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7615857 |
Modular three-dimensional chip multiprocessor
A chip multiprocessor die supports optional stacking of additional dies. The chip multiprocessor includes a plurality of processor cores, a memory controller, and stacked cache interface circuitry....
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7615855 |
IC card and method of manufacturing the same
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured....
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7608920 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7605454 |
Memory card and method for devising
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure...
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7605453 |
Chip module and chip card
A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the...
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7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7586185 |
Semiconductor device having a functional surface
A semiconductor device for fingerprint sensors reduces a mounting area of the semiconductor device and improves a processing capacity of assembling and testing process. The semiconductor device has...
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7579679 |
Chipcard with contact areas and method for producing contact areas
A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another...
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7573720 |
Active socket for facilitating proximity communication
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon...
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7559469 |
Chip card of reduced size with backward compatibility and adapter for a reduced size chip card
To achieve backward compatibility for smaller chip cards, in particular to legacy card readers/writers or legacy mobile terminals, according to the present invention a smaller chip card comprises a...
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7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes
Wiring lines for the supply of a voltage to feed a drive voltage to an integrated circuit formed in a semiconductor chip are disposed so as to cover a main surface of the semiconductor chip, so...
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7547973 |
Tamper-resistant semiconductor device
The semiconductor device of the present invention includes: first defensive wiring provided above a diffusion isolation layer formed in a substrate or a well, arranged at a minimum wiring pitch...
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7547961 |
IC card with bonding wire connections of different lengths
An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip...
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7535088 |
Secure-digital (SD) flash card with slanted asymmetric circuit board
A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an...
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7531757 |
IC card and semiconductor integrated circuit device package
An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a...
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7525330 |
Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identity of the semiconductor device
The semiconductor device ( 11 ) of the invention comprises a circuit covered by a passivation structure ( 50 ). It is provided with a first and a second security element ( 12 A, 12 B) which...
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7514710 |
Bottom gate thin film transistors
A transistor is provided comprising: a substrate; a gate electrode; a semiconducting material not located between the substrate and the gate electrode; a source electrode in contact with the...
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7504670 |
Sealing structure for mounting a semiconductor device to a substrate
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the...
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7495926 |
Interface module for electronic devices
An interface module in a nonplanar form. The interface module includes an electronic device card, such as a SIM or memory card, in a cross-sectional shape that may be, for example, substantially a...
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7495329 |
Semiconductor memory card
A semiconductor memory card includes a nonvolatile memory chip mounted on an upper surface of a circuit board. The memory chip has first bonding pads formed close to a first side of the memory chip...
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7489027 |
Accessible electronic storage apparatus
A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12 a disposed on the first...
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7488619 |
Method and apparatus for manufacturing IC chip packaged device
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at...
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7486149 |
Method of manufacturing surface mount type crystal oscillator
A method of manufacturing a surface mount type crystal oscillator having a container body including a first recess and a second recess respectively formed in two main surfaces thereof, a crystal...
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7485491 |
Secure digital memory card using land grid array structure
A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to...
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7467464 |
Method of manufacturing a memory card
A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a...
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7463154 |
Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation of devices thereby are provided. Th method involves selectively exposing the...
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7446402 |
Substrate structure with embedded semiconductor chip and fabrication method thereof
A substrate structure with embedded semiconductor chip and a fabrication method thereof are provided. The method includes: providing a carrier board having a first surface and an opposing second...
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7432585 |
Semiconductor device electronic component, circuit board, and electronic device
A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the...
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7428148 |
Component support
A component support having at least one insert card reception chamber with two insert card guidance devices, which have oppositely located guides for receiving at least one insert card. The guides...
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7420830 |
Memory card module
A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is...
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7417306 |
Apparatuses and methods for forming electronic assemblies
Apparatuses and methods for forming microelectronic assemblies are claimed. One embodiment of the invention includes a contact smart card wherein fluidic self assembly is used to build the...
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7416132 |
Memory card with and without enclosure
The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory...
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7408226 |
Electronic card with protection against aerial discharge
An electronic card includes a card terminal which is exposed on a surface of a card, a semiconductor integrated circuit chip including an insulated-gate field effect transistor, and a protection...
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7405665 |
Semiconductor device, RFID tag and label-like object
An object of the present invention is to supply a semiconductor device capable of communicating data through radio communication, such as an RFID tag or a label-like object, with high productivity...
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7405656 |
Device and method for encapsulation and mounting of RFID devices
This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be...
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7405470 |
Adaptable electronic storage apparatus
A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12 a disposed on the first...
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7397672 |
Flip chip mounting substrate
The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line...
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7397140 |
Chip module
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the...
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7394147 |
Semiconductor package
A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface...
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7385280 |
Electronic device package and electronic equipment
An electronic device to be loaded on an electronic equipment or an electronic component is mounted on a mount substrate, the mount substrate being made thin and flexible and having strong...
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7382045 |
IC card and method of manufacturing the same
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured....
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7378301 |
Method for molding a small form factor digital memory card
A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly...
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7375972 |
Appearance protective case and appearance protective case assembly
An appearance protective case and an appearance protective case assembly are provided in which damage of a colored or marked pattern due to exposure is prevented, and in which the structure of a...
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7375631 |
Enabling and disabling a wireless RFID portable transponder
Provides protection to wireless portable transponders from an unauthorized interrogation by employing a mechanical member. Transponders include: cards, fobs and RFID tags that a persons may carry....
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7366918 |
Configuring and managing resources on a multi-purpose integrated circuit card using a personal computer
The systems and methods provide for configuring and managing resources on a multi-purpose IC card. In one aspect, a user interface (UI) for an application is presented on a display device. A user...
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7355860 |
Memory card with two standard sets of contacts and a contact covering mechanism
Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns,...
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7355270 |
Semiconductor chip with coil antenna and communication system
The present invention intends to prevent the communication distance from becoming shorter with a reduction in size of a coil antenna to the chip size and with a consequent decrease of an induced...
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7348662 |
Composite multi-layer substrate and module using the substrate
A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a...
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7335972 |
Heterogeneously integrated microsystem-on-a-chip
A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection...
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