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8174123 Semiconductor integrated circuit  
A semiconductor integrated circuit according to an exemplary embodiment of the present invention includes an I/O buffer provided in a semiconductor chip, single-layer pads, and multilayer pads....
8168450 Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package  
A semiconductor package includes a semiconductor chip having a circuit section. A first chip selection electrode passes through a first position of the semiconductor chip, and the first chip...
8169062 Integrated circuit package for semiconductior devices with improved electric resistance and inductance  
A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least...
8169069 Integrated semiconductor outline package  
A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of...
8169060 Integrated circuit package assembly including wave guide  
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal...
8164103 Multiple circuit power supply interface for light-emitting-diode color mixing  
The present invention discloses an light emitting diode (LED) light source and an interface for providing power to the LED. The LED light source includes an LED unit and a second coupling unit....
8159054 Semiconductor device  
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOSωFET for a high side switch and a power MOSωFET for a low side switch are connected in...
8159052 Apparatus and method for a chip assembly including a frequency extending device  
A chip assembly includes a chip, a paddle, an interface layer, a frequency extending device, and lands. The chip has contacts. The interface layer is disposed between the chip and the paddle. The...
8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions  
The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is...
8143714 Integrated circuit and method for producing the same  
An integrated circuit provides a carrier substrate, a wiring level above a carrier substrate, wherein the wiring level comprises a first conductor track composed of a first conductive material and...
8143107 Integrated circuit packaging system substrates and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a substrate including: patterning a bonding pad on the substrate, patterning a first signal trace coupled to the...
8138615 Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof  
A semiconductor integrated circuit relating to one aspect of the present invention includes a power transistor, at least one or more of first metal patterns functioning as a first electrode of the...
8129837 Flip chip interconnection pad layout  
A flip chip interconnect pad layout has the die signal pads are arranged on the die surface near the perimeter of the die, and the die power and ground pads arranged on the die surface inboard...
8129836 Semiconductor device  
A semiconductor device is composed of a pair of semiconductor chips (402, 404) arranged parallel on the same flat plane; a high voltage bus bar (21) bonded on the surface on the collector side of...
8129759 Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a...
8130513 Radio-frequency package  
A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal...
8129834 Integral metal structure with conductive post portions  
A plurality of FPGA dice is disposed upon a semiconductor substrate. In order to supply the immense power required by the plurality of FPGA dice, power is routed through the semiconductor...
8125070 Semiconductor component  
A semiconductor component has at least one semiconductor chip in which an electrical circuit is integrated. The semiconductor chip is surrounded by an electrically insulating encapsulating...
8125071 Package structure utilizing high and low side drivers on separate dice  
In the specification and drawing a package structure is described and shown with a first die including a high side driver and at least a first bonding pad, a second die including a low side...
8120154 Interconnection of lead frame to die utilizing flip chip process  
Embodiments in accordance with the present invention relate to techniques which avoid the problems of deformation in the shape of a solder connection in a flip chip package, resulting from solder...
8120164 Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof  
A semiconductor chip package and printed circuit board assembly including the same which have a variable mounting orientation include a semiconductor chip disposed on a first surface of an...
8120921 Device having electronic components mounted therein and method for manufacturing such device  
A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second...
8120162 Package with improved connection of a decoupling capacitor  
A package (216) for electrically connecting an integrated circuit (212) to a printed circuit board (214) includes a mount array (219) and a substrate body (216A). The mount array (219) is...
8116084 Method for manufacturing power module substrate, power module substrate, and power module  
A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal...
8115295 Semiconductor device  
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF...
8115112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates  
Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and...
8115325 Semiconductor integrated circuit including plurality of bonding pads  
A semiconductor integrated circuit includes a plurality of bonding pads formed along an edge of a semiconductor substrate; a plurality of I/O cells arranged along the edge under the plurality of...
8116102 Integrated circuit device and method of producing  
An electronic device which comprises a lead frame comprising at least one clip, a capacitor comprising at least one terminal, the at least one terminal being received in the at least one clip, and...
8111524 Electronic passive device  
A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second...
8110907 Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate  
A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first...
8106474 Semiconductor device  
A wiring electrically connected to a terminal to which a high power supply potential is applied and a wiring electrically connected to a terminal to which a low power supply potential is applied...
8106503 High frequency semiconductor device  
According to one embodiment, a high frequency semiconductor device is provided, which includes: a distribution/input matching circuit board that mounts thereon a distribution/input matching...
8106425 Interconnection substrate, semiconductor chip package including the same, and display system including the same  
Example embodiments relate to an interconnection substrate and a semiconductor chip package and a display system including the same. The interconnection substrate may include a base film, a signal...
8097942 Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor  
A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically...
8097943 Semiconductor device and method of forming wafer level ground plane and power ring  
A semiconductor die has active circuits formed on its active surface. Contact pads are formed on the active surface of the semiconductor die and coupled to the active circuits. A die extension...
8093075 Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit  
Provided are a semiconductor integrated circuit including a power supply, a semiconductor system including the semiconductor integrated circuit, and a method of forming the semiconductor...
8093707 Leadframe packages having enhanced ground-bond reliability  
Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on...
8084852 Hybrid integrated circuit device, and method for fabricating the same, and electronic device  
A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main...
8081486 Electronic module  
An electronic module has at least one first and one second connecting terminal and power semiconductors which are connected by way of connecting conductors, diodes which are each connected in...
8079528 Input/output pads placement for a smart card chip  
A chip for a smart card including a plurality of electrical contacts for communication of data with a smart card reader is disclosed. In one embodiment, a chip for a smart card includes a core...
8072058 Semiconductor package having a plurality input/output members  
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A...
8072062 Circuit device with at least partial packaging and method for forming  
A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the...
8072774 Substrate including wiring for transmitting signal, apparatus and system including the substrate  
An apparatus includes a substrate which includes an electronic component mounted on the substrate, the electronic component for processing a pair of signals, the substrate including a first wire...
8067822 Integrated circuit package for semiconductor devices with improved electric resistance and inductance  
A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area (101a) that is disposed over at least...
8067827 Stacked microelectronic device assemblies  
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first packaged microelectronic device...
8067826 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package  
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the...
8063480 Printed board and semiconductor integrated circuit  
An IC which includes a first circuit and a plurality of first paired terminals each including a first power supply terminal and a first GND terminal which are connected to the first circuit, and a...
8058554 Semiconductor power conversion apparatus and method of manufacturing the same  
A bus bar has a lead portion and a bus bar portion which are integrally shaped. The lead portion is provided in such a shape that branches from the bus bar portion. A part of the lead portion...
8058720 Semiconductor package  
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads in a first horizontal plane disposed along peripheral edges of the die pad; a ground...
8050054 Electronic device with a base plate  
A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece...