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7364941 |
Circuit device manufacturing method
A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto...
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7364778 |
Container for an electronic component
A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage...
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7361980 |
Semiconductor device
A semiconductor device comprises a semiconductor chip in which a circuit part provided in a center of the semiconductor chip is connected with power-supply lines and power-supply electrodes to...
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7361979 |
Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates
A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the...
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7361981 |
Pad layout
A pad layout suitable for being applied on a metal interconnection structure of an integrated circuit chip is provided. The pad layout includes a first signal pad, a second signal pad, a first...
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7358604 |
Multichip circuit module and method for the production thereof
A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the...
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7357017 |
Wafer level capped sensor
A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion....
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7358607 |
Substrates and systems to minimize signal path discontinuities
Arrangements are used for minimizing signal path discontinuities.
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7358599 |
Optical semiconductor device having a lead frame and electronic equipment using same
An optical semiconductor device 1 a includes a lead frame 4 having an aperture 7 , a submount 8 disposed on one surface of the lead frame 4 to close the aperture 7 , a semiconductor...
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7352056 |
Semiconductor package structure with microstrip antennan
A semiconductor package structure with a microstrip antenna comprises a packaging substrate, a chip and a microstrip radiation device. The packaging substrate has an upper surface having a...
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7352010 |
Photoelectric conversion module with cooling function
A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the...
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7348661 |
Array capacitor apparatuses to filter input/output signal
An apparatus for filtering noise from an input/output (I/O) signal is disclosed. In various embodiments, the apparatus may be an array capacitor, and may be disposed between an electronic package...
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7348666 |
Chip-to-chip trench circuit structure
A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the...
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7348604 |
Light-emitting module
The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled...
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7345360 |
Multiple chips image sensor package
A multi-chip image sensor module includes a first substrate; a photosensitive chip arranged on an upper surface of the first substrate; a lens holder mounted on the upper surface of the first...
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7344919 |
Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener
A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of...
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7345362 |
Electronic component and method for manufacturing the same
An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall...
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7345359 |
Integrated circuit package with chip-side signal connections
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
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7342300 |
Integrated circuit incorporating wire bond inductance
The invention relates to the field of electronics, more particularly to the wire bonds incorporated into an integrated circuit package such as a quad flat pack, a ball grid array or hybrid style...
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7341888 |
Balance filter packaging chip having balun mounted therein and manufacturing method thereof
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter...
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7342298 |
Metal lid with improved adhesion to package substrate
A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip,...
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7339262 |
Tape circuit substrate and semiconductor apparatus employing the same
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a...
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7339796 |
Electrical circuit having a multilayer printed circuit board
An electrical circuit includes a multilayer printed circuit board and a housing which shields against electromagnetic interference. A portion of at least one outer layer of the printed circuit...
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7339263 |
Integrated circuit packages, systems, and methods
An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die...
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7335970 |
Semiconductor device having a chip-size package
Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a...
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7335985 |
Method and system for electrically coupling a chip to chip package
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals....
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7332701 |
Dual-mode CMOS imaging sensor with supporting LED
The present invention relates to a sensor device for sensing an image of an object, wherein a detection means ( 14 ) for detecting radiation received from the object is supported by a...
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7332797 |
Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
The specification discloses an apparatus comprising a die mounted on a substrate, the die being connected to the substrate by a plurality of wires, and a mold cap encapsulating the die and the...
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7327019 |
Semiconductor device of a charge storage type
According to the present invention, a gettering layer is deposited both on the side surfaces and the bottom surface of a semiconductor chip. The semiconductor chip is then mounted on the board of a...
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7327023 |
Semiconductor component with plastic housing, and process for producing the same
A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged...
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7327006 |
Semiconductor package
A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on...
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7327018 |
Chip package structure, package substrate and manufacturing method thereof
A package substrate for carrying a chip with a plurality of bumps thereon is provided. The package substrate includes a first substrate, and an interposer. The first substrate has a first circuit...
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7323358 |
Method and system for sizing a load plate
A method of sizing a load plate for an Application Specific Integrated Circuit (ASIC) assembly includes compressing the load plate prior to installation in the ASIC assembly. The compression is...
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7322100 |
Method for producing a micromachined layered device
Methods for producing micromachined layered devices having a membrane layer and a first and second layer on both sides of the membrane layer are disclosed. The method includes applying a membrane...
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7323704 |
Chip type led
A chip type LED which is capable of laterally emitting light from the light emitting diode chip and having a relatively small thickness is provided. The chip type LED includes an insulating...
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7323768 |
Voltage contrast monitor for integrated circuit defects
A semiconductor chip is provided which includes active and inactive IP cores. The spaces on the metal layer associated with the inactive IP cores includes voltage contrast inspection structures....
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7320738 |
Method for encapsulation of a chip card and module obtained thus
Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the...
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7319553 |
Optical modulator module package structure
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip...
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7317199 |
Circuit device
To provide a circuit device suitable for incorporating a semiconductor element emitting or receiving short-wavelength light. The circuit device includes a casing, a semiconductor element, and a...
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7312517 |
System-in-package type semiconductor device
A system-in-package type semiconductor device includes a plurality of semiconductor chips, a first semiconductor chip 1110 to which electric power is supplied from first power supply wiring 1111...
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7312524 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
A method for fabricating a thermally stable ultralow dielectric constant film including Si, C, O and H atoms in a parallel plate chemical vapor deposition process utilizing a plasma enhanced...
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7310175 |
MEMS device and method of forming MEMS device
A method of forming a MEMS device includes depositing a conductive material on a substructure, forming a first sacrificial layer over the conductive material, including forming a substantially...
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7309912 |
On-package edge-mount power decoupling and implementation with novel substrate design for FPGA and ASIC devices
A package substrate is provided with a side/edge-mounted decoupling capacitor that can provide substantially instant power or control simultaneous switching noise (SSN) associated with a...
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7309919 |
Sealing apparatus for semiconductor wafer, mold of sealing apparatus, and semiconductor wafer
A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the...
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7307285 |
Optical semiconductor device and a method for manufacturing the same
An optical semiconductor device includes a first set of lead frames having a first set of element mounting beds, a second set of lead frames having a second set of element mounting beds, which are...
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7307341 |
Integrated packaged having magnetic components
A packaged device is obtained using an innovative package approach that allows integration of miniature planar magnetics into standard low-cost semiconductor packages (BGA, PDIP, SOIC, etc.) with...
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7304394 |
Semiconductor device and method for manufacturing same
A wiring pattern is provided on an insulating tape. Part of the wiring pattern is a connection section. An insulating resin is provided so that the connection section is coated with the insulating...
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7304377 |
Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
On a piezoelectric substrate 23 , there are provided surface acoustic wave devices F 1 and F 2 in which predetermined circuit patterns are formed, and a package substrate 11 comprising side...
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7304372 |
Semiconductor package
A semiconductor package including a bidirectional compound semiconductor component and two power semiconductor devices connected in a cascode configuration.
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7304393 |
System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
A technique is provided for communicatively coupling internal circuitry (e.g., a resonant tank) of an integrated circuit (“IC”) with pins of the IC's package in a manner that minimizes the...
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