|
Match
|
Document |
Document Title |
|
|
6849940 |
Integrated circuit package for the transfer of heat generated by the inte circuit and method of fabricating same
An integrated circuit package includes a first or active substrate and a second or passive substrate. The active substrate includes at least one circuit that generates heat during circuit...
|
|
|
6848178 |
Enhancement of current-carrying capacity of a multilayer circuit board
A multilayer circuit board, in which a plurality of insulating layers and a plurality of conductive layers, each of which includes a conductive pattern, have been laminated, includes an insulating...
|
|
|
6849953 |
Microelectronic assemblies with composite conductive elements
A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect...
|
|
|
6849951 |
Bypass capacitor solution for integrated circuit dice
A die having a bypass capacitor is stacked on another die having an active circuit. The active circuit draws a spike of current, for example, during a switching period of a voltage on its output...
|
|
|
6847100 |
High speed IC package configuration
Devices and methods are provided for reducing lead inductance in integrated circuit (IC) packages. An integrated circuit package configuration is provided for high speed applications where the...
|
|
|
6847107 |
Image forming apparatus with improved transfer efficiency
By causing the movement of charge from a toner to a latent image carrier, the amount of charge of the toner is lowered to an amount of charge suitable for facilitating the transfer of toner so as...
|
|
|
6844617 |
Packaging mold with electrostatic discharge protection
The present invention relates to a packaging mold with electrostatic discharge protection, comprising at least one recess for receiving at least one packaging substrate, the packaging substrate...
|
|
|
6841860 |
Flip-chip bonding structure and method for making the same
Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip...
|
|
|
6841861 |
MEMS package
A wafer-level packaging process for MEMS applications, and a MEMS package produced thereby, in which a SOI wafer is bonded to a MEMS wafer and the electrical feed-throughs are made through the SOI...
|
|
|
6838758 |
Package and method for making an underfilled integrated circuit
An integrated circuit package for use in flip-chip manufacturing has a surface having a depression for receiving a bumped die. The depression has disposed on its floor a plurality of cage pads. The...
|
|
|
6836005 |
Semiconductor device
A semiconductor device includes a semiconductor package, a substrate provided under the semiconductor package, a metal substrate provided on the semiconductor package, and a fixing member...
|
|
|
6835004 |
Opto-electronic component packaging
An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along...
|
|
|
6834658 |
PBGA singulated substrate for model melamine cleaning
An apparatus is provided to clean melamine deposits from tools and components that are used to form molds around and to therewith encapsulate BGA devices. The cleaning apparatus uses a dummy BGA...
|
|
|
6833611 |
Semiconductor device
A semiconductor device mainly comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of...
|
|
|
6833619 |
Thin profile semiconductor package which reduces warpage and damage during laser markings
A semiconductor package has a substrate comprising a resin layer of an approximate planar plate, a cavity passing through the resin layer vertically at a center area thereof, a plurality of...
|
|
|
6830960 |
Stress-relieving heatsink structure and method of attachment to an electronic package
A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as...
|
|
|
6831360 |
Semiconductor device having an elastic resin with a low modulus of elasticity
A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on...
|
|
|
6830955 |
Semiconductor package and method for manufacturing the same
A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an...
|
|
|
6828663 |
Method of packaging a device with a lead frame, and an apparatus formed therefrom
A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an...
|
|
|
6828664 |
Packaging substrate with electrostatic discharge protection
The present invention relates to a packaging substrate with electrostatic discharge protection. The packaging substrate is disposed in a recess of a mold and comprises an outer wall electrically...
|
|
|
6828674 |
Hermetically sealed microstructure package
A hermetically sealed wafer scale package for micro-electrical-mechanical systems devices. The package consists of a substrate wafer which contains a microstructure and a cap wafer which contains...
|
|
|
6828643 |
Bonding pads over input circuits
An integrated circuit having functional circuitry within a core portion of the integrated circuit. Input circuits are disposed on a first layer within a peripheral portion of the integrated...
|
|
|
6825550 |
Board-on-chip packages with conductive foil on the chip surface
The invention encompasses a board-on-chip package comprising an insulative substrate having circuitry thereon and an opening therethrough. A semiconductive-material-comprising die is adhered to the...
|
|
|
6825064 |
Multi-chip semiconductor package and fabrication method thereof
A multi-chip semiconductor package and a fabrication method thereof are provided. A substrate having an upper surface and a lower surface is prepared. At least a first chip is mounted on the upper...
|
|
|
6825551 |
Method for packaging a semiconductor chip containing sensors and resulting package
A method of producing a package ( 30 ) for a semiconductor die (or chip) including a semiconductor die ( 20 ) having one or more bond pads on the top surface for providing terminals for one or more...
|
|
|
6825122 |
Method for fabricating a patterned thin film and a micro device
An organic resin with an optical crosslinking agent therein is coated to form an organic resin layer over a resist mast and a patterned thin film, and crosslinked. Although some debris are formed...
|
|
|
6821822 |
Method of manufacturing semiconductor device, molding device for semiconductor device, and semiconductor device
A semiconductor assembly ( 10 ) in which a semiconductor chip ( 12 ) is secured to a die pad ( 14 ) is placed in a cavity ( 38 ). A support pin ( 42 ) which is able to enter into or be pulled out...
|
|
|
6822326 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
|
|
|
6821812 |
Structure and method for mounting a small sample in an opening in a larger substrate
A process and structure for mounting a small sample in an opening in a larger substrate by using an intermediate size structure, wherein the small sample is mounted in a small opening in the...
|
|
|
6818479 |
Highly moisture-sensitive electronic device element and method for fabrication
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a...
|
|
|
6818979 |
High-frequency semiconductor device
A high-frequency semiconductor device is provided with a ceramic substrate, an element group including semiconductor elements and passive components mounted onto a bottom portion of the ceramic...
|
|
|
6819000 |
High density area array solder microjoining interconnect structure and fabrication method
A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint...
|
|
|
6818975 |
ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE
The present invention provides a bump forming apparatus ( 101, 501 ) which can prevent charge appearance semiconductor substrates ( 201, 202 ) from pyroelectric breakdown and physical failures, a...
|
|
|
6815230 |
Control signal transmitting method with package power pin and related integrated circuit package structure
A method and a device are disclosed for transmitting a control signal to an option pad of an integrated circuit chip at its package level. The method includes the steps of: electrically isolating...
|
|
|
6815251 |
High density modularity for IC's
A high density multi-chip module and method for construction thereof, wherein a plurality of integrated circuit dice with at least one row of generally central bond pads is bonded in a staggered...
|
|
|
6815808 |
Hollow airtight semiconductor device package
The present invention comprises a first main face ( 22 a ) on the surface side of a substrate ( 21 a ). An island portion ( 26 ) is formed on the first main face ( 22 a ) and a semiconductor chip (...
|
|
|
6815695 |
Simplified reticle stage removal system for an electron beam system
A simplified reticle removal system used with an electron beam system. The simplified reticle removal system includes a reticle chamber having an angled opening and a maintenance panel removably or...
|
|
|
6812498 |
Multi-color light emitting diode package
Disclosed herein is a multi-color light emitting diode package. The multi-color light emitting diode package mounted thereon with at least three light emitting diodes comprises a substrate formed...
|
|
|
6813154 |
Reversible heat sink packaging assembly for an integrated circuit
A reversible heat sink packaging assembly ( 400 ) for integrated circuits is provided. The packaging assembly ( 400 ) includes a chip carrier ( 102 ) having an opening ( 104 ) formed therein and a...
|
|
|
6812060 |
Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards
The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 18 1 of a metal wiring 28 of each...
|
|
|
6809418 |
Integrated circuit package structure
A reliable new IC package structure comprises an IC package having a plurality fo grounding conductor plates provided around its surrounding, a first conductor plate for covering over the IC...
|
|
|
6809412 |
Packaging of MEMS devices using a thermoplastic
A microelectromechanical circuit includes a cover attached to a package substrate by a thermoplastic. A MEMS device is disposed between the cover and the packaging substrate. The thermoplastic is...
|
|
|
6809411 |
Low-inductance semiconductor components
In order to obtain a minimal leakage inductance in a semiconductor component, it is necessary to provide at least two adjacent switching elements whose load current connection elements which are...
|
|
|
6809410 |
Power semiconductor module
A power semiconductor module with a connection structure in which an electrode terminal whose one end is connected with an electric power semiconductor device which is resin sealed inside of the...
|
|
|
6806561 |
Electronic apparatus
An electronic apparatus of the present invention comprises an electronic circuit board; an electrically conductive casing for encasing the electronic circuit board; a semiconductor element module...
|
|
|
6806562 |
Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The...
|
|
|
6806583 |
Light source
A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the...
|
|
|
6803114 |
Manufacturing process for laminated cards with intermediate PETG layer
The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene...
|
|
|
6800934 |
Power module
A power module having a plurality of power devices arranged in parallel with each other and switched by gate signals with substantially equal electric potential. The power module includes: a...
|
|
|
6798051 |
Connection of packaged integrated memory chips to a printed circuit board
An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed...
|