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6946731 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard  
This invention relates to a layout structure for providing stable power supply to a four-layer motherboard and a main bridge chip substrate. In the invention, on the top signal layer and power...
6943446 Via construction for structural support  
An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to...
6943436 EMI heatspreader/lid for integrated circuit packages  
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
6936911 Semiconductor integrated circuit device  
A semiconductor integrated circuit device has a semiconductor integrated circuit chip, a package enclosing the chip, and a plurality of conductors connecting the bonding pads of the chip to the...
6933600 Substrate for semiconductor package  
The invention provides a semiconductor package substrate, which includes a substrate, a chip contact area, an inner pad portion, an outer pad portion and a conductive layer. The chip contact area,...
6933599 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures  
A semiconductor device has a die (10) overlying and electrically connected to a support structure (11), such as a substrate or a lead frame, via a plurality of interconnects. Aggressor...
6933602 Semiconductor package having a thermally and electrically connected heatspreader  
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The substrate includes at least one...
6933593 Power module having a heat sink  
A power module that includes a molded shell having a lead frame molded in a mold body, and a plurality of power semiconductor devices disposed directly on the die pads of the lead frame.
6930378 Stacked semiconductor die assembly having at least one support  
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes...
6930377 Using adhesive materials as insulation coatings for leadless lead frame semiconductor packages  
A number of apparatus for packaging semiconductor devices using an epoxy ink or adhesive. In one embodiment, a pattern of epoxy is formed on the bottom surface of die attach pad of a leadless...
6924551 Through silicon via, folded flex microelectronic package  
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the...
6924661 Power switch circuit sizing technique  
An integrated circuit structure has at least one voltage island and a pattern of power switches within the voltage island. The pattern determines the number of (and evenly spaces) the power...
6921981 Ball grid array package  
A BGA package comprises a chip with an array pad design disposed on the top surface of a substrate. The chip has a plurality of bonding pads located about the periphery thereof. The bonding pads...
6921975 Circuit device with at least partial packaging, exposed active surface and a voltage reference plane  
A circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is...
6921980 Integrated semiconductor circuit including electronic component connected between different component connection portions  
An integrated semiconductor circuit includes a semiconductor chip on which surface a plurality of connection electrodes are formed, a lower insulating layer covering the surface of the...
6919635 High density microvia substrate with high wireability  
The density of plated thru holes in a glass fiber based chip carrier is increased by off-setting holes to positions in which fibers from adjacent holes will not connect. Elongated strip zones or...
6914326 Solder ball landpad design to improve laminate performance  
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force...
6914321 Semiconductor device  
It is an object to provide a semiconductor device having an improved heat dissipation characteristic. A power element is mounted on and jointed and to a metal block through a jointing material. An...
6911732 Integrated circuit  
An integrated circuit which is integrated in a housing having connecting pins fitted to the housing for connecting the housing to signal lines of an external circuit, each connecting pin connected...
6911725 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device  
Disclosed is a film substrate comprising an insulative sheet including a first region to be separated, having a slit on an outer peripheral line of the first region, and on which a semiconductor...
6909174 Reference plane of integrated circuit packages  
An apparatus including an integrated circuit including a plurality of devices and signal circuitry coupled to the plurality of devices, and a package substrate including a first surface coupled to...
6906404 Power module with voltage overshoot limiting  
A power module employs at least one capacitor electrically coupled across the input terminals to reduce voltage overshoot. The capacitor may be surface mounted to a high side collector plating...
6900986 Power module  
A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed...
6897555 Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die  
A BGA package having a multiplicity of power segments configured for power connection to integrated circuit die is disclosed. The BGA package substrate includes an integrated circuit die and a...
6897558 Power electronic component module and method for assembling same  
This electronic module comprises a metallic base (12) and electronic power components (D1, D2, D3, D4, D5, D6) on the base; in which each component, in a group consisting of some of the...
6891260 Integrated circuit package substrate with high density routing mechanism  
A semiconductor substrate having high density signal routing is provided. The semiconductor substrate may include first signal traces electrically connected to a first row of signal bonding pads...
6888235 Power delivery system for integrated circuits utilizing discrete capacitors  
Systems for power delivery to an integrated circuit include a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system delivers...
6888240 High performance, low cost microelectronic circuit package with interposer  
A low cost technique for packaging microelectronic circuit chips fixes a die within an opening in a package core. At least one metallic build up layer is then formed on the die/core assembly and a...
6888203 Power chip set for a switching mode power supply having a device for providing a drive signal to a control unit upon startup  
A power chip set for a switching mode power supply includes a high voltage chip and a control unit chip. The high voltage chip contains a switching power metal-oxide-semiconductor (MOS) transistor...
6884939 Constructing of an electronic assembly having a decoupling capacitor  
An electronic assembly is provided, having a capacitor interconnected between BGA solder balls. The capacitor is placed on a motherboard and soldered to the BGA solder balls when the BGA solder...
6885046 Semiconductor integrated circuit configured to supply sufficient internal current  
A semiconductor integrated circuit includes pads, a first power supply I/O cell which is connected to an external pin through a corresponding one of the pads, and a second power supply I/O cell...
6882035 Die package  
A packaged die having a die pad, leads, and a power ring is disclosed. The die includes an electrical circuit thereon and is attached to the die pad. The leads are arranged around the die pad with...
6876069 Ground plane for exposed package  
A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the...
6870276 Apparatus for supporting microelectronic substrates  
058804113 A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The...
6870257 Power delivery through a flex tape in decoupled I/O-power hybrid substrate  
A apparatus is disclosed for use as part of the packaging of an integrated circuit. The apparatus includes one or more flex tapes coupled to the integrated circuit. These flex tapes are utilized...
6870271 Integrated circuit assembly module that supports capacitive communication between semiconductor dies  
One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active...
6870253 Power semiconductor device  
Emitter electrodes (Es) and collector electrodes (Cs) of elements (101 to 104) are connected to bus electrodes (361 to 364) of a bus bar (351), respectively. The bus bar (351) contains seven...
6870252 Chip packaging and connection for reduced EMI  
A chip package for reduced EMI. In one embodiment, a chip package includes a semiconductor chip mounted on a substrate. First and second horizontal conductors may be present within the substrate....
6870275 Semiconductor device, image scanning unit including the semiconductor device, and image forming apparatus including the image scanning unit  
A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and...
6867488 Thick metal top layer  
An integrated circuit having signal traces, power traces, and ground traces. The signal traces are disposed on at least one signal distribution layer, and the signal traces on the at least one...
6861740 Flip-chip die and flip-chip package substrate  
A flip-chip die and a flip-chip package substrate. The flip-chip die has an active surface containing a plurality of core power/ground pads, at least one signal pad rings, at least one power pad...
6861739 Minimum metal consumption power distribution network on a bonded die  
A method for minimum metal consumption power distribution includes the steps of forming a circuit having a plurality of circuit components on an electrically insulated substrate and forming a...
6855967 Utilization of MACRO power routing area for buffer insertion  
A structure and a method for forming buffer cells in power line areas between macro cell in a macro block area. In a power line level, a pin is formed between VSS and VDD lines. The pin is...
6853063 Semiconductor device and communication terminal using thereof  
Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on...
6849956 Semiconductor integrated circuit with shortened pad pitch  
An semiconductor integrated circuit includes a plurality of first pads having first size, a plurality of second pads having second size smaller than the first size, a switch circuit which couples...
6847120 Flip chip semiconductor device having signal pads arranged outside of power supply pads  
A flip chip semiconductor device has a cell forming layer assigned to macro-cells and input and output cells and a pad forming layer assigned to power supply pads for the macro-cells and input and...
6847527 Interconnect module with reduced power distribution impedance  
An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby...
6847115 Packaged semiconductor device for radio frequency shielding  
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are...
6845017 Substrate-level DC bus design to reduce module inductance  
A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents,...
6844620 Power layout structure of main bridge chip substrate and motherboard  
The present invention is a placement that is utilized in a 4 layers motherboard and a main bridge chip substrate. The layout adds a placement of the power rings and the power paths on the top...