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7619304 |
Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one...
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7619303 |
Integrated circuit package
An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first...
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7615854 |
Semiconductor package that includes stacked semiconductor die
A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7612444 |
Semiconductor package with flow controller
A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that...
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7612441 |
Image-sensing chip package module adapted to dual-side soldering
An image-sensing chip package module adapted to dual-side soldering includes three substrates, an image-sensing chip and a filter lens. The three substrates are stacked together by pressing (using...
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7612440 |
Package for an integrated circuit
According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the...
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7608917 |
Power semiconductor module
A power semiconductor module and an inverter apparatus in which a device or a joining part is not mechanically damaged even when the temperature in use becomes a high temperature in the range of...
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7606049 |
Module thermal management system and method
A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated...
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7605478 |
Semiconductor package and method of manufacturing the same
Provided are a semiconductor package and a method of manufacturing the semiconductor package, and more particularly, a semiconductor package with bonding wires and a method of manufacturing the...
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7605459 |
Coreless substrate and manufacturing thereof
An aspect of the present invention features a manufacturing method of a package on package with a cavity. The method can comprise (a) forming a first upper substrate cavity in one side of an upper...
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7605453 |
Chip module and chip card
A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the...
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7602057 |
Signal light using phosphor coated LEDs
A method for creating an improved signal light is disclosed. For example, the improved signal light includes a housing, one or more first type of light emitting diodes (LEDs) emitting a light...
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7602056 |
On-die termination method for multi-chip packages
An on-die termination method to support a multi-chip package routing topology is described. The on die termination method may increase the surface area on the substrate such that larger size die or...
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7602055 |
Semiconductor device and method for fabricating the same
A semiconductor device with a WLP structure that enables the improvement of heat resistance. A dam layer which spreads over a PI film and an Si substrate for a chip is formed between the Si...
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7602054 |
Method of forming a molded array package device having an exposed tab and structure
In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab...
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7602052 |
Semiconductor device
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according...
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7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
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7598617 |
Stack package utilizing through vias and re-distribution lines
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof...
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7598603 |
Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7595553 |
Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
An advantage of the present invention is to suppress moisture infiltrating from a pad electrode portion from spreading over the surface of a wiring pattern and improve the reliability of a...
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7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a...
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7595220 |
Image sensor package and fabrication method thereof
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
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7592688 |
Semiconductor package
A multi-chip semiconductor package that includes two power semiconductor devices arranged in a half-bridge configuration between two opposing circuit boards.
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7589787 |
Solid state image sensing device
Each of a pair of power supply electric lines ( 11 and 12 ) connected to power supply pads of a solid state image sensor ( 1 ) and a pair of power supply electric lines ( 13 and 14 ) connected...
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7589405 |
Memory cards and method of fabricating the memory cards
Provided are a memory card and a method of fabricating the memory card. The memory card includes: a printed circuit board including conductive wires exposed to at least a portion of an outer wall...
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7589282 |
Wiring board and a semiconductor device using the same
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being...
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7586193 |
Mm-wave antenna using conventional IC packaging
An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad...
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7586180 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7583511 |
Semiconductor die package with internal bypass capacitors
Embodiments of the present invention provide a computer system that reduces voltage noise for a processor chip. The computer system includes a package which is configured to be sandwiched between...
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7582959 |
Driver module structure with flexible circuit board
A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
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7582958 |
Semiconductor package
A semiconductor package which includes a plurality of leads embedded in a ceramic body, a semiconductor device electrically coupled to the leads, and a molded housing encapsulating at least the...
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7582952 |
Method for providing and removing discharging interconnect for chip-on-glass output leads and structures thereof
Microelectronic devices may be fabricated while being protected from damage by electrostatic discharge. In one embodiment, a shorting circuit is connected to elements of the microelectronic device,...
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7579683 |
Memory interface optimized for stacked configurations
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that...
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7579682 |
Power semiconductor module
A power semiconductor module has a ceramic substrate ( 9 ) which has on at least one side a patterned metallization ( 50 ) with a fineness of pattern of smaller than or equal to 800 μm, a first...
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7579681 |
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of fabricating the die packages on a wafer...
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7579678 |
Semiconductor microphone unit
A semiconductor microphone unit includes a semiconductor microphone chip having a diaphragm covering an inner hole of a support. The support is adhered onto the surface of a support substrate whose...
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7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave
A semiconductor light emitting device of the present invention includes a plurality of light emitting elements, a package body for storing the light emitting elements, wiring patterns being...
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7576429 |
Packaged semiconductor device with dual exposed surfaces and method of manufacturing
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite...
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7576422 |
Semiconductor device
The present invention enhances the reliability of a semiconductor device. The semiconductor device includes a package substrate having a dry resist film which covers some conductive portions out of...
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7576420 |
Semiconductor integrated circuit device having reduced terminals and I/O area
In a semiconductor integrated circuit device including a semiconductor integrated circuit board having a mask ROM area and an internal bus and a programmable ROM which is mounted on the...
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7576419 |
Semiconductor device
A semiconductor device has an IC chip main body including a power transistor and a substrate of BGA type including an insulating substrate. A plurality of external electrodes are formed on a...
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7573125 |
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One such device can include a first support member, a second...
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7569933 |
Housing for accommodating microwave devices having an insulating cup member
A housing for accommodating a microwave device having an insulating cup member.
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7569922 |
Semiconductor device having a bonding wire and method for manufacturing the same
A semiconductor device includes: a first semiconductor chip face-down mounted on a substrate; a second semiconductor chip face-up mounted on the first semiconductor chip; an electromagnetic...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7569919 |
Multi-chip package for reducing test time
A multi-chip package is provided. The multi-chip package includes semiconductor chips. The multi-chip package receives selection signals for selecting two or more chips in response to the selection...
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7567599 |
Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same
A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically...
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7566963 |
Stacked assembly of semiconductor packages with fastening lead-cut ends of leadframe
A stacked assembly of semiconductor packages primarily comprises a plurality of stacked semiconductor packages. Each semiconductor package includes an encapsulant, at least a chip, and a plurality...
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