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Document Title |
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7633144 |
Semiconductor package
Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing...
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7629660 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which...
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7626253 |
Computing device including a stacked semiconductor device
The present invention provides a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip ( 20 ) disposed on a substrate ( 10 ), a first...
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7622311 |
Inspection of underfill in integrated circuit package
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package...
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7622801 |
Thin planar semiconductor device
A thin, planar semiconductor device having electrodes on both surfaces is disclosed. This semiconductor device is provided with an IC chip and a wiring layer having one side that is electrically...
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7622750 |
Optical device package and optical semiconductor device using the same
An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die...
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7615870 |
Semiconductor device, manufacturing method thereof, and connection method of circuit board
Cut pieces of a flexible tape respectively having positioning holes are superposed on a substrate having positioning holes, while positioning the substrate and the cut pieces by inserting a...
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7607560 |
Semiconductor die attachment for high vacuum tubes
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7589403 |
Lead structure for a semiconductor component and method for producing the same
A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic...
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7589420 |
Print head with reduced bonding stress and method
An ink jet print head includes a silicon ink jet chip, a print head holder, configured to carry and support the silicon chip, and a glass plate, bonded between the silicon chip and the print head...
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7586185 |
Semiconductor device having a functional surface
A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has...
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7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically...
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7534662 |
Methods for hermetic sealing of post media-filled MEMS package
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port...
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7531229 |
Microstructured component and method for its manufacture
A microstructured component having a layered construction may allow implementation of component structures having a layer thickness of more than 50 μm, e.g., more than 100 μm. Capping of the...
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7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames
Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer...
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7528472 |
Chip package mechanism
A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the...
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7514289 |
Methods and structures for facilitating proximity communication
One embodiment of the present invention provides an integrated chip module and a corresponding method of manufacture that facilitates proximity communication. This module includes a base chip and a...
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7514777 |
Power semiconductor module
A power semiconductor module of the present invention comprises: a heat sink 1 ; a circuit substrate 2 mounted on the heat sink 1 ; a conductive pattern 10 provided on the circuit substrate ...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7495328 |
Micromechanical component
A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.
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7489031 |
High power radiation emitter device and heat dissipating package for electronic components
The electronic component package of the present invention includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed...
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7482686 |
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first...
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7482683 |
Integrated circuit encapsulation system with vent
An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe...
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7476955 |
Die package having an adhesive flow restriction area
A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a...
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7473992 |
Multi-layer interconnection circuit module and manufacturing method thereof
The present invention is directed to a multi-layer interconnection circuit module in which plural unit wiring layers are interlayer-connected to each other through a large number of via holes so...
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7452754 |
Method for manufacturing flexible printed circuit boards
A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically...
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7449363 |
Semiconductor package substrate with embedded chip and fabrication method thereof
A semiconductor package substrate with embedded chip and a fabrication method thereof are provided. A first insulating layer is applied on a metallic board, and formed with at least one opening for...
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7442653 |
Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass
An exemplary manufacturing method of an inter-metal dielectric of a semiconductor device according to an embodiment of the present invention includes forming a first silicon-rich oxide (SRO) layer...
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7428255 |
Semiconductor laser
A semiconductor laser is constituted by a die pad and a plurality of leads formed by a plate-shaped lead frame that are integrally supported by a resin portion made of a mold resin, and a laser...
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7417309 |
Circuit device and portable device with symmetrical arrangement
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
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7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7405469 |
Semiconductor device and method of manufacturing the same
A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a...
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7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing...
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7397140 |
Chip module
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the...
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7381996 |
Low thermal resistance LED package
A LED chip is bonded on a large submount serving as a heat sink. The submount is punched out from a thin metal sheet together with two other sections of lead frames for the LED and held together...
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7375433 |
Semiconductor device packaging substrate and semiconductor device packaging structure
A packaging substrate for a semiconductor device includes: a solder resist on a surface of the packaging substrate, the solder resist having a first opening portion for mounting the semiconductor...
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7364778 |
Container for an electronic component
A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage...
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7355275 |
Chip package and fabricating method thereof
A chip package and fabricating method thereof are provided to maintain the thermal dissipating efficiency and reduce the damage to the chip. The edge of the exposed portion would be cracked caused...
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7348681 |
Electronic component and manufacturing method of the electronic component
In an electronic component in which a semiconductor device such as a light emitting diode is encapsulated by an encapsulation resin and a manufacturing method of the same, formation of flash on...
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7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region
A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the...
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7332784 |
Method of providing an optoelectronic element with a non-protruding lens
An optoelectronic component has a lens that is formed in the surface of an encapsulant surrounding a semiconductor diode element. With respect to emitters, the lens reduces internal reflection and...
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7320902 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
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7309919 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the...
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7307773 |
Micro-optoelectromechanical system packages for a light modulator and methods of making the same
A micro-optoelectromechanical system (MOEMS) package for a light modulator includes a sealed modulator package containing a light modulator sealed under a first transparent lid; a secondary, larger...
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7298039 |
Electronic circuit device
In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high...
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7288843 |
Integrated circuit chip support substrate for placing in a mold, and associated method
A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and...
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7279781 |
Two-stage transfer molding device to encapsulate MMC module
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the...
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