory card includes a nonvolatile memory chip mounted on an upper surface of a circuit board. The memory chip has first bonding pads formed close to a first side of the memory chip...
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7489023 |
Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of...
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7485959 |
Structure for joining a semiconductor package to a substrate using a solder column
A semiconductor package and a package mounting substrate can be joined using a conductive material column. Each of the semiconductor package and the package mounting substrate include an insulating...
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7479693 |
Arrangement of conductive connectors in a power semiconductor device
One of the aspects of the present invention is to provide a power semiconductor device, including a first substrate having a first circuit pattern formed thereon, and a second substrate having a...
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7479680 |
Method and apparatus that provides differential connections with improved ESD protection and routing
The present invention provides a single ESD device package that can be used to provide ESD protection to multiple high-speed lines, in particular multiple high-speed differential lines. The present...
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7466013 |
Semiconductor die structure featuring a triple pad organization
A semiconductor die featuring vertical rows of bonding pad structures is disclosed. The rows of bonding pad structures are located vertically in the Y direction, or traversing the width of the...
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7465488 |
Bow control in an electronic package
A package including a package substrate, a die-substrate assembly including a substrate including a plurality of layers including a layer having a mesh to stiffen the substrate adapted to mount one...
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