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Document Title |
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7473989 |
Flip-chip package
A flip-chip package comprises a substrate with an opening. A dummy die is disposed onto the substrate corresponding to the opening so as to form a composite chip carrier with a chip cavity. The...
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7470980 |
Apparatus and method for manufacturing a display device substrate
An apparatus and method for manufacturing a display device substrate are provided. In one embodiment, the apparatus comprises a clamp for clamping an edge of a plastic substrate, and a tension...
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7470983 |
Semiconductor device reducing warping due to heat production
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between...
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7470939 |
Semiconductor device
A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an...
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7470998 |
Semiconductor device and method of manufacturing the same
The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an...
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7468550 |
High-performance semiconductor package
A high-speed and high-performance semiconductor package reduces degradation of chip characteristics when chips are packaged. The semiconductor package includes a semiconductor chip including a...
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7468549 |
Method for producing a package for an electronic circuit and a substrate for a package
The invention relates a substrate for a package for an electronic circuit and methods for packaging an electronic circuit with a substrate. The substrate comprises at least one conduction region...
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7466017 |
Laser apparatus and method for assembling the same
A laser apparatus includes: one or more semiconductor lasers emitting one or more laser beams; an optical fiber; an optical condensing system which makes the one or more laser beams enter the...
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7464603 |
Sensor component with a cavity housing and a sensor chip and method for producing the same
A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of...
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7462927 |
Pattern film forming method and pattern film forming apparatus
A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a...
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7462928 |
Semiconductor apparatus
A semiconductor apparatus according to the present invention comprises a support member that has a recessed portion, one pair of positive and negative conductive wiring members that are provided on...
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7459782 |
Stiffener for flip chip BGA package
Provided are semiconductor die flip chip packages with warpage control and fabrication methods for such packages. A package includes a heat spreader that is attached to a die and a stiffener, which...
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7459783 |
Light emitting chip package and light source module
A light emitting chip package having a carrier, at least one light emitting chip and a thermal enhanced cover is provided. The carrier includes a plurality of through holes. The light emitting chip...
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7459838 |
Plasma display device, TCP applied thereto, and method of manufacturing the TCP
A plasma display device includes a plasma display panel, a chassis base coupled to the plasma display panel, a drive circuit coupled to the chassis base, a flexible printed circuit (FPC) couples...
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7457337 |
Optical module having case grounding using bypass capacitor
According to embodiments of the present invention, an optical transponder includes a transmitter optical subassembly (TOSA). In one embodiment, the electrical ground of the TOSA may be DC-isolated...
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7456497 |
Electronic devices and its production methods
An electronic device having mounted thereon an MEMS element or other functional elements, in which a device body and lid define an element-carrying space, the element-carrying space is sealed...
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7453141 |
Semiconductor device package, method of manufacturing the same, and semiconductor device
A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board which has at least one of a ground plane and a power plane; at...
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7449781 |
Printed wiring board
A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158...
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7446406 |
Circuit device and manufacturing method thereof
A circuit device includes a ceramic substrate, an Al wiring layer provided on the ceramic substrate, and a semiconductor device and a bus bar which are electrically connected to the wiring layer....
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7446401 |
Structure of power semiconductor with twin metal and ceramic plates
A designing for a power semiconductor, and especially to a structure of a power semiconductor formed by using the basic materials including two metal plates and a ceramic plate, in the power...
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7443016 |
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are...
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7443002 |
Encapsulated microstructure and method of producing one such microstructure
A microstructure including in a first layer insulated from a substrate by an insulator layer at least one sensitive element connected to at least one contact pad by an electrical connection and...
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7435664 |
Wafer-level bonding for mechanically reinforced ultra-thin die
An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The...
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7436052 |
Repatterned integrated circuit chip package
A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection...
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7436051 |
Component for fabricating an electronic device and method of fabricating an electronic device
A component for fabricating the electronic device comprises a substrate and a conductive film provided on the substrate, in which the adhesion of the conductive film to the substrate is not greater...
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7436050 |
Semiconductor device having a flexible printed circuit
To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a...
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7432586 |
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
An apparatus and method for enhancing thermal performance and electromagnetic interference (EMI) shielding in die-up array integrated circuit (IC) device packages is presented. A die-up array...
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7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from...
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7429497 |
Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor
A hybrid electronic circuit package ( 102, FIG. 1 ) includes non-insertable conductive features ( 110 ) and insertable conductive features ( 112 ) at a surface of the package. A hybrid receptacle...
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7429783 |
Image sensor package
An image sensor package includes a substrate, a lens module and a bottom cover. Herein the substrate has an upper surface and a lower surface, a plurality of passive components is fabricated on the...
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7429782 |
Semiconductor stack block comprising semiconductor chips and methods for producing the same
A semiconductor stack block contains either stacked semiconductor chip size semiconductor devices or semiconductor devices with semiconductor chips in a plastic housing composition, the...
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7429784 |
Package structure
A package structure is provided herein. The package structure includes a first substrate and a second substrate. A first seal ring having a first height is disposed around a predetermined area of...
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7430359 |
Micromechanical system containing a microfluidic lubricant channel
Embodiments of the present invention generally relate to a electromechanical device that has an improved usable lifetime due to the presence of one or more channels that contain and deliver a...
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7429793 |
Semiconductor device having an electronic circuit disposed therein
A semiconductor device and a fabrication method thereof are provided. A semiconductor device which is packaged as it includes a semiconductor in which an electronic circuit is disposed, the...
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7429798 |
Integrated circuit package-in-package system
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first...
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7427804 |
Optoelectronic semiconductor device and light signal input/output device
A optoelectronic semiconductor device, mountable on and electrically connectable to an electro-optical wiring board, a substrate thereof having a light input/output through-hole and electric...
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7427807 |
Chip heat dissipation structure and manufacturing method
This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central...
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7428255 |
Semiconductor laser
A semiconductor laser is constituted by a die pad and a plurality of leads formed by a plate-shaped lead frame that are integrally supported by a resin portion made of a mold resin, and a laser...
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7425763 |
Electronic circuit package
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor...
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7425757 |
Semiconductor power module
A semiconductor power module includes a filter element made of a magnetic material that can be exchanged as required, while providing a package having a compact size. The power module can be used...
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7423332 |
Vertical laminated electrical switch circuit
A vertical laminated electrical switch circuit includes a first, second, and third ceramic substrate positioned in juxtaposed relationship relative to each other. The circuit also includes a first...
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7423340 |
Semiconductor package free of substrate and fabrication method thereof
A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of...
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7421781 |
Method of forming a module component having a plurality of penetration holes
According to the invention, the method of manufacturing a module component comprises an inserting step of inserting a chip component in a first molding die; a primary molding step of filling the...
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7423339 |
Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board,...
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7420267 |
Image sensor assembly and method for fabricating the same
An assembly device of an image sensor chip is disclosed. A flexible circuit has a die-attached portion, a plurality of bendable portions, and a plurality of bonding portions where the bendable...
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7417327 |
IC chip package with cover
An IC (integrated circuit) chip package includes a substrate ( 2 ), a chip ( 3 ), a plurality of bonding wires ( 32 ), and a cover ( 5 ). The substrate has a top surface, a bottom surface, a...
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7417309 |
Circuit device and portable device with symmetrical arrangement
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
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7414304 |
Semiconductor device
A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating...
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7414269 |
Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier ( 1 ) and a reflector arrangement ( 2 ) disposed on said system...
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7410829 |
Method of fabricating a semiconductor chip package
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes...
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