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7632718 |
Semiconductor power component with a vertical current path through a semiconductor power chip
A semiconductor power component using flat conductor technology includes a vertical current path through a semiconductor power chip. The semiconductor power chip includes at least one large-area...
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7633148 |
Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
A plurality of conductive pads ( 2 ) are formed on a mounting surface of a mounting board. Conductive pads ( 11 ) are formed on a principal surface of a semiconductor chip ( 10 ) at positions...
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7629695 |
Stacked electronic component and manufacturing method thereof
A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer...
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7626256 |
Compact power semiconductor module having a connecting device
A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device...
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7626255 |
Device, system and electric element
Provided is a device, an assembly comprising said device, a sub-assembly and an element suitable for use in the assembly. The device comprises a body of an electrically insulating material having a...
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7622811 |
Semiconductor assembly with component attached on die back side
One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be...
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7622801 |
Thin planar semiconductor device
A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically...
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7619306 |
Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
A semiconductor device includes a semiconductor substrate, and a plurality of wiring lines provided on one side of the semiconductor substrate, each of the wiring lines having a connection pad...
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7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or...
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7615406 |
Electronic device package manufacturing method and electronic device package
By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space...
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7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a...
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7612436 |
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support...
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7612457 |
Semiconductor device including a stress buffer
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
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7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
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7598621 |
Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths
A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7598609 |
Structure of polymer-matrix conductive film and method for fabricating the same
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7595257 |
Process of forming an electronic device including a barrier layer
An electronic device can include a substrate ( 12 ) having a primary surface ( 14 ), a second surface ( 16, 22 ) opposite the primary surface ( 14 ), and an electrode ( 50 ). In one embodiment, the...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7595220 |
Image sensor package and fabrication method thereof
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
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7595547 |
Semiconductor die package including cup-shaped leadframe
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the...
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7592699 |
Hidden plating traces
A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger...
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7592694 |
Chip package and method of manufacturing the same
A chip package including a metal layer, a film-like circuit layer, a chip, a lead matrix and an encapsulant is provided. The film-like circuit layer disposed on the metal layer includes an...
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7589388 |
Semiconductor device and method of manufacturing the same
The invention is directed to providing a package type semiconductor device with high reliability and smaller size and a method of manufacturing the same. A semiconductor substrate formed with a...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7586186 |
Ball grid array
A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the...
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7582919 |
Functional coating of the SCFM preform
The invention relates to a power semiconductor module having at least one semiconductor chip ( 11 ) made of a semiconductor material and having a first and a second main electrode ( 12, 13 ), a...
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7579682 |
Power semiconductor module
A power semiconductor module has a ceramic substrate ( 9 ) which has on at least one side a patterned metallization ( 50 ) with a fineness of pattern of smaller than or equal to 800 μm, a first...
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7579683 |
Memory interface optimized for stacked configurations
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that...
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7569923 |
Recyclying faulty multi-die packages
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.
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7566977 |
Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device, includes: mounting a semiconductor chip having an electrode on a wiring substrate having a base substrate and a wiring formed on the base...
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7566968 |
Biosensor with smart card configuration
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring...
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7560810 |
Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the...
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7557442 |
Power semiconductor arrangement
A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is...
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7554187 |
Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
A connecting structure between a circuit and another electronic component, includes a first electrode and a second electrode, and a dielectric material interposed between the first and second...
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7554136 |
Micro-switch device and method for manufacturing the same
A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation. The micro device includes a circuit board, an electrode pad being provided...
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7550855 |
Vertically spaced plural microsprings
A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited,...
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7545032 |
Integrated circuit package system with stiffener
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle;...
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7538414 |
Semiconductor integrated circuit device
Disclosed is a semiconductor IC device capable of suppressing the interference of noise generated in one functional block with other functional blocks therein while protecting against electrostatic...
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7535741 |
Semiconductor device
The object of the present invention is to reduce parasitic inductance of a main circuit in a power supply circuit. The present invention provides a non-insulated DC-DC converter having a circuit in...
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7531894 |
Method of electrically connecting a microelectronic component
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a...
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7531443 |
Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
A method for fabricating semiconductor components includes the step of providing a semiconductor substrate having a circuit side, a back side, a plurality of integrated circuits on the circuit...
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7528477 |
Castellation wafer level packaging of integrated circuit chips
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and,...
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7526861 |
Method for fabricating structure of polymer-matrix conductive film
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel...
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7528495 |
Chip structure
A chip structure including a substrate, at least one chip bonding pad, a passivation layer, at least one compliant bump, and at least one redistribution conductive trace is provided. The substrate...
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7525183 |
Surface mount multichip devices
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead...
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7525181 |
Tape wiring substrate and tape package using the same
A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween....
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7525174 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
High performance system-on-chip using post passivation process
The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a...
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7524754 |
Interconnect shunt used for current distribution and reliability redundancy
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution...
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