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Match Document Document Title
7148578 Semiconductor multi-chip package  
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
7145248 Common connection method for flip-chip assembled devices  
The planes of chips in a flip-chip arrangement, when at least one of the chips has an insulating layer running through it, may be electrically connected together by incorporating into the top chip...
7145247 Offset-bonded, multi-chip semiconductor device  
The present invention is aimed at bonding a lower chip and an upper chip through bumps in a highly reliable manner, while ensuring a sufficient area for an external connection terminal region, by...
7145225 Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods  
An interposer includes a substrate, first and second sets of contact pads carried by the substrate, and receptacles formed in a surface of the substrate and exposing contact pads of the second set....
7145226 Scalable microelectronic package using conductive risers  
This invention relates to an apparatus and methods for increasing the microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package...
7144800 Multichip packages with exposed dice  
Multichip packages and methods for making same. The present invention generally allows for either the back of a flipchip, the back of a mother die, or both to be exposed in a multichip package....
7145233 Decoupling capacitor closely coupled with integrated circuit  
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and...
7145227 Stacked memory and manufacturing method thereof  
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is...
7141883 Integrated circuit package configuration incorporating shielded circuit element structure  
An electromagnetically-shielded high-Q inductor may be fabricated within a multi-layer package substrate (MLS). The inductor is preferably constructed as a loop structure on a layer of the MLS, and...
7141872 Semiconductor device and method of manufacturing semiconductor device  
Disclosed is a method of manufacturing a semiconductor device, comprising preparing a first substrate including an integrated circuit chip, first connection terminals electrically connected to...
7141873 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument  
A semiconductor device including: a semiconductor chip; a wiring board on which the semiconductor chip is mounted; and a plurality of external terminals provided on the wiring board. The external...
7138708 Electronic system for fixing power and signal semiconductor chips  
An electronic system having a sandwich design and including two carriers, each carrier having a printed circuit layer, the upper printed circuit layer being positioned on different planes.
7138710 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument  
A semiconductor device includes a semiconductor substrate in which an integrated circuit is formed, a through-hole electrode which is formed through first and second surfaces of the semiconductor...
7138709 Microelectronic package array  
This invention relates to an apparatus and method for increasing microelectronic package density by stacking multiple microelectronic packages in an array and controlling package to package...
7135703 Test tray with carrier modules for a semiconductor device handler  
A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves...
7134194 Method of developing an electronic module  
An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without...
7135762 Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument  
A semiconductor device including: a semiconductor substrate having an integrated circuit and a penetrating hole; an insulating layer formed on an inner surface of the penetrating hole; and a...
7132752 Semiconductor chip and semiconductor device including lamination of semiconductor chips  
To prevent short-circuit due to contact of bonding wires each other and to make a semiconductor device compact. A semiconductor chip with a rectangular main surface may comprise: a first side...
7132753 Stacked die assembly having semiconductor die overhanging support  
A stack of semiconductor dies is disclosed. A first stack level includes a first semiconductor die and at least one first support that are attached to a substrate surface. A second level includes a...
7132739 Encapsulated stack of dice and support therefor  
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports...
7132738 Semiconductor device having multiple semiconductor chips stacked in layers and method for manufacturing the same, circuit substrate and electronic apparatus  
The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips...
7132747 Multilayer integrated circuit for RF communication and method for assembly thereof  
A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package...
7132746 Electronic assembly with solder-bonded heat sink  
A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive...
7129572 Submember mounted on a chip of electrical device for electrical connection  
A submember for electrical device is disclosed. Said submember is mounted on a chip of electrical device. An embodiment for the submember comprised of an insulator and a plurality of conductive...
7129420 Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument  
A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The...
7129583 Multi-chip package structure  
The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first...
7126214 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements  
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable...
7126209 Lead frame, resin-encapsulated semiconductor device, and method of producing the same  
A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the...
7126829 Adapter board for stacking Ball-Grid-Array (BGA) chips  
Electronic devices packaged with arrayed solder balls, leads, or pads, such as Ball Grid Array (BGA) devices, are stacked together. Each stack has a bottom adapter card with metal contacts on a top...
7122904 Semiconductor packaging device and manufacture thereof  
A semiconductor packaging device comprises a carrier having at least a cavity or a slot thereon. At least a chip has a back surface and an active surface with a plurality of first bonding pads. The...
7122893 Semiconductor package structure  
A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A...
7122886 Semiconductor module and method for mounting the same  
A semiconductor module that can realize a substantially fixed transmission time of signals transmitted through electric wirings disposed on a board via each semiconductor device mounted on a board...
7122912 Chip and multi-chip semiconductor device using thereof and method for manufacturing same  
The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of...
7119427 Stacked BGA packages  
Provided are double stacked and multiple stacked BGA packages in which two or more BGA packages are stacked to increase the packaging density. Each of the individual BGA packages included in the...
7119429 3-D stackable semiconductor package  
A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second...
7119428 Semiconductor device  
A semiconductor device capable of reducing a temperature increase during operation thereof is provided. In the semiconductor device, an interface chip is stacked on a plurality of stacked...
7119425 Stacked multi-chip semiconductor package improving connection reliability of stacked chips  
The chip package includes a first and second semiconductor chip. The first semiconductor chip has a first connection structure that electrically connects to a bond pad on a first surface of the...
7119436 Memory module  
The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and...
7119445 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board  
An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such...
7119426 Semiconductor device and manufacturing method of same  
In a semiconductor device in which a second semiconductor chip is layered on a first semiconductor chip mounted on a substrate, a mounting-use bonding layer being formed on a reverse surface of the...
7115986 Flexible ball grid array chip scale packages  
A method and apparatus for increasing the integrated circuit density in a semiconductor assembly. The assembly includes a flexible interposer substrate attached to an active surface and a back side...
7115983 Multilayer, thin-film electronic devices  
Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance...
7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices  
A semiconductor device package is disclosed which is substantially die-sized with respect to each of the X, Y and Z axes. The package includes outer connectors that are located along at least one...
7115483 Stacked chip package having upper chip provided with trenches and method of manufacturing the same  
A stacked chip package includes a substrate having an upper surface and a lower surface, a first semiconductor chip having an upper surface and a lower surface, wherein the lower surface of the...
7116002 Overhang support for a stacked semiconductor device, and method of forming thereof  
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such...
7115977 Multi-chip package type semiconductor device  
A multi-chip package type semiconductor device includes an insulating substrate having first and second conductive patterns thereon, a first semiconductor chip on the insulating substrate and...
7112878 Die stacking scheme  
An improved die stacking scheme is provided. In accordance with one embodiment of the present invention, a multiple die semiconductor assembly is provided comprising a substrate, first and second...
7112877 High density package with wrap around interconnect  
A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the...
7112879 Microelectronic assemblies having compliant layers  
A microelectronic package includes a microelectronic element having contacts accessible at a surface thereof, a layer overlying the microelectronic element, the layer having a first surface and a...
7109576 Semiconductor component having encapsulated die stack  
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first...
Matches 601 - 650 out of 1688 < 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 >