Match Document Document Title
7642551 Wafer-level package having test terminal  
A wafer-level package includes a semiconductor wafer having at least one semiconductor chip circuit forming region each including a semiconductor chip circuit each provided with test chip...
7642632 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same  
A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the...
7638871 Semiconductor device  
A semiconductor device, formed on a semiconductor substrate, including a first memory array formed in a first region and including first word lines, first bit lines across the first word lines,...
7632718 Semiconductor power component with a vertical current path through a semiconductor power chip  
A semiconductor power component using flat conductor technology includes a vertical current path through a semiconductor power chip. The semiconductor power chip includes at least one large-area...
7633147 Semiconductor unit having two device terminals for every one input/output signal  
A semiconductor unit constituting a memory device has a memory chip, a package substrate having three wiring layers. Power-supply surfaces (VDD surface) and (GND surface) are wired on the package...
7629680 Direct power delivery into an electronic package  
In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with...
7626256 Compact power semiconductor module having a connecting device  
A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device...
7626266 Semiconductor integrated circuit device having a plurality of functional circuits with low power consumption  
A semiconductor integrated circuit device includes a functional circuit block, a power supply for supplying power to the functional circuit block, a power supply interruption circuit disposed...
7615854 Semiconductor package that includes stacked semiconductor die  
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.
7612439 Semiconductor package having improved thermal performance  
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
7612457 Semiconductor device including a stress buffer  
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
7608922 Semiconductor device including amplifier and frequency converter  
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF...
7605462 Universal substrate for a semiconductor device having selectively activated fuses  
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The...
7605460 Method and apparatus for a power distribution system  
A method and apparatus is provided to reduce the spreading inductance and increase the distributed capacitance of power planes within the power distribution system of a semiconductor package...
7602056 On-die termination method for multi-chip packages  
An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die...
7602058 Flip-chip semiconductor device with improved power pad arrangement  
A semiconductor device is composed of a power supply interconnection extending from a certain starting point in a first direction and also extending from the starting point in a second direction...
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device  
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same  
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
7595561 Semiconductor device including multiple rows of peripheral circuit units  
In a semiconductor device including an internal circuit, multiple rows of peripheral circuit units are electrically connected to the internal circuit and arranged on at least one peripheral edge...
7592250 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device  
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a...
7589400 Inverter and vehicle drive unit using the same  
The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The...
7586186 Ball grid array  
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
7579683 Memory interface optimized for stacked configurations  
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so...
7576420 Semiconductor integrated circuit device having reduced terminals and I/O area  
In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the...
7573107 Power module  
A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.
7569923 Recyclying faulty multi-die packages  
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.
7569428 Method for manufacturing semiconductor device, semiconductor device and apparatus comprising same  
Disclosed is a method for manufacturing a method for manufacturing a semiconductor device which comprises a substrate, a semiconductor chip and a plurality of terminals. The method comprises...
7569916 Separable network interconnect systems and assemblies  
Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower...
7571415 Layout of power device  
A layout of a power device is provided. The layout includes a substrate, a unit array, a plurality of first, second, third and fourth signal paths, and a first, second, third and fourth port. The...
7566964 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures  
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect...
7560808 Chip scale power LDMOS device  
A semiconductor device includes at least one macro-cell device, the macro-cell device comprising a plurality of LDMOS devices. A first conductive layer is formed over the substrate, the first...
7557444 Power-via structure for integration in advanced logic/smart-power technologies  
A via structure is disclosed for use in a multi-layered semiconductor device, for forming electrical contacts between prescribed layers of the vertically aligned structures. The via structures...
7554198 Flexible joint methodology to attach a die on an organic substrate  
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
7554133 Pad current splitting  
An integrated circuit with a monolithic semiconducting substrate formed in a chip, where the chip has a peripheral edge, a backside, and an opposing top on which circuitry is formed. A first ring...
7554181 Semiconductor device with non-overlapping chip mounting sections  
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
7550855 Vertically spaced plural microsprings  
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
7547961 IC card with bonding wire connections of different lengths  
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit...
7547964 Device packages having a III-nitride based power semiconductor device  
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include...
7528467 IC substrate with over voltage protection function  
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
7525183 Surface mount multichip devices  
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead...
7521781 Integrated circuit package system with mold clamp line critical area having widened conductive traces  
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
7514778 Power semiconductor device  
A power semiconductor device is disclosed. In one embodiment, the power semiconductor device includes a plurality of device components that are contact-connected by bonding wires having different...
7514794 Semiconductor integrated circuit and the method of designing the layout  
The semiconductor integrated circuit of the present invention comprises: a standard cell group including a power supply wiring group or a ground wiring group, which is arranged at an interval...
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips  
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side...
7514774 Stacked multi-chip package with EMI shielding  
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each...
7511370 Power gridding scheme  
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically...
7508061 Three-dimensional semiconductor module having multi-sided ground block  
The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block....
7504670 Sealing structure for mounting a semiconductor device to a substrate  
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on...
7504721 Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips  
Apparatus and methods are provided for integrally packaging antenna devices with semiconductor IC (integrated circuit) chips, wherein IC chips are packaged with dielectric resonators antennas that...
7501709 BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance  
A Ball Grid Array (BGA) integrated circuit package having (i) an additional dedicated ground ring on the package substrate which provides a reduced area return current loop path to reduce wire...