Matches 351 - 400 out of 1441 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
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7235869 Integrated circuit package having a resistant layer for stopping flowed glue  
An integrated circuit package comprises a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface. The lower surface is formed...
7235880 IC package with power and signal lines on opposing sides  
A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect...
7235873 Protective device for subassemblies and method for producing a protective device  
A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a...
7233057 Integrated circuit package with optimized mold shape  
The invention relates to an integrated circuit package, in particular an integrated chip size package or an integrated chip scale package, comprising a substrate carrying a die, and connection...
7230317 Capacitor placement for integrated circuit packages  
A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the...
7230324 Strobe light control circuit and IGBT device  
As external connection terminals for an emitter electrode ( 12 ) of an IGBT chip, a first emitter terminal ( 151 ) for electrically connecting a light emitter in a strobe light control circuit to...
7230326 Semiconductor device and wire bonding chip size package therefor  
A semiconductor device incorporated in a wire bonding chip size package (WBCSP) is designed such that a plurality of pads are formed on the surface of a semiconductor substrate and are connected to...
7227246 Matching circuits on optoelectronic devices  
An apparatus comprises a first substrate and a second substrate. The first substrate includes an optoelectronic device and a matching circuit. The second substrate includes a driver circuit. A...
7227248 Stacked land grid array package  
A spring plate may be provided between a bolster plate and a board in order to mount components on the opposite side of the board. In some embodiments, the spring plate may provide additional stack...
7227247 IC package with signal land pads  
In one embodiment, an integrated circuit package comprises a substrate including a first surface having a plurality of signal land pads and a second surface having a plurality of signal die pads; a...
7227575 Linear image sensor chip and linear image sensor  
A linear image sensor chip is manufactured by forming an image pickup section, peripheral circuit sections, a plurality of bonding pads, and a light-suppressing layer on a semiconductor substrate...
7224048 Flip chip ball grid array package  
A flip-chip ball grid array integrated circuit package with improved thermo-mechanical properties is provided. The package includes a substrate having first and second surfaces and a plurality of...
7224050 Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging  
Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched...
7221043 Integrated circuit carrier with recesses  
An integrated circuit carrier includes a wafer having a receiving zone. The receiving zone is demarcated by a bore in the wafer. A plurality of island-defining portions is arranged about the...
7218007 Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices  
An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a...
7217992 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device  
Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are...
7215032 Triaxial through-chip connection  
A method performed on a wafer having multiple chips, each including a doped semiconductor and substrate, involves etching an annulus trench partially into the substrate, metalizing an inner and...
7215009 Expansion plane for PQFP/TQFP IR—package design  
Provided is a lead frame package with an expansion plane to minimize electrical parasitics introduced into the semiconductor chip's electrical system (e.g., power delivery system, signal loops,...
7215013 Semiconductor device and semiconductor apparatus  
A semiconductor device comprises a bonding surface to be mounted with adhesive or solder on a mounting surface of a mounting member. One or more grooves are provided on the bonding surface that...
7216009 Machine vision systems for use with programmable material consolidation system and associated methods and structures  
Programmable material consolidation systems employing a machine vision system in combination with a 3-D printing system for accurately locating a position over a support element and optionally on a...
7211880 Photoelectric conversion apparatus and manufacturing method of same  
An image reading apparatus ( 10 ) includes a photoelectric conversion element formation substrate ( 4 ) having a plurality of photoelectric conversion elements ( 2 ) on a reverse surface of an...
7211881 Structure for containing desiccant  
A hermetically sealed area includes a substrate having microelectronics thereon. A desiccant is operatively disposed within the hermetically sealed area. An equipotential region is substantially...
7211883 Semiconductor chip package  
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state...
7211882 LED package structure and method for making the same  
An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative...
7211887 connection arrangement for micro lead frame plastic packages  
A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad...
7205613 Insulating substrate for IC packages having integral ESD protection  
An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed
7205574 Optical semiconductor device  
An integral-detem-type optical semiconductor device employing lead frame(s) 11 , shield case region(s) 111 created by bending portion(s) of lead frame(s) 11 extending to the exterior being...
7205647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages  
A semiconductor multi-package module having a second package stacked over a lower ball grid array first package, each package including a die attached to a substrate, in which the first and second...
7202560 Wafer bonding of micro-electro mechanical systems to active circuitry  
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS...
7202545 Memory module and method for operating a memory module  
A memory module has an electronic printed circuit board and a plurality of semiconductor memory chips. A series circuit of the semiconductor memory chips is formed with the aid of two leads that...
7199462 Substrate for producing semiconductor packages  
A parent or master substrate for a semiconductor package is provided, which can provide a plurality of unit substrates by cutting into pieces for producing a semiconductor device. The parent...
7196424 Semiconductor device  
A semiconductor device with a packaging circuit portion connected to a semiconductor chip therein. The semiconductor chip includes a plurality of pad electrodes, and the packaging circuit portion...
7196405 Silicon package with integral heater  
A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. A metallic layer of...
7196359 Radiation-emitting chip and radiation-emitting component  
A radiation-emitting chip ( 2 ) with a radiation-transmissive window ( 5 ), which has a refractive index n F and has a main area ( 19 ), with a multilayer structure ( 9 ), which contains a...
7196411 Heat dissipation for chip-on-chip IC packages  
Disclosed herein are IC package devices and related methods of manufacturing. In one embodiment, an package device includes first and second package substrates, and a first IC chip having at least...
7193303 Supporting frame for surface-mount diode package  
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame...
7193302 Leadless semiconductor package  
A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The lead frame includes a chip paddle and a...
7193304 Memory card structure  
A memory card structure comprising a substrate, a plurality of memory chips, some molding compound and an ultra-thin plastic shell is provided. To fabricate the memory card, a substrate having a...
7193328 Semiconductor device  
Provided is a semiconductor device which prevents displacement of a semiconductor element and a wiring pattern of a wiring substrate so as to ensure the connection of the semiconductor element and...
7193311 Multi-chip circuit module and method for producing the same  
A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A...
7190061 stack package made of chip scale packages  
A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the...
7190057 Packaging component and semiconductor package  
A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion...
7190058 Spacer die structure and method for attaching  
A semiconductor spacer structure comprises in order a backgrinding tape layer, a spacer adhesive layer, a semiconductor spacer layer, an optional second spacer adhesive layer, a dicing tape layer....
7187066 Radiant energy heating for die attach  
Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.
7187074 Semiconductor and electronic device with spring terminal  
A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member,...
7186629 Protecting thin semiconductor wafers during back-grinding in high-volume production  
A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer...
7183617 Magnetic shielding for magnetically sensitive semiconductor devices  
A magnetic shielding device is provided for protecting at least one magnetically sensitive component on a substrate according to embodiments of the present invention. The device comprises a first...
7183132 Semiconductor device in a recess of a semiconductor plate  
A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the...
7183636 Adapter for a chip card having a reduced format in comparison with the standard SIM mini-card format  
An adapter for a portable integrated circuit device of the chip card variety has a reduced format in comparison with the standard mini-card format. The device with a reduced format includes a body...
7183633 Optical cross-connect system  
An optical cross-connect switch comprises a base ( 216 ), a flap ( 211 ) and one or more electrically conductive landing pads ( 222 ) connected to the flap ( 211 ). The flap ( 211 ) has a bottom...
Matches 351 - 400 out of 1441 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >