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7615859 |
Thin semiconductor package having stackable lead frame and method of manufacturing the same
Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that...
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7615858 |
Stacked-type semiconductor device package
A stacked-type semiconductor device package is provided. The stacked-type semiconductor device package includes a plurality of stacked semiconductor chip packages with joining electrodes exposed on...
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7615857 |
Modular three-dimensional chip multiprocessor
A chip multiprocessor die supports optional stacking of additional dies. The chip multiprocessor includes a plurality of processor cores, a memory controller, and stacked cache interface circuitry....
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7615856 |
Integrated antenna type circuit apparatus
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes...
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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
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7612434 |
Electronic device having wiring substrate and lead frame
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first...
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7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The...
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7608921 |
Multi-layer semiconductor package
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on top of the die. The bottom side of the...
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7608920 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7608919 |
Interconnect packaging systems
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7605477 |
Stacked integrated circuit assembly
A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the...
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7605476 |
Stacked die semiconductor package
A stacked die semiconductor package includes: a substrate, having a first surface and an opposite surface thereto; a plurality of dice, structured for being stacked one on top of the other on the...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605458 |
Method and apparatus for integrating capacitors in stacked integrated circuits
Method and apparatus for integrating capacitors in stacked integrated circuits are described. One aspect of the invention relates to a semiconductor assembly having a carrier substrate, a plurality...
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7605457 |
Semiconductor device and method of manufacturing the same
The present invention provides a semiconductor device that includes: stacked semiconductor chips, each semiconductor chip including a semiconductor substrate and a first insulating layer that is...
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7605454 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7602630 |
Configurable inputs and outputs for memory stacking system and method
Embodiments of the present invention relate to configurable inputs and/or outputs for memory and memory stacking applications. More specifically, embodiments of the present invention include memory...
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7602057 |
Signal light using phosphor coated LEDs
A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light...
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7598619 |
Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
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7598618 |
Semiconductor device
A semiconductor device that enables the transmission time of a signal and implementation area to be reduced, and a method for manufacturing the same. A semiconductor device includes a first...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598607 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same
Provided is a semiconductor package with enhanced joint reliability and methods of fabricating the same. The method includes: forming package units including a semiconductor chip interposed between...
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7598606 |
Integrated circuit package system with die and package combination
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
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7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7598523 |
Test structures for stacking dies having through-silicon vias
A semiconductor die including a test structure is provided. The semiconductor die includes a loop-back formed on a surface of the semiconductor die. The loop-back structure includes a first bonding...
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7598123 |
Semiconductor component and method of manufacture
A semiconductor component comprising two stacked semiconductor dice and a method of manufacture. A leadframe having an active area that includes leadframe leads and a cavity is mounted to a support...
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7595552 |
Stacked semiconductor package in which semiconductor packages are connected using a connector
A stacked semiconductor package includes a semiconductor package module in which a plurality of semiconductor packages, which include a substrate and a semiconductor chip mounted over the...
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7595551 |
Semiconductor package for a large die
A semiconductor package is provided. A semiconductor package has a die pad and a plurality of bonding fingers. A spacer is attached to the die pad, and a large die is attached to the spacer. The...
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7592709 |
Board on chip package and method of manufacturing the same
A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active...
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7592707 |
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated...
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7592700 |
Semiconductor chip and method of manufacturing semiconductor chip
A semiconductor chip includes a semiconductor substrate having a first principal surface, and having a device layer on the first principal surface in which a semiconductor device is formed, an...
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7592693 |
Interconnecting electrical devices
An intercoupling component includes first male contacts, each first male contact received within a corresponding aperture of a first array of apertures and extending beyond a second surface of a...
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7592692 |
Semiconductor device with a dummy electrode
A semiconductor device according to an embodiment of the present invention includes a semiconductor chip. The semiconductor chip includes a semiconductor substrate, an interconnect layer, a back...
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7592691 |
High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
A stacked semiconductor die assembly includes at least two partially offset semiconductor dice with bond pads located adjacent at least one peripheral side thereof supported on a redistribution...
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7592690 |
Semiconductor device including semiconductor elements mounted on base plate
A semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that...
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7592689 |
Semiconductor module comprising semiconductor chips and method for producing the same
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top...
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7589410 |
Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package
A stack package includes at least two stacked package units. Each package unit comprises semiconductor chips having bonding pads on upper surfaces thereof; a molding part formed to surround side...
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7589409 |
Stacked packages and microelectronic assemblies incorporating the same
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and...
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7589408 |
Stackable semiconductor package
A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed...
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7589407 |
Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on...
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7589406 |
Stacked semiconductor component
A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding...
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7588964 |
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same
A stacked structure of semiconductor devices may include a plurality of stacked semiconductor devices, each having an upper surface and a lower surface and one or more via electrodes protruding...
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7586184 |
Electronic package
An electronic package is provided. The electronic package includes a first substrate, an electronic component, a first sealant, a second substrate, a plurality of bonding wires and a second...
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7586183 |
Multilevel semiconductor module and method for fabricating the same
A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face...
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7586182 |
Packaged semiconductor die and manufacturing method thereof
Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die...
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7585700 |
Ball grid array package stack
Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and...
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