Matches 401 - 450 out of 1699 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >
Match Document Document Title
7327026 Vacuum diode-type electronic heat pump device and electronic equipment having the same  
An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member...
7327021 Multi-level semiconductor module  
A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to...
7323363 Contact load profile modification for a compression socketed CPU  
A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top...
7323774 Integrated circuit package system with pedestal structure  
An integrated circuit package system includes providing a substrate having a bond finger thereon and forming a pedestal on a portion of the bond finger. A first die is mounted on the substrate and...
7322239 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base...
7321165 Semiconductor device and its manufacturing method  
In a semiconductor device in which a plurality of substrates each mounting a semiconductor chip are stacked, one ends of the leads formed on the substrates are connected to the semiconductor chip...
7321164 Stack structure with semiconductor chip embedded in carrier  
A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and...
7319049 Method of manufacturing an electronic parts packaging structure  
A method of manufacturing an electronic parts packaging structure of the present invention, includes the steps of forming a first uncured resin layer on a substrate, arranging an electronic parts...
7317244 Semiconductor device and manufacturing method thereof  
In a semiconductor device having a semiconductor chip mounted on a printed circuit board, the semiconductor chip has a plurality of electrodes and the printed circuit board has a plurality of...
7317256 Electronic packaging including die with through silicon via  
An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the...
7317247 Semiconductor package having heat spreader and package stack using the same  
A semiconductor package which can be stacked to form a package stack that includes a semiconductor chip with bonding pads, a board having contact pads on its upper surface and bump pads on its...
7317250 High density memory card assembly  
A high density memory card assembly having application for USB drive storage, flash and ROM memory cards, and similar memory card formats. A cavity is formed through a rigid laminate substrate....
7315078 Chip-stacked semiconductor package and method for fabricating the same  
A chip-stacked semiconductor package and a method for fabricating the same are proposed. A chip carrier module plate including a plurality of chip carriers, and a heat sink module plate including a...
7312518 Miniaturized multi-chip module and method for manufacturing the same  
A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and...
7312527 Low temperature phase change thermal interface material dam  
A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.
7309648 Low profile, chip-scale package and method of fabrication  
Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate with first and second surfaces, at least one opening, and a certain thickness. On the first...
7309923 Integrated circuit package having stacked integrated circuits and method therefor  
Improved approaches to stacking integrated circuit chips within an integrated circuit package are disclosed. The improved approaches enable increased integrated circuit density within integrated...
7309913 Stacked semiconductor packages  
A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The...
7309914 Inverted CSP stacking system and method  
Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible...
7310458 Stacked module systems and methods  
The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of...
7306973 Method for making a semiconductor multipackage module including a processor and memory package assemblies  
A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multipackage module substrate. In some embodiments the memory packages...
7304375 Castellation wafer level packaging of integrated circuit chips  
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled to castellation blocks and,...
7304373 Power distribution within a folded flex package method and apparatus  
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace...
7304370 Electronic device having wiring substrate and lead frame  
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first...
7304374 Wireless coupling of semiconductor dies  
At least one semiconductor die is equipped with at least one RF transmitter, RF receiver and/or RF transceiver. This enables one or more RF links to be established with the die, enabling...
7301243 High-reliable semiconductor device using hermetic sealing of electrodes  
The present invention relates to a high-reliable semiconductor device in which electrodes formed on substrates are prevented from deteriorating by sealing the electrodes with a frame member rather...
7301233 Semiconductor chip package with thermoelectric cooler  
The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate,...
7298036 Scaling of functional assignments in packages  
A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each...
7298032 Semiconductor multi-chip package and fabrication method  
A multi-chip package comprises a package substrate having bond fingers disposed thereon. A first chip have center bonding pads formed on a substantially center portion thereof. The first chip is...
7298037 Stacked integrated circuit package-in-package system with recessed spacer  
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first...
7298625 Expansion structure of memory module slot  
An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the...
7298038 Integrated circuit package system including die stacking  
An integrated circuit package system including a leadframe having an aperture provided therein and an integrated circuit package mounted to the leadframe over or under the aperture. A die is...
7298033 Stack type ball grid array package and method for manufacturing the same  
A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked...
7298035 Semiconductor device and a method of assembling a semiconductor device  
A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided...
7294936 Semiconductor device  
In the case where a first semiconductor chip 100 and a second semiconductor chip 200 are stacked, both the semiconductor chips 100 and 200 are connected using micro bumps, in which a...
7294928 Components, methods and assemblies for stacked packages  
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both...
7291924 Flip chip stacked package  
A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower...
7291869 Electronic module with stacked semiconductors  
An electronic module has a heat sink with an upper surface and a lower surface, a plurality of leads arranged adjacent the heat sink and at least one circuit element with two vertical semiconductor...
7291907 Chip stack employing a flex circuit  
A chip stack employing BGA or FBGA integrated circuit chip packages is provided. Two chip packages have bottom surfaces attached with sets of electrical contacts, which are oriented towards each...
7291906 Stack package and fabricating method thereof  
Disclosed are a stack package and a fabricating method thereof using a ball grid array semiconductor package (hereinafter, referred to as “BGA PKG”). The stack package can easily electrically...
7291905 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device  
A lead frame of the present invention includes a plurality of tie bars including tie bars each having deformable portions that protect opposite outside frames from deformation. The outside frames...
7288835 Integrated circuit package-in-package system  
An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second...
7288836 Stacked alignment mark and method for manufacturing thereof  
A stacked alignment mark. The stacked alignment mark comprises a first alignment mark and a second alignment mark. The first alignment mark is located in a first film layer, wherein the first...
7288837 Semiconductor device and its writing method  
A semiconductor device mounted on a mother board has a circuit board to be positioned on the mother board and a semiconductor chip positioned on the circuit board. The circuit board has a...
7286384 Automatic resource assignment in stacked module devices  
A stacked module device and corresponding module and method are provided where at least some modules have input ports connected to receive first resource related signals and output ports connected...
7285848 Carrier for stacked type semiconductor device and method of fabricating the same  
A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second...
7285847 Chip stack package, connecting board, and method of connecting chips  
A chip stack package, a connecting board, and a method of connecting multiple, stacked semiconductor chips multi-chip package comprises a plurality of stacked packages including an upper package...
7286365 Electronic substrate for a three-dimensional electronic module  
The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being...
7285856 Package for semiconductor devices  
To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even...
7282791 Stacked semiconductor device and semiconductor memory module  
A semiconductor device module includes a wiring substrate, a plurality of stacked semiconductor devices and a damping impedance circuit. The plurality of stacked semiconductor devices are provided...
Matches 401 - 450 out of 1699 < 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 >