Matches 651 - 700 out of 1679 < 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 >
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7098528 Embedded redistribution interposer for footprint compatible chip package conversion  
An embedded redistribution interposer is disclosed for providing footprint compatible chip package migration in which a die designed to be mounted into chip package is originally implemented using...
7098542 Multi-chip configuration to connect flip-chips to flip-chips  
A semiconductor structure includes a carrier having a cavity formed in a top portion thereof, and a plurality of conductive contacts formed on a top surface of the carrier and positioned around the...
7098073 Method for stacking an integrated circuit on another integrated circuit  
Two or more semiconductor packages are stacked with an intervening element that is positioned between within an area surrounded by conductive bumps of a bottom surface of the overlying package....
7098530 Package for a high-frequency electronic device  
The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends...
7094632 Low profile chip scale stacking system and method  
The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile structures provide connection between...
7095104 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same  
An approach to DRAM memory chip packaging leveraging the chip center position for wire bond pads to minimize time-of-flight and impedance effects resulting from stacking in a BGA application. A top...
7095105 Vertically stacked semiconductor device  
A semiconductor device including a vertical assembly of semiconductor chips interconnected on a substrate with one or more metal standoffs providing a fixed space between each supporting chip and a...
7091622 Semiconductor device, ball grid array connection system, and method of making  
A semiconductor device is provided with a metal stiffening layer between the die and a multilayer structure comprising at least two insulating layers each having at least one conductor thereon. A...
7091592 Stacked package for electronic elements and packaging method thereof  
A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided...
7091593 Circuit board with built-in electronic component and method for manufacturing the same  
A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating...
7091619 Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device  
A method is provided to enhance the connection reliability in three-dimensional mounting while considering the warping of packages. Opening diameters of the openings provided corresponding to...
7091590 Multiple stacked-chip packaging structure  
The invention provides a multiple stacked-chip packaging structure, including: at least one lower layer chip located on a substrate, wherein a plurality of wires are electrically connected to the...
7091589 Multilayer wiring board and manufacture method thereof  
In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of...
7091606 Circuit device and manufacturing method of circuit device and semiconductor module  
After a trench 54 is formed in a conductive foil 60 , the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being...
7091591 Semiconductor device  
A semiconductor device formed by mutually connecting a first semiconductor chip with second and third semiconductor chips arranged side by side, with the active surface of the first chip faced to...
7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation  
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
7091061 Method of forming a stack of packaged memory dice  
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor...
7087502 Method for generating chip stacks  
Disclosed is a method for generating chip stacks during the production of chips from wafers, the chips located on the wafer being separated from one another, the wafer being ground thin and the...
7087988 Semiconductor packaging apparatus  
An exemplary embodiment of the present invention described and shown in the specification and drawings is a semiconductor packaging apparatus that includes a first substrate for coupling to an...
7084513 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same  
A semiconductor device includes a first semiconductor chip ( 5 ) having a first terminal ( 7 ) on one surface, a second semiconductor chip ( 1 a ) which is larger than the first semiconductor chip...
7078793 Semiconductor memory module  
A semiconductor memory module includes a wiring board in or on which at least a number of data line runs are conducted in a respective width of k bits and which exhibits a number of memory ranks...
7078818 Semiconductor device  
A semiconductor device includes: a wiring board; a first semiconductor chip, which has a circuitry side and a non-circuitry side that face each other vertically and which is electrically connected...
7078790 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices  
Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At...
7078788 Microelectronic substrates with integrated devices  
A microelectronic substrate including at least one microelectronic device disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within...
7078792 Universal interconnect die  
A device for electrically interconnecting one or more semiconductor devices to provide for flexibility in wiring and preventing long or shorted leads and methods for fabricating and using same. The...
7075177 Semiconductor chip package  
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state...
7071547 Assemblies having stacked semiconductor chips and methods of making same  
A stacked microelectronic assembly comprises a continuous sheet including a core panel and a plurality of side panels, each having a folded portion that connects the side panel to an edge of the...
7071546 Space-saving packaging of electronic circuits  
An apparatus and packaging method for stacking a plurality of integrated circuit substrates, i.e., substrates having integrated circuits formed as integral portions of the substrates, which...
7071567 Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument  
A semiconductor device includes: a substrate on which is formed an interconnecting pattern; a first semiconductor chip provided above the substrate and having a first electrode on a surface facing...
7071555 Ball grid array package stack  
Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and...
7068072 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit  
A general purpose interface tile of a first integrated circuit includes a plurality of micropads. A second integrated circuit may be stacked on the first integrated circuit such that signals from...
7067911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture  
A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and...
7067909 Multi-layer integrated semiconductor structure having an electrical shielding portion  
A multi-layer integrated semiconductor structure is provided, which includes at least a first semiconductor structure and a second semiconductor structure coupled together via an interface. The...
7067910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips  
One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated...
7064430 Stacked die packaging and fabrication method  
A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded...
7064579 Alterable application specific integrated circuit (ASIC)  
A highly economical alterable ASIC contains multiple fully optimized custom ASIC designs in one IC foot-print, each design utilizing the entire IC. The user can switch between multiple...
7064425 Semiconductor device circuit board, and electronic equipment  
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump....
7064426 Semiconductor multi-package module having wire bond interconnect between stacked packages  
A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by...
7061089 Memory module having space-saving arrangement of memory chips and memory chip therefore  
A memory module has a module board having a main surface. A plurality of memory chips is arranged on the main surface of the module board. Each memory chip has two main surfaces extending between a...
7061121 Stacked microelectronic assemblies with central contacts  
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at...
7061088 Semiconductor stacked multi-package module having inverted second package  
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire...
7061087 Multi-package stack module  
A multi-package module comprises a plurality of stacked packages including an upper package and a lower package. Each package comprises a board having located on a first side thereof a chip...
7061120 Stackable semiconductor package having semiconductor chip within central through hole of substrate  
A stackable semiconductor package includes a substrate having a first surface, an opposite second surface, and through hole. Circuit patterns on the first and second surfaces of the substrate...
7057270 Systems and methods for stacking chip components  
Systems and methods for vertically interconnecting a plurality of chips to provide increased volume circuit density for a given surface chip footprint. One embodiment provides a chip stack where...
7057269 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package  
A semiconductor multi-package module has a second package inverted and stacked over a first package, each of the packages having a die attached to a substrate, in which the second package substrate...
7053474 Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip  
A semiconductor component, featuring a housing, at least two semiconductor chips arranged in the housing, which chips in each case have a front side and a rear side and in each case have at least...
7053475 Semiconductor device and manufacturing method therefor  
An object of the present invention is to make it possible to effect a reliable and compact configuration for a semiconductor device when mounting a plurality of semiconductor elements in a single...
7049691 Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package  
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the upper and...
7049687 Tape carrier package having stacked semiconductor elements, and short and long leads  
A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base...
7049692 Stacked semiconductor device  
A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer...
Matches 651 - 700 out of 1679 < 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 >