Matches 301 - 350 out of 1688 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7393770 Backside method for fabricating semiconductor components with conductive interconnects  
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
7394160 Printed wires arrangement for in-line memory (IMM) module  
An inline memory module (IMM) architecture may include: a printed circuit board (PCB); a first array of memory devices on a first side of the PCB; a second array of memory devices on a second side...
7393718 Unmolded package for a semiconductor device  
A semiconductor device that does not include a molded body or package. The semiconductor device includes a substrate and a die coupled to the substrate. The die is coupled to the substrate such...
7394147 Semiconductor package  
A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface...
7394148 Module having stacked chip scale semiconductor packages  
Stacked CSP (chip scale package) modules include a molded first (“top”) chip scale package having a molding side and a substrate side, and a second (“bottom”) package affixed to the...
7391106 Stack type package  
A stack type semiconductor package uses rigid, C-shaped guide substrates that hold semiconductor packages stacked in place and which also provide signal pathways between the stacked semiconductors...
7391105 Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same  
A unit semiconductor chip and stacked semiconductor package and method of manufacturing with center bonding pads and at least one circuit layer to reduce the length of bonding. The unit...
7388280 Package stacking lead frame system  
The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a...
7388293 Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions  
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided...
7388294 Semiconductor components having stacked dice  
A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary...
7385283 Three dimensional integrated circuit and method of making the same  
A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second...
7385296 Sensor device having stopper for limitting displacement  
A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The...
7385299 Stackable integrated circuit package system with multiple interconnect interface  
A stackable integrated circuit package system is provided forming a first integrated circuit die having an interconnect provided thereon, forming an external interconnect, having an upper tip and a...
7385281 Semiconductor integrated circuit device  
A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an...
7378725 Semiconducting device with stacked dice  
Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active...
7378726 Stacked packages with interconnecting pins  
A system may include a first integrated circuit package including a first integrated circuit die and a first integrated circuit package substrate defining a first plurality of openings, a second...
7378732 Semiconductor package  
A plurality of semiconductor packages is collectively fabricated on a wafer in a batch process and the wafer is then diced to obtain discrete semiconductor packages. The semiconductor package is a...
7375419 Stacked mass storage flash memory package  
A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the...
7375422 Stacked-type semiconductor package  
Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission...
7375005 Method for reclaiming and reusing wafers  
Embodiments of the present invention provide a method for reclaiming and reusing a wafer. In one embodiment, a method for reclaiming a wafer comprises providing a used, nonproductive wafer having a...
7375421 High density multilayer circuit module  
Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules...
7375420 Large area transducer array  
A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a...
7372140 Memory module with different types of multi chip packages  
In an embodiment, a memory module includes a first group of multi chip packages, including one or more non-volatile memories, and a second group of multi chip packages, including one or more...
7372131 Routing element for use in semiconductor device assemblies  
A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than...
7372129 Two die semiconductor assembly and system including same  
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
7372142 Vertical conduction power electronic device package and corresponding assembling method  
A vertical conduction power electronic device package and corresponding assembly method comprising at least a metal frame suitable to house at least a plate or first semiconductor die having at...
7372137 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a lower substrate having wiring patterns formed of a plurality of wirings, semiconductor chips located above the lower substrate and electrically connected to the...
7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides  
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One...
7368812 Interposers for chip-scale packages and intermediates thereof  
A carrier substrate, or interposer, for use in a chip-scale package includes a material, such as a semiconductive material, that has a coefficient of thermal expansion that is the same or similar...
7368666 Surface-mounting type electronic circuit unit without detachment of solder  
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of...
7368754 Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus  
The invention provides a semiconductor integrated circuit which allows a plurality of devices to be integrated compactly, that is, with high density; a signal transmitting device; an...
7367120 Method for producing a solid-state imaging device  
A method of manufacturing a solid-state imaging device. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer...
7368811 Multi-chip package and method for manufacturing the same  
A multi-chip package and method for manufacturing are disclosed. The multi-chip package may include a substrate, a lower semiconductor chip mounted on the substrate, a first electrical connection...
7365416 Multi-level semiconductor module and method for fabricating the same  
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and...
7365418 Multi-chip structure  
A multi-chip structure at least including a first chip, a second chip and a first thermal-conductive layer is provided. The first chip has a first surface and a plurality of first pads disposed on...
7365417 Overhang integrated circuit package system  
An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the...
7363971 Method and apparatus for maintaining a multi-chip module at a temperature above downhole temperature  
Methods and systems for operating integrated circuits at temperatures higher than expected ambient temperatures. The heating may be of entire circuit boards, portions of the circuit boards (such as...
7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package  
A method is provided for making a semiconductor multi-package module, by providing a lower molded ball grid array package including a lower substrate and a die, affixing an upper molded package...
7365427 Stackable semiconductor package  
The present invention relates to a stackable semiconductor package, comprising a first substrate, a chip, a second substrate, a plurality of second wires, a plurality of supporting elements and a...
7364941 Circuit device manufacturing method  
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto...
7364945 Method of mounting an integrated circuit package in an encapsulant cavity  
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and...
7361982 Bumpless chip package  
A bumpless chip package including at least a panel-shaped component, a chip, an interconnection structure and a conductive channel is provided. The chip is disposed on the panel-shaped component....
7358601 Architecture for face-to-face bonding between substrate and multiple daughter chips  
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and...
7358600 Interposer for interconnecting components in a memory card  
A circuit module for use in a memory card. The circuit module comprises a base substrate including a plurality of contacts. Attached to the base substrate is a memory die, while attached to the...
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides  
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof  
A reciprocal design symmetry allows stacked wafers or die on wafer to use identical designs or designs that vary only by a few layers (e.g. metal interconnect layers). Flipping or rotating one die...
7354800 Method of fabricating a stacked integrated circuit package system  
An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit,...
7355271 Flexible assembly of stacked chips  
A three-dimensional package consisting of a plurality of folded integrated circuit chips ( 100, 110, 120 ) is described wherein at least one chip provides interconnect pathways for electrical...
7355272 Semiconductor device with stacked semiconductor chips of the same type  
A semiconductor device includes a wiring board, a first semiconductor chip (e.g. DRAM) that is flip-chip connected on the wiring board, a second semiconductor chip (e.g. DRAM) that is of the same...
7353595 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon  
A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands...
Matches 301 - 350 out of 1688 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >