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8168985 |
Semiconductor module including a switch and non-central diode
A semiconductor module having one or more silicon carbide diode elements mounted on a switching element is provided in which the temperature rise is reduced by properly disposing each of the diode...
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8159072 |
Rectification chip terminal structure
The present invention includes a base, a rectification chip, a conductive element and a coupling collar. The base has an installation pedestal to hold the rectification chip. The conductive element...
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8154124 |
Semiconductor device having a chip-size package
A semiconductor chip has a main surface, a back surface and a plurality of side surfaces. A plurality of electrodes is provided on the main surface of the semiconductor chip so as to be arranged in...
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8143645 |
Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors
Each of first base regions of sequentially layered first IGBT and second IGBT has a peripheral section in the vicinity of the side face of the semiconductor substrate. Each of the IGBTs includes a...
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8129277 |
Method of machining wafer
A method of machining a wafer in which, at the time of grinding the back-side surface of the wafer, only a back-side surface region corresponding to a device formation region where semiconductor...
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8124453 |
Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates
An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and...
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8125069 |
Semiconductor device and etching apparatus
A method for manufacturing a semiconductor device comprises dry-etching a thin film using a resist mask carrying patterns in which at least one of the width of each pattern and the space between...
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8115266 |
MEMS device having a movable electrode
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an...
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8106501 |
Semiconductor die package including low stress configuration
A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first molding material covering at least a...
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8093706 |
Mounting structure of semiconductor device and electronic apparatus using same
A mounting structure includes: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is...
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8030749 |
Semiconductor device
A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At...
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7977699 |
Light emitting device package and manufacture method of light emitting device package
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting...
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7931206 |
Wireless IC device
A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit...
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7919835 |
Semiconductor device and method for manufacturing the same
The present invention provides a semiconductor device having a low-k film including an interconnect layer and a highly-reliable through-substrate contact plug. The semiconductor device includes: a...
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7893528 |
Package structure of compound semiconductor device and fabricating method thereof
A package structure of a compound semiconductor device comprises a thin film substrate, a die, at least one metal wire and a transparent encapsulation material. The thin film substrate comprises a...
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7859088 |
Semiconductor device manufacturing method, wafer, and wafer manufacturing method
A semiconductor device manufacturing method capable of making in-plane temperature distribution on a wafer uniform at heat treatment time. Before heat treatment is performed by irradiating the...
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7847384 |
Semiconductor package and manufacturing method thereof
A semiconductor package 100 is constructed of a semiconductor chip 110, a sealing resin 106 for sealing this semiconductor chip 110, and wiring 105 formed inside the sealing resin 106. And, the...
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7829989 |
Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and...
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7825468 |
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding...
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7816745 |
Wafer level hermetically sealed MEMS device
A hermetically sealed microelectromechanical system (MEMS) package includes a MEMS switch having a movable portion and a stationary portion with an electrical contact thereon. A glass lid is...
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7786565 |
Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor
A semiconductor apparatus includes a semiconductor chip 61 including a power semiconductor device using a wide band gap semiconductor, base materials 62 and 63, first and second intermediate...
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7759784 |
3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules
A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery...
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7709951 |
Thermal pillow
Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed...
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7705442 |
Contact device for use in a power semiconductor module or in a disc-type thyristor
A contact device for use with a power semiconductor component in a power semiconductor module or a disc-type thyristor, the module or thyristor having a molded body with a first recess disposed...
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7692299 |
Semiconductor apparatus having improved thermal fatigue life
A semiconductor apparatus having improved thermal fatigue life is provided by lowering maximum temperature on jointing members and reducing temperature change. A jointing member is placed between a...
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7682879 |
Edge coating a microelectronic device
A microelectronic device includes a die having an active surface and a non-active surface. To assemble the microelectronic device, the active surface of the die is placed on a substrate. A first...
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7573130 |
Crack trapping and arrest in thin film structures
The present invention relates to a process for preparing a robust crack-absorbing integrated circuit chip comprising a crack trapping structure containing two metal plates and a via-bar structure...
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7528476 |
Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
A semiconductor device includes: a semiconductor substrate having an active surface and a back surface; an integrated circuit formed on the active surface; a feedthrough electrode penetrating the...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7397066 |
Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a...
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7390973 |
Memory module and signal line arrangement method thereof
The pesent invention discloses a memory module and a signal line arrangement method thereof. The memory module includes memory chips mounted on both sidees in a mirror form; and a printed circuit...
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7368819 |
Multilayer printed wiring board and multilayer printed circuit board
In a multilayer printed wiring board having a plurality of laminated resin layers, a plurality of wiring patterns formed on the interfacial surface of the resin layers, and a plurality of lands...
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7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
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7335970 |
Semiconductor device having a chip-size package
Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a...
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7327023 |
Semiconductor component with plastic housing, and process for producing the same
A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged...
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7327022 |
Assembly, contact and coupling interconnection for optoelectronics
A novel micro optical system as a platform technology for electrical and optical interconnections, thermal and mechanical assembly and integration of electronic, optoelectronic, passive and active...
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7312400 |
Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer 111); a conductive layer 112 formed on one surface of said insulating substrate...
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7268417 |
Card-type circuit device
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode...
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7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted...
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7208840 |
Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
First alignment marks are provided on a film substrate in a manner that they are located at positions offset from the disposed positions of second alignment marks provided on a semiconductor chip....
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7193328 |
Semiconductor device
Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and...
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7173325 |
Expansion constrained die stack
Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection...
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7170152 |
Wafer level semiconductor package with build-up layer and method for fabricating the same
A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material...
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7109575 |
Low-cost flexible film package module and method of manufacturing the same
Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package...
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7053479 |
Package of semiconductor device and its manufacturing method
A packaged semiconductor device structure comprises a semiconductor chip (20) having a bump electrode (5), a facing substrate (9) having on one face thereof a facing electrode (8) contacting an end...
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7030476 |
Rectifier diode device
Disclosed is a rectifier diode device. The rectifier diode device includes a conductive base, a semiconductor chip, a conductive lead and insulation resin. A trench and a post are formed in the...
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6977441 |
Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument
An interconnect substrate including a first substrate on which a first interconnect pattern is formed, having a mounting region for an electronic chip; and a second substrate on which a second...
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6943436 |
EMI heatspreader/lid for integrated circuit packages
An integrated circuit package includes a lid with EMI containment features. The lid may include a plurality of projections adapted to couple a ground plane of a circuit board.
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6936913 |
High performance vias for vertical IC packaging
A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package...
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6882040 |
Semiconductor device
A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1)...
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