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7034383 |
Electronic component and panel and method for producing the same
The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two...
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7034385 |
Topless semiconductor package
A semiconductor package which includes a die pad that is exposed through the top surface of its molded housing, a semiconductor die having one power electrode electrically and mechanically...
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7033664 |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
A crystalline substrate based device including a crystalline substrate having formed thereon a microstructure and at least one packaging layer which is formed over the microstructure and defines...
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7030494 |
Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof
A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on...
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7030477 |
Optical semiconductor device
A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front...
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7030508 |
Substrate for semiconductor package and wire bonding method using thereof
Disclosed is a substrate for semiconductor package and a wire bonding method using thereof. The substrate is provided with at least one reference mark on its surface to check a loading position and...
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7030475 |
Method and apparatus for forming a thin film
In a method of uniformly forming a thin film on a wafer and an apparatus of using the same, after supplying a first gas, a second gas and a third gas into a reaction chamber in which a wafer is...
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7030476 |
Rectifier diode device
Disclosed is a rectifier diode device. The rectifier diode device includes a conductive base, a semiconductor chip, a conductive lead and insulation resin. A trench and a post are formed in the...
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7030504 |
Sectional molding system
The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each...
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7026719 |
Semiconductor package with a heat spreader
A semiconductor package with a heat spreader is described, including a first chip, a second chip, a heat spreader and a substrate. The first chip has an active surface over which the second chip is...
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7026706 |
Method and packaging structure for optimizing warpage of flip chip organic packages
An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid...
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7023087 |
Integrated circuit carrier and method of manufacturing and integrated circuit
A process for manufacturing an integrated circuit including the steps of providing a chip carrier including a base, an inner well formed about the periphery of the base, and an outer well formed...
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7023077 |
Carrier with metal bumps for semiconductor die packages
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
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7023076 |
Multiple chip semiconductor packages
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active...
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7023084 |
Plastic packaging with high heat dissipation and method for the same
The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding...
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7023078 |
Packages for communication devices
A package for a communication device has a base member having a first end, a second end opposite the first end, and an interior space disposed between the first and second ends for accommodating a...
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7019390 |
Silicon nitride insulating substrate for power semiconductor module
An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality...
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7019391 |
NANO IC packaging
Systems and methods are disclosed to dissipate heat from a semiconductor substrate. A package for integrated circuit includes a chip having a plurality of chip pads adapted to receive the variety...
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7018864 |
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component
A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver...
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7015585 |
Packaged integrated circuit having wire bonds and method therefor
An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. The package substrate...
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7012323 |
Microelectronic assemblies incorporating inductors
Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example,...
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7009302 |
Micromachine package and method for manufacturing the same
A micromachine package includes a first chip, a second chip, a spacer ring, a plurality of bumps, a plurality of leads, and an encapsulant. The first chip has at least one moveable structure. The...
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7009285 |
Optoelectronic semiconductor component
An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip...
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7005740 |
Thick film millimeter wave transceiver module
A thick film millimeter wave transceiver module includes a base plate and a multi-layer substrate board having a plurality of layers of low temperature transfer tape received on the base plate. The...
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7007171 |
Method and apparatus for improved fold retention on a security enclosure
A method and apparatus for forming a security enclosure having improved fold retention. In particular, the enclosure is formed by folding a flexible tamper respondent cloth around an electronic...
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7006341 |
Multichip module and multichip shutdown method
In the multichip module and shutdown method thereof, there are provided a semiconductor chip for voltage regulation which shuts itself down at a first setup temperature and a semiconductor chip for...
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7005743 |
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
A semiconductor device able to maintain a bonding state between a bump and an electrode and having high reliability even under thermal stress, wherein a sealing resin is interposed to bond the...
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7005748 |
Flip chip interface circuit of a semiconductor memory device
A flip chip interface circuit for combining two identical semiconductor chips on upper and lower surfaces of an assembling lead frame into one flip chip package includes at least first and second...
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7002246 |
Chip package structure with dual heat sinks
A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink....
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7002803 |
Electronic product with heat radiating plate
An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame...
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7002282 |
Surface acoustic wave device and method of fabricating the same
A surface acoustic wave device includes a surface acoustic wave filter element having a piezoelectric substrate on which comb-like electrodes are formed, and a package having a first cavity in...
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7002245 |
Semiconductor package having conductive bumps on chip and method for fabricating the same
A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An...
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6998710 |
High-frequency device
A high-frequency device has a semiconductor substrate; a high-frequency circuit layer formed on the substrate and including a circuit element and a multilayer wiring layer; electrically conductive...
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6992378 |
Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC...
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6992898 |
Smart-card module with an anisotropically conductive substrate film
A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one...
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6989587 |
Semiconductor device and manufacturing the same
There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the...
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6989559 |
Discrete circuit component having fabrication stage clogged through-holes and process of making the same
A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole...
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6984867 |
Magnetic memory device
A magnetic memory device having a packaged magnetic memory chip is disclosed, which comprises a package structure including a magnetic memory chip, and a magnetic guide of a high-permeability...
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6984883 |
Semiconductor power module
An insulating substrate ( 17 ) includes a surface conductive layer ( 25 ) fixedly laminated on a surface of the plate-like semiconductor body ( 21 ) via a surface side fixing member ( 24, 26 ). The...
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6984885 |
Semiconductor device having densely stacked semiconductor chips
In a semiconductor chip having electrodes formed on the top surface, and electrodes or an insulation layer formed on the back surface, the top-surface electrodes are loop-connected with the...
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6982482 |
Packaging of solid state devices
A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the...
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6982479 |
Semiconductor package with leadframe inductors
A semiconductor device in which an inductance element formed in a resin package has stable characteristics, impedance matching is achieved easily, and the stability of high-frequency...
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6979895 |
Semiconductor assembly of stacked substrates and multiple semiconductor dice
A semiconductor package comprising multiple stacked substrates having flip-chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are...
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6979870 |
Semiconductor integrated circuit including CMOS logic gate
A semiconductor integrated circuit of an aspect of the present invention having a CMOS logic gate including a first MOS transistor of a first conductivity type and a second MOS transistor of a...
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6977431 |
Stackable semiconductor package and manufacturing method thereof
A stackable semiconductor package is disclosed that includes a semiconductor die coupled to a metal leadframe. The semiconductor die is coupled to a die pad and is electrically coupled to leads of...
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6977428 |
Semiconductor device adapted to remove noise from a signal
What is invented is a semiconductor device ( 10 ) comprising a pellet ( 12 ) having a ground electrode ( 18 ), an outside signal terminal ( 15 ) connected to the pellet ( 12 ), so as to receive...
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6975024 |
Hybrid integrated circuit device and manufacturing method thereof
In a manufacturing method of a hybrid integrated circuit device of the invention, transfer molding is carried put by positioning a curved surface formed in a back surface of the substrate on a...
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6970360 |
Tamper-proof enclosure for a circuit card
A tamper-proof enclosure for an electrical card, such as a high speed communications card, includes an enclosure in which the card is mounted. The enclosure has a wall with an opening, and a cup...
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6965281 |
FBAR, FBAR based duplexer device and manufacturing method thereof
Disclosed herein is a film bulk acoustic resonator (FBAR), an FBAR based duplexer device, and a manufacturing method thereof, which a plurality of sacrificial layer units are formed on a substrate...
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6965168 |
Micro-machined semiconductor package
A hermetic multi-layered ceramic semiconductor package for micro-machined semiconductor devices. The package has a substrate with top and bottom surfaces. A micro-machined semiconductor device is...
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