Matches 1 - 50 out of 171 1 2 3 4 >
Match Document Document Title
7573130 Crack trapping and arrest in thin film structures  
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure...
7528476 Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument  
A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the...
7504670 Sealing structure for mounting a semiconductor device to a substrate  
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
7498669 Semiconductor device  
A rectify element as a semiconductor device has a disk section, a first solder part, a buffer plate, a second solder part, a semiconductor chip, and a lead, and a sealing member with which the...
7397066 Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers  
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a...
7390973 Memory module and signal line arrangement method thereof  
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
7368819 Multilayer printed wiring board and multilayer printed circuit board  
In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands...
7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer  
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
7335970 Semiconductor device having a chip-size package  
Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a...
7327022 Assembly, contact and coupling interconnection for optoelectronics  
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active...
7327023 Semiconductor component with plastic housing, and process for producing the same  
A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged...
7312400 Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method  
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111 ); a conductive layer 112 formed on one surface of said insulating...
7268417 Card-type circuit device  
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode...
7242085 Semiconductor device including a semiconductor chip mounted on a metal base  
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip ( 1 ) mounted...
7208840 Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module  
First alignment marks are provided on a film substrate in a manner that they are located at positions offset from the disposed positions of second alignment marks provided on a semiconductor chip....
7193328 Semiconductor device  
Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and...
7173325 Expansion constrained die stack  
Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection...
7170152 Wafer level semiconductor package with build-up layer and method for fabricating the same  
A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material...
7109575 Low-cost flexible film package module and method of manufacturing the same  
Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package...
7061090 Semiconductor device  
A semiconductor device comprises a semi-conductor chip bonded on a top surface inside a case electrode by a bonding material and a lead electrode bonded on a top surface of the semiconductor chip...
7053479 Package of semiconductor device and its manufacturing method  
A packaged semiconductor device structure comprises a semiconductor chip ( 20 ) having a bump electrode ( 5 ), a facing substrate ( 9 ) having on one face thereof a facing electrode ( 8 )...
7030476 Rectifier diode device  
Disclosed is a rectifier diode device. The rectifier diode device includes a conductive base, a semiconductor chip, a conductive lead and insulation resin. A trench and a post are formed in the...
7009223 Rectification chip terminal structure  
A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for...
6977441 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument  
An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second...
6943436 EMI heatspreader/lid for integrated circuit packages  
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
6936913 High performance vias for vertical IC packaging  
A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package...
6882040 Semiconductor device  
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device ( 10 ) of one embodiment can include a semiconductor chip ( 1 )...
6858922 Back-to-back connected power semiconductor device package  
A small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment with one another. A...
6822318 Stress isolating die attach structure and method  
A method and structure for isolating a die from thermally induced or pressure induced differential stresses between a die and a package includes providing an intermediate layer having therein a...
6753596 Resin-sealed semiconductor device  
A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface...
6710435 Semiconductor device arrangement and method of fabricating the same  
A semiconductor device arrangement includes a plurality of three-dimensional semiconductor units. Each of the three-dimensional semiconductor units includes a semiconductor chip in a shape of a...
6707144 Insulated high speed semiconductor switching device  
A semiconductor device has a semiconductor element housed in a ceramic cylinder as an insulated vessel, and plural gate terminals. Plural through-holes are formed in the ceramic cylinder. Leads...
6653168 LSI package and internal connecting method used therefor  
The present invention is provides an LSI package without employing steps for forming solder bumps on a bare chip and soldering to an interposer. In the present invention, a bare chip is mounted on...
6492718 Stacked semiconductor device and semiconductor system  
A stacked semiconductor device includes a plurality of stacked wiring substrates each having connection electrodes and wires connected to the connection electrodes and each mounted with a...
6479901 Semiconductor device having interconnected external electrode pads and wire bonding pads  
A semiconductor device according to the invention of the present application includes a plurality of external electrode pads which are placed over the back of a substrate having a semiconductor...
6472305 Method of manufacturing bonded structure of film substrate and semiconductor chip  
The bonding conditions for bonding a semiconductor chip to a film substrate are controlled to allow an adhesive positioned right under the junction between the first connection terminal of the film...
6469382 Semiconductor device substrate and method of manufacturing semiconductor device  
A semiconductor device substrate and a method of manufacturing the same by removing variations in resin thickness due to resin flows, warps in the substrate, cracking in the substrate, and foams...
6452261 Flat semiconductor device and power converter employing the same  
Control electrode wirings which are led out from control electrodes over a number of chips built in a flat package and insulating members which are provided in order to insulate the control...
6380622 Electric apparatus having a contact intermediary member and method for manufacturing the same  
A pressed-contact type semiconductor device in which a main electrode surface of a semiconductor element is contacted with an electrode plate by a pressed-contact, which can reduce both an electric...
6331730 Push-in type semiconductor device including heat spreader  
A push-in type semiconductor chip has a semiconductor device, a support electrode body bonded to one of the end portions of the semiconductor chip and supported by, and fixed to, a heat spreader at...
6323547 Pressure contact type semiconductor device with ringshaped gate terminal  
In a GCT device which controls large current at the operating frequency of 1 kHz or more, a ring-shaped gate terminal (10) is made of a magnetic material with the maximum permeability of 15,000 or...
6307260 Microelectronic assembly fabrication with terminal formation from a conductive layer  
A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends...
6303987 Compression bonded type semiconductor device  
A compression bonded type semiconductor device including a semiconductor substrate having a top surface and a bottom surface a gate electrode and a cathode electrode formed on the top surface of...
6255721 Method and tool for handling micro-mechanical structures  
A method of forming and handling an array of micro-devices such as thin film devices that enables simultaneous mass handling and processing of these thin film devices. A plurality of micro-devices...
6239367 Multi-chip chip scale package  
A multi-chip chip scale package. The package has a film carrier whereby two chips with different sizes can be disposed on the same film carrier. A flip chip technique is used to arrange each chip...
6177701 Semiconductor device with resistor and fabrication method therof  
A semiconductor device capable of the area reduction of a resistor. A semiconductor substrate having a first conductive region is prepared. A dielectric layer is formed to cover the first...
6160309 Press-fit semiconductor package  
A press-fit package, such as a press-fit rectifier, includes an improved cup design which incorporates a mold lock formed within the inner wall of the cavity. a well is provided between the inner...
6127729 Semiconductor chip with corner electrode terminals and detecting wiring for defect inspection  
A method of inspecting a chip with projecting electrodes or bumps, part of which are lacking, includes arranging electrode terminals for detecting projecting electrodes along four corners of a...
6100533 Three-axis asymmetric radiation detector system  
A three-axis radiation detection system whose inner and outer electrodes are shaped and positioned so that the shortest path between any point on the inner electrode and the outer electrode is a...
6081039 Pressure assembled motor cube  
A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where the...
Matches 1 - 50 out of 171 1 2 3 4 >