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7622750 |
Optical device package and optical semiconductor device using the same
An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die...
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7615274 |
Storage magazine for microstructured molded parts and fabrication procedure
This describes a procedure for replicative fabrication and packaging of at least one microstructured molded part as one magazine/molded part composite as well as a magazine with at least one...
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7608922 |
Semiconductor device including amplifier and frequency converter
A miniaturized semiconductor device has a package substrate, a semiconductor chip mounted on the main surface of the package substrate and having plural LNAs each for amplifying a signal, an RF VCO...
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7608918 |
Semiconductor device
A semiconductor device is provided which comprises a heat-radiative support plate 5 ; and first and second semiconductor elements 1 and 2 mounted and layered on support plate 5 for alternate...
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7598604 |
Low profile semiconductor package
A first semiconductor element and a second semiconductor element each have an electrode forming surface with an electrode pad thereon. The first semiconductor element and the second semiconductor...
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7598534 |
LED light source with integrated circuit and light guide
An elongated light source ( 50 ) comprises a subassembly ( 51 ) including a base ( 54 ), a light engine ( 10 ) positioned in mounting means ( 56 ) formed with the base; a light guide ( 58 )...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7586188 |
Chip package and coreless package substrate thereof
A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a...
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7586181 |
Semiconductor device and method for manufacturing
A semiconductor device and method has trenches for raising reliability. An electrode pad, with a protective film and an interlayer film which form an opening on top, are on a substrate. A rewiring...
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7582969 |
Hermetic interconnect structure and method of manufacture
A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization...
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7579683 |
Memory interface optimized for stacked configurations
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that...
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7579680 |
Packaging system for semiconductor devices
A package system for integrated circuit (IC) chips and a method for making such a package system. The method uses a solder-ball flip-chip method for connecting the IC chips onto a lead frame that...
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7573125 |
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One such device can include a first support member, a second...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7550812 |
Camera module and method of fabricating the same
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module....
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7535089 |
Monolithically integrated light emitting devices
Methods and structures for monolithically integrating monocrystalline silicon and monocrystalline non-silicon materials and devices are provided. In one structure, a monolithically integrated...
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7535087 |
Semiconductor device with lead frames
By disposing a rear surface of a first island 12 and a top surface of a second island 13 so as to at least partially overlap each other, a first semiconductor chip on the first island and a...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7528472 |
Chip package mechanism
A chip package mechanism. A substrate is disposed in a receiving chamber of a base. A chip is disposed on a target surface of the substrate. A plurality of supporting elements is disposed on the...
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7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames
Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7525174 |
***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
High performance system-on-chip using post passivation process
The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a...
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7524087 |
Optical device
An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face...
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7518200 |
Semiconductor integrated circuit chip with a nano-structure-surface passivation film
A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface...
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7511379 |
Surface mountable direct chip attach device and method including integral integrated circuit
A surface mountable chip comprises a semiconductor substrate having IC devices formed thereon and also vertically exposed electrical contacts formed as part of the IC fabrication substrate....
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7511368 |
Carrier device for electronic chip
A surface mount electronic chip ( 10 ) is mounted on a holder ( 70 ) and electrically connected to holder terminals ( 74,76, 80 ) by the use of a carrier device ( 30 ). The carrier device has clips...
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7508057 |
Electronic component device
An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7491579 |
Composable system-in-package integrated circuits and process of composing the same
An SIP for performing a plurality of hard and soft functions comprises standard IC die and custom platforms mounted to a substrate. Die are identified for each standard hard function, such as...
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7489021 |
Lead frame with included passive devices
An semiconductor device package ( 10 ) includes a semiconductor device (die) ( 12 ) and passive devices ( 14 ) electrically connected to a common lead frame ( 17 ). The lead frame ( 17 ) is formed...
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7489013 |
Destructor integrated circuit chip, interposer electronic device and methods
A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the...
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7466030 |
Semiconductor device and fabrication process thereof
The semiconductor device uses an insulating resin that contains at least a resin anti-repellent for adjusting wettability of the insulating resin. The insulating resin is applied on a circuit...
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7466019 |
Rectangular semi-conducting support for microelectronics and method for making same
The semi-conducting support comprises a graphite substrate having a front surface and a rear surface and at least a first stack arranged on the front surface of the substrate. The first stack...
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7464459 |
Method of forming a MEMS actuator and relay with vertical actuation
A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms a...
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7459838 |
Plasma display device, TCP applied thereto, and method of manufacturing the TCP
A plasma display device includes a plasma display panel, a chassis base coupled to the plasma display panel, a drive circuit coupled to the chassis base, a flexible printed circuit (FPC) couples...
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7456497 |
Electronic devices and its production methods
An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed...
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7456483 |
Semiconductor device, manufacturing method of semiconductor device and module for optical device
A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening...
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7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at...
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7443681 |
Heat dissipator for display apparatus and plasma display apparatus including the heat dissipator
A heat dissipator of a signal transmission member for a display apparatus can sufficiently dissipate heat from devices of the signal transmission member and protect the devices, and includes a...
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7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are...
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7432593 |
Semiconductor package assembly and method for electrically isolating modules
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
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7432533 |
Encapsulation of electronic devices with shaped spacers
An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby...
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7429501 |
Lid and method of employing a lid on an integrated circuit
A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses...
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7414663 |
Imaging element, imaging device, camera module and camera system
The method for manufacturing a camera module of the present invention includes forming a bump on each electrode portion of an imaging element. Next, a through hole is formed in a substrate. The...
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7411210 |
Semiconductor probe with resistive tip having metal shield thereon
A semiconductor probe with a resistive tip and a method of fabricating the semiconductor probe. The resistive tip doped with a first impurity includes a resistive region formed at a peak thereof...
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7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7408250 |
Micromirror array device with compliant adhesive
A microstructure is packaged with a device substrate of the microstructure being attached to a package substrate. For dissipating possible deformation of the microstructure, which may result in...
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7402901 |
Semiconductor device and method of manufacturing semiconductor device
The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a...
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7402900 |
Semiconductor device substrate, semiconductor device, and manufacturing method thereof
A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing...
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