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9041184 Chip-housing module and a method for forming a chip-housing module  
A chip-housing module is provided, the chip-housing module including a carrier configured to carry one or more chips; the carrier including a first plurality of openings, wherein each opening of...
9041205 Reliable microstrip routing for electronics components  
A semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package...
9041182 Semiconductor package and method of manufacturing the same  
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side...
9041183 Power module packaging with double sided planar interconnection and heat exchangers  
A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die,...
9006901 Thin power device and preparation method thereof  
A thin power device comprises a substrate having a first set of first contact pads at a front surface of the substrate electrically connecting to a second set of second contact pads at a back...
8987912 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a substrate having a conductor; a semiconductor chip disposed on the substrate and electrically connected to the conductor; a tubular electrode having one end...
8987887 Interconnection device for electronic circuits, notably microwave electronic circuits  
An interconnection device for elements to be interconnected such as electronic modules or circuits, comprises at least one transmission line coupled to a ground line, the two lines being produced...
8987765 Reflective bank structure and method for integrating a light emitting device  
Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a...
8987886 Copper pillar full metal via electrical circuit structure  
An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry...
8981546 Semiconductor package  
A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a...
8981540 Electronic device and package structure thereof  
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an...
8981550 Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same  
A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly...
8971044 Semiconductor device  
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output...
8963317 Thermal dissipation through seal rings in 3DIC structure  
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8963321 Semiconductor device including cladded base plate  
A semiconductor device includes a semiconductor chip joined with a substrate and a base plate joined with the substrate. The base plate includes a first metal layer clad to a second metal layer....
8957514 Operating and manufacturing a DC-DC converter  
Manufacturing a DC-DC converter on a chip includes: providing a die having a p-type top side and an n-type bottom side; removing an interior portion, creating a hole; flipping the interior...
8946705 Semiconductor device  
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed...
8937372 Integrated circuit package system with molded strip protrusion  
An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded...
8933553 Semiconductor unit  
A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first...
8928105 Method and apparatus for thin film module with dotted interconnects and vias  
A method to fabricate monolithically-integrated optoelectronic module apparatuses (100) comprising at least two series-interconnected optoelectronic components (104, 106, 108). The method includes...
8921993 Semiconductor package having EMI shielding function and heat dissipation function  
A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow...
8916968 Multichip power semiconductor device  
An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the...
8898894 Capacitor-circuit board interface for welding system components  
A welding system component includes a circuit board for the welding system component. An interface has a main riser portion with a fastener passageway formed therethrough. The interface has an...
8896039 Solid-state imaging device, method for manufacturing the same, and electronic apparatus  
A method for manufacturing a solid-state imaging device includes: forming pixels that receive incident light in a pixel array area of a substrate; forming pad electrodes in a peripheral area...
8896107 High power semiconductor package with conductive clip  
One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor, a sync transistor, a driver integrated circuit (IC) for...
8890335 Semiconductor device  
A semiconductor device includes: on an upper surface of a second semiconductor chip on a circuit board, a ring dam section formed at an outer circumference of a mounting region above which a first...
8884423 Image forming apparatus, chip, and chip package  
An image forming apparatus including an engine unit to perform an image forming operation, and a board unit to control the engine unit. The board unit includes at least one chip package that...
8884433 Circuitry component and method for forming the same  
A circuit structure includes a semiconductor substrate, first and second metallic posts over the semiconductor substrate, an insulating layer over the semiconductor substrate and covering the...
8876225 Actuator control unit and electric-mechanical brake unit  
The invention achieves a further downsizing of an actuator control unit. The actuator control unit has a control circuit controlling an actuator, and a bus bar electrically connected to the...
8878354 Method and apparatus for supplying power to a system on a chip (SOC)  
A semiconductor package including i) a first semiconductor die and ii) a second semiconductor die vertically stacked on top of the first semiconductor die. The first semiconductor die includes a...
8872327 Semiconductor device  
According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical...
8871630 Manufacturing electronic device having contact elements with a specified cross section  
An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the...
8866282 Semiconductor apparatus, signal transmission system and signal transmission method  
A slew rate of a signal transmitted between a semiconductor device having a small load capacitance and a semiconductor device having a large load capacitance is improved. When a signal is...
8860204 Semiconductor device and package with bit cells and power supply electrodes  
There is provided a semiconductor device including: plural bit cells each including the same circuit; plural electrodes supplied with power from outside, wherein each of the respective plural...
8860194 Buck converter power package  
One exemplary disclosed embodiment comprises a semiconductor package including a vertical conduction control transistor and a vertical conduction sync transistor. The vertical conduction control...
8847385 Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package  
A chip arrangement is provided, the chip arrangement including: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed...
8846452 Semiconductor device package and methods of packaging thereof  
In one embodiment of the present invention, a method of forming a semiconductor device includes forming a device region in a first region of a semiconductor substrate, and forming an opening in a...
8841774 Semiconductor device including a first wiring having a bending portion a via  
A first wiring (1) has a bending portion (2), a first wiring region (1a) extending from the bending portion (2) in the X direction, and a second wiring region (1b) extending from the bending...
8836131 Semiconductor module with edge termination and process for its fabrication  
A semiconductor module is disclosed, including a substrate and at least one semiconductor component in bottom contact with the substrate. The semiconductor component including a main current...
8836103 Semiconductor unit  
A semiconductor unit includes an insulation layer, a conductive layer bonded to one side of the insulation layer, a semiconductor device mounted on the conductive layer, a cooler thermally coupled...
8837150 Electronic device for switching currents and method for producing the same  
The present invention relates to an electronic device for switching currents and a method for producing such a device that is reliable and durable. Such an electronic device comprises a power...
8823156 Semiconductor device packages having stacking functionality and including interposer  
A semiconductor device package with an interposer, which serves as an intermediate or bridge circuit of various electrical pathways in the package to electrically connect any two or more...
8810022 Power and ground planes in package substrate  
A semiconductor package includes a plurality of electrical connectors, a semiconductor die having core logic, at least two pairs of core logic input-power and output-power pads, and a plurality of...
8810020 Semiconductor device with redistributed contacts  
A semiconductor device has external, exposed electrical contacts at an device active face and a semiconductor die, which has internal, electrical contacts at a die active face. The exposed...
8810045 Packaging substrate and semiconductor package  
A packaging substrate and a semiconductor package each include: a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality...
8810021 Semiconductor device including a recess formed above a semiconductor chip  
A semiconductor device, includes a substrate with a first surface, a semiconductor chip disposed over the first surface of the substrate, the semiconductor chip including a first region and a...
8803309 Preamplifier integrated circuit on flex circuit for magnetic media storing devices  
A preamplifier integrated circuit (IC) for a magnetic storage device comprises a plurality of channels, each including at least one preamplifier and a plurality of groups. Each of the groups...
8803275 Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle  
A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a...
8802496 Substrate for semiconductor package and method of manufacturing thereof  
Disclosed is a substrate for a semiconductor package in which leakage of radiation noise from a gap between a semiconductor element and a mounting substrate can be prevented. The substrate for the...