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7173327 Clock distribution networks and conductive lines in semiconductor integrated circuits  
A clock distribution network (110) is formed on a semiconductor interposer (320) which is a semiconductor integrated circuit. An input terminal (120) of the clock distribution network is formed on...
7167379 Micro-spring interconnect systems for low impedance high power applications  
An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality...
7161244 Microwave device for dissipating or attenuating power  
The present invention relates to a microwave device for at least one of dissipating and attenuating power, the device comprising: an insulating substrate;at least one conductive strip of a...
7161235 Semiconductor apparatus of a plurality of semiconductor devices enclosed in case and wiring method therefore  
A drain electrode wiring conductor through which a main current of a MOS transistor takes the form of a flat board, being inserted into a first side of the frame of a case, and extends along the...
7161237 Flip chip packaging using recessed interposer terminals  
A method and apparatus for packaging a semiconductor die with an interposer substrate. The semiconductor device assembly includes a conductively bumped semiconductor die and an interposer...
7154174 Power supply packaging system  
A packaging system for a high current, low voltage power supply. The power supply uses bare die power FETs which are directly mounted to a thermally conductive substrate by a solder attachment...
7151655 Electrostatic discharge (ESD) detector  
An electrostatic discharge (ESD) detector and a system having an ESD detector have been described herein.
7151986 Distributed driver system for locomotive or OHV  
A system for use with a locomotive or an off-highway vehicle (OHV) processor controlling an auxiliary device. A driver selectively energizes the auxiliary device. A driver switch for selectively...
7151309 Apparatus for improved power distribution in wirebond semiconductor packages  
A semiconductor package comprising a die adjacent a substrate, a supporting plate adjacent the die, and a conducting plate abutting the supporting plate and electrically coupled to a metal...
7148562 Power semiconductor device and power semiconductor module  
A plurality of power semiconductor chips (power transistors or the like) are arranged, being separated from each other with a free space of a terminal board interposed therebetween. A radiating...
7148554 Discrete electronic component arrangement including anchoring, thermally conductive pad  
An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically...
7145224 Semiconductor device  
In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5, and the drain terminal DT1 is formed on the rear surface of the chip 2, and the source...
7145225 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods  
An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second...
7145782 Reducing loadline impedance in a system  
In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second...
7135759 Individualized low parasitic power distribution lines deposited over active integrated circuits  
An integrated circuit (IC) chip, mounted on a leadframe, has a network of power distribution lines deposited on the surface of the chip so that these lines are located over active components of...
7132740 Semiconductor package with conductor impedance selected during assembly  
A semiconductor package having a plurality of conductors arrayed in two (or more) parallel planes, and an available ground conductor. Conductors in the auxiliary or second plane substantially...
7133287 ATCA integrated heatsink and core power distribution mechanism  
An integrated heatsink and core power distribution mechanism. First and second power rails are disposed on opposite sides of one of more integrated circuits on a printed circuit board (PCB). The...
7132752 Semiconductor chip and semiconductor device including lamination of semiconductor chips  
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side...
7132748 Semiconductor apparatus  
A semiconductor apparatus is provided in which input/output of an electric signal having a particularly high frequency is less disturbed by parasitic capacitance generated in a wiring in the...
7133294 Integrated circuit packages with sandwiched capacitors  
To provide high-speed, low inductance capacitive decoupling, an integrated circuit (IC) package includes capacitors positioned within the mounting region between a die and an IC package substrate....
7129571 Semiconductor chip package having decoupling capacitor and manufacturing method thereof  
A semiconductor chip package has a substrate that includes circuit lines provided on first and/or second surfaces, a power plane provided on the second surface, bump lands provided on the second...
7129588 Portable telephone  
A portable telephone including an integrated circuit chip module with a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power...
7129574 Multi-power ring chip scale package for system level integration  
A scalable multi-power integrated circuit package for integrated circuits having spaced apart first, second and third pluralities of respective spaced apart chip power bonding pads connected...
7126218 Embedded heat spreader ball grid array  
A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying...
7126230 Semiconductor electronic device and method of manufacturing thereof  
A semiconductor electronic device is described comprising a die of semiconductor material having a plurality of contact pads electrically connected to a support for example through interposition...
7122888 Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device  
A semiconductor device is arranged so as to include (i) a wire L1, connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB1...
7119448 Main power inductance based on bond wires for a switching power converter  
A method for providing main power inductance to a switching power supply using bond wires of an integrated circuit packaging. A predetermined number of bond wires are connected serially between...
7119420 Chip packaging structure adapted to reduce electromagnetic interference  
A chip packaging structure adapted to reduce EMI includes a chip having contacts provided on one side thereof, and a leadframe having a plurality of leads arranged in a predetermined manner and...
7119437 Electronic substrate, power module and motor driver  
An electronic substrate is used to mount a plurality of semiconductor chips thereon. The substrate includes a first conductive member, a second conductive member, and an insulating layer. The...
7120031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors  
To reduce switching noise, the power supply terminals of an integrated circuit die are coupled to the respective terminals of at least one embedded capacitor in a multilayer ceramic/organic hybrid...
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices  
A semiconductor device package is disclosed which is substantially die-sized with respect to each of the X, Y and Z axes. The package includes outer connectors that are located along at least one...
7098533 Printed circuit board with a heat dissipation element and package comprising the printed circuit board  
A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip...
7098527 Integrated circuit package electrical enhancement with improved lead frame design  
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the...
7098528 Embedded redistribution interposer for footprint compatible chip package conversion  
An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using...
7095117 Semiconductor device and an electronic device  
A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser....
7095107 Ball assignment schemes for integrated circuit packages  
The present disclosure is directed to ball assignment schemes for ball grid array packages in integrated circuits with increased signal count. The ball assignment scheme includes an array of...
7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation  
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
7087992 Multichip wafer level packages and computing systems incorporating same  
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die contained...
7084500 Semiconductor circuit with multiple contact sizes  
A semiconductor circuit comprising a semiconductor die and a package substrate. In one embodiment, a first plurality of conductive bumps serves as a portion of a conductive path between contacts...
7081667 Power LED package  
In a chip package (10, 10′, 110, 210), first and second electrical power buses (14, 14′, 16, 16′, 114, 116, 214, 216) are each formed of an electrical conductor having a chip bonding portion (20,...
7081660 Hermetic package with internal ground pads  
An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical...
7078824 Semiconductor device having a switch circuit  
A semiconductor device includes a semiconductor chip, a plurality of bonding pads which are formed on a main surface of the semiconductor chip and include first power source bonding pads, second...
7078788 Microelectronic substrates with integrated devices  
A microelectronic substrate including at least one microelectronic device disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within...
7075179 System for implementing a configurable integrated circuit  
The present invention provides a system for implementing a configurable integrated circuit (IC). Aspects of the invention include an IC die; a plurality of input/outputs (I/Os) coupled to the IC...
7071569 Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection  
An electrical package and manufacturing method thereof is provided. A high stiffness, high electrical conductivity, low coefficient of thermal expansion and high thermal conductivity support...
7067910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips  
One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of...
7067859 Multi-layer staggered power bus layout design  
A bus layout design is provided which includes a first electrically conductive layer with a first bus and a second bus and a second electrically conductive layer with a first bus and a second bus....
7064431 Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts  
An electronic assembly is described, having a substrate and contacts on the substrate which are spaced and arranged in a manner that allows for a more dense arrangement of contacts but still...
7061094 Multilayer printed circuit board including first and second signal traces and a first ground trace  
A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at...
7057275 Device with power semiconductor components for controlling the power of high currents and use of said device  
A device with power semiconductor components controlling the power of high currents has each power semiconductor component insulated and fixed to a common cooled carrier body. Conductor bars, in...