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Match Document Document Title
7432602 Semiconductor device  
A semiconductor device includes: a semiconductor chip connected onto a surface of a printed wiring board in a flip-chip connection; a dam for preventing an outflow of underfill, the dam being...
7432589 Semiconductor device  
The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area. The semiconductor device of the present invention...
7432588 Semiconductor device and method of fabricating the same  
A semiconductor device 100 comprises a leadframe 104 having an island portion 102 ; two chips of a first semiconductor chip 110 and a second semiconductor chip 120 , respectively having top...
7432585 Semiconductor device electronic component, circuit board, and electronic device  
A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the...
7432533 Encapsulation of electronic devices with shaped spacers  
An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby...
7425758 Metal core foldover package structures  
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
7425757 Semiconductor power module  
A semiconductor power module includes a filter element made of a magnetic material that can be exchanged as required, while providing a package having a compact size. The power module can be used...
7423340 Semiconductor package free of substrate and fabrication method thereof  
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of...
7420282 Connection structure for connecting semiconductor element and wiring board, and semiconductor device  
In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part...
7417317 Post passivation interconnection schemes on top of the IC chips  
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on...
7417198 Radiofrequency power semiconductor module with cavity housing, and method for producing it  
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame...
7414306 Preamplifier integrated circuit on flex circuit for magnetic media storing devices  
A preamplifier integrated circuit (IC) for a magnetic storage device includes a plurality of channels, each including at least one preamplifier and one or more interconnecting layers. A passivation...
7411179 Photodetector module with impedance matching  
A photodetector module that can achieve impedance matching and power saving. A photodetector ( 11 ) and an amplifier ( 12 ) for amplifying an electric signal from the photodetector ( 11 ) are...
7408251 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7408243 High temperature package flip-chip bonding to ceramic  
A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is...
7402911 Multi-chip device and method for producing a multi-chip device  
The present invention relates to a multi-chip device comprising a substrate having a first surface on which a number of first contact elements is provided, a plurality of integrated circuit chips...
7400512 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor  
A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing...
7394164 Semiconductor device having bumps in a same row for staggered probing  
A semiconductor device has a plurality of bumps in a same row for staggered probing. The bumps in a same row are disposed on a chip and include a plurality of regular bumps and a plurality of...
7394152 Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same  
The present invention provide a wafer level chip size packaged chip device with a N-shape junction at which external leads electrically connect to peripheral arrayed compatible pads and a method of...
7394151 Semiconductor package with plated connection  
A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting...
7394150 Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys  
A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on...
7394146 MOSFET package  
A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic...
7391107 Signal routing on redistribution layer  
A semiconductor wafer has a dielectric layer, a metal last layer, a passivation layer, and a redistribution layer. The metal last layer is formed over the dielectric layer, and the metal last layer...
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions  
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided...
7387827 Interconnection designs and materials having improved strength and fatigue life  
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a...
7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts  
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit...
7382052 Post passivation interconnection schemes on top of IC chip  
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on...
7382044 Semiconductor device package diepad having features formed by electroplating  
Embodiments in accordance with the present invention relate to the fabrication of packages for semiconductor devices, and in particular to the use of electroplating techniques to form features on...
7375424 Wirebonded device packages for semiconductor devices having elongated electrodes  
A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel...
7372161 Post passivation interconnection schemes on top of the IC chips  
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on...
7372139 Semiconductor chip package  
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for...
7368825 Power semiconductor device  
The present invention is directed to a power semiconductor device in which a control circuit controls a power switching element, comprising: a semiconductor substrate having a front surface and a...
7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof  
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an...
7368809 Pillar grid array package  
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an...
7368803 System and method for protecting microelectromechanical systems array using back-plate with non-flat portion  
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on...
7364941 Circuit device manufacturing method  
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto...
7361997 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths  
A device package, such as a BGA, to be mounted on a printed wiring board (PWB) is disclosed. The bottom electrodes of the device package are arranged in an array such that intervals between the...
7361983 Semiconductor device and semiconductor assembly module with a gap-controlling lead structure  
In a semiconductor device ( 1 ), semiconductor elements ( 2 ) and ( 3 ) are mounted on a lead frame ( 5 ) having leads ( 4 ). The semiconductor elements ( 2 ) and ( 3 ) are connected with the leads...
7361935 Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head  
A semiconductor device includes a substrate, conductive layer, semiconductor thin films, and individual electrodes. The conductive layer is formed on the substrate and serves as a common electrode....
7361880 Digital camera module for detachably mounting with flex printed circuit board  
A digital camera module ( 100 ) includes a holder, an image sensor chip package ( 30 ), a number of conductive elements ( 24 ) and a circuit board ( 40 ). The holder defines a receiving portion....
7352054 Semiconductor device having conducting portion of upper and lower conductive layers  
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a...
7348666 Chip-to-chip trench circuit structure  
A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the...
7348661 Array capacitor apparatuses to filter input/output signal  
An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package...
7345362 Electronic component and method for manufacturing the same  
An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall...
7342318 Semiconductor package free of substrate and fabrication method thereof  
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of...
7342262 Split-gate power module for suppressing oscillation therein  
The invention involves a method of packaging and interconnecting four power transistor dies to operate at a first frequency without oscillation at a second frequency higher than the first frequency...
7339265 Capacitance type semiconductor sensor  
In a capacitance type semiconductor dynamic quantity sensor, a sensor chip and a circuit are connected to each other through adhesive film having an elasticity of 200 MPa or less to reduce the...
7335977 Semiconductor chip mounting arrangement  
Disclosed is a device which comprises a substrate, a plurality of signal output terminal electrodes provided on the substrate, a plurality of signal input terminal electrodes provided on the...
7335976 Crosstalk reduction in electrical interconnects using differential signaling  
An electrical device includes a plurality of interconnects passing through a plane. The interconnects have a longitudinal axis substantially perpendicular to the plane and including an arrangement...
7335951 Semiconductor device and method for manufacturing the same  
The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be...
Matches 1 - 50 out of 1095 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >