Matches 1 - 50 out of 1774 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7429792 Stack package with vertically formed heat sink  
A stack package includes a base substrate having connection pads on an upper surface thereof and ball lands on a lower surface thereof; at least two semiconductor chps stacked by intervening a...
7429788 Thin multichip flex-module  
A thin multichip module comprises: a foldable frame comprising two rigid, substantially planar members capable of being folded together about a selected fold axis to form a substantially closed...
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7429786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides  
A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a...
7429785 Stacked integrated circuit chip assembly  
A stacked arrangement of integrated circuit chips are bonded to a lead frame. Two side-by-side integrated circuit chips have bottom contact pads bonded to a lead frame structure having contact...
7429784 Package structure  
A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of...
7429782 Semiconductor stack block comprising semiconductor chips and methods for producing the same  
A semiconductor stack block contains either stacked semiconductor chip size semiconductor devices or semiconductor devices with semiconductor chips in a plastic housing composition, the...
7427810 Semiconductor device including semiconductor element mounted on another semiconductor element  
A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second...
7425758 Metal core foldover package structures  
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The...
7423339 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7423338 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7423337 Integrated circuit device package having a support coating for improved reliability during temperature cycling  
An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after...
7423336 Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices  
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations...
7423335 Sensor module package structure and method of the same  
An image sensor multi-chips package structure, includes a first package including a first chip with image sensors having first bonding pads and micro lens on a first active surface, a first die...
7420814 Package stack and manufacturing method thereof  
A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first...
7420269 Stacked integrated circuit package-in-package system  
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a...
7420268 Semiconductor chip package and application device thereof  
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of...
7420129 Semiconductor package including a semiconductor device, and method of manufacturing the same  
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having...
7417308 Stack type package module and method for manufacturing the same  
The stack type package module includes a plurality of stacked tape carrier packages. Each package has an elongated lead having an extension end connected to the first lateral end connected to a...
7417293 Image sensor packaging structure  
An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second...
7414505 High frequency inductor having low inductance and low inductance variation and method of manufacturing the same  
An inductor used in an RF unit for a wireless communication terminal, includes first inductor means for electrically connecting an RF chip placed over a substrate at a predetermined distance from...
7414305 Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices  
A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and...
7413928 Die-wafer package and method of fabricating same  
A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each...
7411286 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7411285 Low profile stacked semiconductor chip package  
A stacked semiconductor chip package comprising a first semiconductor chip having an upper surface, a lower surface opposed to said upper surface, and a plurality of conductive metal lines formed...
7411281 Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same  
Die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. A die-down array IC device package includes a heat spreader...
7410884 3D integrated circuits using thick metal for backside connections and offset bumps  
Backside connections for 3D integrated circuits and methods to fabricate thereof are described. A stack of a first wafer over a second wafer that has a substrate of the first wafer on top of the...
7408255 Assembly for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7408254 Stack land grid array package and method for manufacturing the same  
A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a...
7408253 Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density  
The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned...
7408245 IC package encapsulating a chip under asymmetric single-side leads  
A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a...
7408244 Semiconductor package and stack arrangement thereof  
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a...
7405991 Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices  
The invention is directed to a system and method comprising a first semiconductor device and a second semiconductor device, wherein the first semiconductor device comprises a voltage supply means,...
7405472 Semiconductor device  
A semiconductor device, which is constituted in such a way that a pad portion of a logic chip is connected to an element region of a semiconductor chip with a bump bonding, is capable of achieving...
7405471 Carrier-based electronic module  
An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes...
7402903 Semiconductor device  
Disclosed is a semiconductor device including: a semiconductor substrate; a plurality of diffusion layer patterns formed on the semiconductor substrate; an insulation film formed between the plural...
7402902 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice  
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
7402901 Semiconductor device and method of manufacturing semiconductor device  
The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a...
7402897 Vertical system integration  
The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and...
7400047 Integrated circuit with stacked-die configuration utilizing substrate conduction  
An integrated circuit comprises a plurality of integrated circuit die arranged in a stack, with a given die other than a top die of the stack carrying current for itself and at least one additional...
7400033 Package on package design to improve functionality and efficiency  
Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may...
7400032 Module assembly for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7397120 Semiconductor package structure for vertical mount and method  
In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A...
7397115 Folding chip planar stack package  
A folding chip planar stack package is realized by employing folding chips. The folding chip planar stack package includes a substrate, first and second semiconductor chips attached to an upper...
7394160 Printed wires arrangement for in-line memory (IMM) module  
An inline memory module (IMM) architecture may include: a printed circuit board (PCB); a first array of memory devices on a first side of the PCB; a second array of memory devices on a second side...
7394149 Thin multichip flex-module  
A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having...
7394148 Module having stacked chip scale semiconductor packages  
Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the...
7394147 Semiconductor package  
A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface...
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7393718 Unmolded package for a semiconductor device  
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such...
Matches 1 - 50 out of 1774 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >