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9041181 Land grid array package capable of decreasing a height difference between a land and a solder resist  
A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a...
9041205 Reliable microstrip routing for electronics components  
A semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package...
9041182 Semiconductor package and method of manufacturing the same  
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side...
9041160 Semiconductor integrated circuit device  
A semiconductor integrated circuit device includes: a rectangular shaped semiconductor substrate; a metal wiring layer formed on or over the semiconductor substrate; and a passivation layer...
9035445 Seal ring structure with a metal pad  
A method includes providing a substrate having a seal ring region and a circuit region, forming a seal ring structure over the seal ring region, forming a first frontside passivation layer above...
9035448 Semiconductor packages having metal composite base plates  
Semiconductor packages are provided that have a base plate with a matrix of pure silver or a silver alloy and reinforcement particles. The reinforcement particles can include high thermal...
9035472 Semiconductor device  
In a semiconductor device, a conductor pattern is disposed in a position overlapped by a semiconductor chip in a thickness direction over the mounting surface (lower surface) of a wiring board. A...
9029198 Methods of manufacturing semiconductor devices including terminals with internal routing interconnections  
A method of fabricating a semiconductor package includes forming a plurality of terminals on a sheet carrier, molding the sheet carrier with a first molding compound, creating electrical paths for...
9029903 Light emitting diode package and method of manufacturing the same  
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips,...
9027238 Multilayered printed circuit board and method for manufacturing the same  
A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a...
9024420 Power quad flat no-lead (PQFN) package  
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One...
9024419 Method of manufacturing semiconductor device  
A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having...
9018537 Surface-mountable electronic device  
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion....
9013014 Chip package and a method of manufacturing the same  
In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip.
9012787 Electronic system for wave soldering  
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for...
9000581 Semiconductor package  
A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the...
9000579 Integrated circuit package system with bonding in via  
An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit...
8999759 Method for fabricating packaging structure having embedded semiconductor element  
A method for fabricating a packaging structure having an embedded semiconductor element includes: providing a substrate having opposite first and second surfaces and at least an opening...
9000571 Surface-mounting light emitting diode device and method for manufacturing the same  
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8994168 Semiconductor package including radiation plate  
A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including...
8987009 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product  
A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or...
8987877 Semiconductor device  
A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first...
8987769 High thermal performance packaging for optoelectronics devices  
A novel submount for the efficient dissipation of heat away from a semiconductor light emitting device is described, which also maintains efficient electrical conductivity to the n and p contacts...
8981548 Integrated circuit package system with relief  
An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a...
8981540 Electronic device and package structure thereof  
A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an...
8981550 Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same  
A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly...
8981549 Multi chip package  
The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the...
8981547 Stub minimization for multi-die wirebond assemblies with parallel windows  
A microelectronic assembly 5 can include first and second microelectronic packages 10a, 10b mounted to respective first and second opposed surfaces 61, 62 of a circuit panel 60. Each...
8981539 Packaged power semiconductor with interconnection of dies and metal clips on lead frame  
A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the...
8981537 Reversible top/bottom MEMS package  
A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the...
8981557 Method for forming photovoltaic cell, and resulting photovoltaic cell  
A photovoltaic cell manufacturing method is disclosed. Methods include manufacturing a photovoltaic cell having a selective emitter and buried contact (electrode) structure utilizing nanoimprint...
8975738 Structure for microelectronic packaging with terminals on dielectric mass  
A structure may include a spacer element overlying a first portion of a first surface of a substrate; first terminals at a second surface of the substrate opposite the first surface; and second...
8975694 Low resistance power switching device  
A semiconductor device includes a semiconductor substrate with doped regions of a first type and doped regions of a second type. A first metallization layer connects to the doped regions of the...
8975118 Component having a via and method for manufacturing it  
An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a...
8970019 Semiconductor device with sealed semiconductor chip  
A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame...
8970026 Methods and structures for reducing stress on die assembly  
A first set of electrically conductive cladding is disposed on an inner section of one external side of a package substrate. The first set electrically conductive cladding is fabricated with a...
8969980 Vented MEMS apparatus and method of manufacture  
A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external...
8963338 III-nitride transistor stacked with diode in a package  
One exemplary disclosed embodiment comprises a two-terminal stacked-die package including a diode, such as a silicon diode, stacked atop a III-nitride transistor, such that a cathode of the diode...
8963315 Semiconductor device with surface electrodes  
A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a...
8963150 Semiconductor device having a test pad connected to an exposed pad  
A semiconductor device includes a circuit board including a ground portion, and a semiconductor package disposed on the circuit board. The semiconductor package includes an external connecting pad...
8957507 Technology of reducing radiation noise of semiconductor device  
A first lead frame group is constituted by a plurality of lead frames that are connected to the first circuit, terminals of the plurality of lead frames being provided on a first side of the...
8956918 Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier  
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier;...
8955219 Method for fabricating a bond  
The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at...
8957516 Low cost and high performance flip chip package  
A low cost and high performance flip chip package is disclosed. By assembling the package using a substrate panel level process, a separate fabrication of a substrate is avoided, thus enabling the...
8951814 Method of fabricating a flip chip semiconductor die with internal signal access  
A device and method for providing access to a signal of a flip chip semiconductor die. A hole is bored into a semiconductor die to a test probe point. The hole is backfilled with a conductive...
8952518 Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same  
A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the...
8946873 Redistribution structures for microfeature workpieces  
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry...
8946882 Semiconductor module and semiconductor device  
A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate,...
8946890 Power/ground layout for chips  
Embodiments of the present disclosure provide a chip that comprises a base metal layer formed over a first semiconductor die and a first metal layer formed over the base metal layer. The first...