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7939907 Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device  
High density mounting and power source sharing are achieved by a digital semiconductor element and an analog semiconductor element provided in a common semiconductor device. A power layer for...
7936059 Lead frame packaging technique with reduced noise and cross-talk  
Broadly speaking, the present invention fills these needs by providing a lead frame package including a substrate stack having opposed sides, one of which includes a plurality of signal traces,...
7936060 Reworkable electronic device assembly and method  
An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal...
7936052 On-chip RF shields with backside redistribution lines  
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening...
7932591 Stacked semiconductor package having flexible circuit board therein  
The present invention relates to a stacked semiconductor package having flexible circuit board therein. The semiconductor package comprises a substrate and a chip assembly. The chip assembly...
7932570 Silicon tab edge mount for a wafer level package  
A Micro-ElectroMechanical Systems (MEMS) device having electrical connections (a metallization pattern) available at an edge of the MEMS die. The metallization pattern on the edge of the die...
7928555 Stack semiconductor package including an interposer chip having an imposed diode or capacitor  
A stacked semiconductor package may include a wiring substrate. A first semiconductor chip may be disposed on the wiring substrate and wire-bonded to the wiring substrate. An interposer chip may...
7928588 Circuit signal connection interface, a manufacture method thereof, and an electronic device using the same  
A circuit signal connection interface, a manufacturing method thereof, and an electronic device using the same are provided. The circuit signal connection interface includes a first signal line...
7915725 Silicon wafer for semiconductor with powersupply system on the backside of wafer  
Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has...
7911047 Semiconductor device and method of fabricating the semiconductor device  
A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed...
7902656 Hybrid integrated circuit device, and method for fabricating the same, and electronic device  
A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main...
7902662 Power core devices and methods of making thereof  
A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a...
7902654 System and method of silicon switched power delivery using a package  
In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and...
7902655 Multichip package leadframe including electrical bussing  
Embodiments of the present invention provide electrical bussing for multichip leadframes. In various embodiments, a leadframe may comprise a first die paddle for receiving a first microelectronic...
7898074 Electronic devices including flexible electrical circuits and related methods  
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit...
7893526 Semiconductor package apparatus  
A semiconductor package apparatus comprises: at least one semiconductor chip; and a circuit board on which the semiconductor chip is installed, wherein at least one conductive plane for improving...
7888788 Semiconductor device with reduced cross talk  
Mutual inductance from an external output signal system to an external input signal system, in which parallel input/output operation is enabled, is reduced. A semiconductor integrated circuit has...
7888808 System in package integrating a plurality of semiconductor chips  
A system in package integrating a plurality of semiconductor chips, including a first chip mounted commonly in a plurality of system in packages and at least including a CPU, a second chip having...
7884470 Semiconductor packages with stiffening support for power delivery  
Embodiments of the invention relate to semiconductor packages in which electrical power is delivered to die-side components removably installed in sockets formed between a package stiffener and an...
7884464 3D electronic packaging structure having a conductive support substrate  
The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the...
7880286 Tape wiring substrate and chip-on-film package using the same  
A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape...
7880284 Embedded power gating  
With embodiments disclosed herein, the distribution of gated power is done using on-die layers without having to come back out and use package layers.
7875963 Semiconductor device including leadframe having power bars and increased I/O  
In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available...
7872283 Semiconductor integrated circuit and multi-chip module  
In a semiconductor integrated circuit requiring a large number of pads, an internal circuit is arranged in the center portion, and a plurality of two kinds of I/O circuits for inputting and...
7872346 Power plane and land pad feature to prevent human metal electrostatic discharge damage  
An IC package includes an IC die mounted on a substrate that includes an ESD protection structure formed within the substrate to dissipate any charge accumulation associated with the package's...
7868409 Semiconductor integrated circuit with solder bump  
A semiconductor integrated circuit which is connected to a substrate by solder bumps wherein, when at least one solder bump is connected to a signal line of the semiconductor integrated circuit...
7864533 Semiconductor device  
A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output...
7863725 Power device packages and methods of fabricating the same  
Provided is a power device package including: a substrate including at least one first die attach region; at least one first power semiconductor chip and at least one second power semiconductor...
7863724 Circuit substrate having post-fed die side power supply connections  
A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the...
7859079 Power semiconductor device  
The present invention relates to a power semiconductor device comprising a switching power semiconductor element, and a free wheeling diode in anti-parallel connection to the switching power...
7855447 Semiconductor integrated circuit device, PDP driver, and plasma display panel  
In a semiconductor integrated circuit device of the present invention, temperature increase of a bonding wire can be suppressed even when conductive leads are short-circuited with each other, and...
7851900 Stacked semiconductor package  
In a stacked semiconductor package, since electric power is supplied to a second semiconductor package through a first semiconductor package, a power supply path becomes complicated and...
7847408 Integrated clock and power distribution  
An integrated clock and power distribution network in a semiconductor device includes assigning a first tile to a location on a placement grid corresponding to a top metal layer. An orientation is...
7843047 Encapsulant interposer system with integrated passive devices and manufacturing method therefor  
A method of manufacturing a semiconductor package system including: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a...
7838971 Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages  
An apparatus and a method for packaging semiconductor devices. Disclosed are multi-die packaging apparatuses and techniques, especially useful for integrated circuit dice involving insulative...
7838395 Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same  
A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension...
7829997 Interconnect for chip level power distribution  
A semiconductor device (601) is provided which comprises a substrate (603); a semiconductor device (605) disposed on said substrate and having a first major surface; a first metal strap (615)...
7829983 Semiconductor device  
There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can...
7829994 Semiconductor substrate elastomeric stack  
A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer...
7821118 Power distribution pattern for a ball grid array  
A reduced inductance power distribution pattern for an integrated circuit (IC) package is disclosed. The IC package can include a die in which the electronic circuitry is formed, a ball grid array...
RE41869 Semiconductor device  
In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5, and the drain terminal DT1 is formed on the rear surface of the chip 2, and the source...
7816779 Multimode signaling on decoupled input/output and power channels  
A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages...
7816757 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device
 
High density mounting and power source sharing are achieved by a digital semiconductor element and an analog semiconductor element provided in a common semiconductor device. A power layer for...
7816786 Semiconductor unit, and power conversion system and on-vehicle electrical system using the same  
A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is...
7812444 Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein  
A semiconductor IC-embedded module 100 comprises a multilayer substrate 101 having first and second insulating layers 101a and 101b, and a controller IC 012 and memory IC 103 that are embedded in...
7812431 Leadframe with die pad and leads corresponding thereto  
A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one...
7804167 Wire bond integrated circuit package for high speed I/O  
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the...
7799613 Integrated module for data processing system  
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a...
7800213 Power semiconductor circuit with busbar system  
A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power semiconductor circuit may be achieved...
7800214 Semiconductor device  
Mutual inductance from an external output signal system to an external input signal system, in which parallel input/output operation is enabled, is reduced. A semiconductor integrated circuit has...