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7102209 |
Substrate for use in semiconductor manufacturing and method of making same
A lead-frame based substrate panel for use in semiconductor packaging is described. The substrate panel includes a lead-frame panel having at least one array of device areas. Each device area has a...
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7096568 |
Method of manufacturing a microcomponent assembly
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and...
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7099175 |
Semiconductor memory integrated circuit
In a semiconductor memory integrated circuit (IC), a plurality of first data IO pads, a plurality of address and instruction pads, and a plurality of second data IO/address pads, are arranged in...
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7095113 |
Semiconductor device with interlocking clip
A semiconductor device is provided having a single-piece clip that interlocks into a lead frame using one or more forks on the clip that mate with one or more corresponding slots in the lead frame....
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7095097 |
Integrated circuit device having reduced bow and method for making same
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The...
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7095100 |
Semiconductor device and method of making the same
A semiconductor device and a method of making a semiconductor device are provided, wherein the device includes a die-pad, a semiconductor chip and a sealing resin. The die-pad has a first surface...
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7095101 |
Supporting frame for surface-mount diode package
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame...
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7095116 |
Aluminum-free under bump metallization structure
An apparatus and method for providing aluminum free under bump metallization stacks in an integrated circuit device is disclosed. Included is the use of vias having substantially non-vertical...
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7091596 |
Semiconductor packages and leadframe assemblies
Semiconductor packages provide a leadframe for packages that are singulated with respective predetermined package body sizes. Individual mold caps are formed on the leadframe with mold cap...
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7091582 |
Electronic package with snap-on perimeter wall
A semiconductor device package comprises a perimeter wall snap fitted to a base having a semiconductor die mounted on the base. A lead is mounted on the opposite side of the die, and the die and a...
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7091584 |
Semiconductor package assembly and method for electrically isolating modules
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for...
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7091583 |
Method and structure for prevention leakage of substrate strip
The present invention provides a structure and a method for prevention leakage of a substrate strip. The substrate strip includes an edge portion and a plurality of units. A patterned metal layer...
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7087439 |
Method and apparatus for thermally assisted testing of integrated circuits
A system and method for thermally testing integrated circuits, comprising a temperature generation device located within the IC, configured with a primary purpose of affecting a temperature at the...
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7084496 |
Method and apparatus for providing optoelectronic communication with an electronic device
An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and...
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7084512 |
Circuit substrate and its manufacturing method
A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the...
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7084391 |
Image sensing module
An image sensing module includes a base with an image sensor and a lens assembly connected to the base. A plurality of inner legs are located on a stepped portion between the upper hole and a lower...
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7081661 |
High-frequency module and method for manufacturing the same
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal...
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7081660 |
Hermetic package with internal ground pads
An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical...
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7078789 |
Method of forming a metal film, semiconductor device and wiring board
A method of forming a metal film on the surface of a resin substrate by forming plating nuclei on a resin substrate through a step of catalyzing treatment, a step of accelerating treatment and,...
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7078790 |
Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At...
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7078795 |
High voltage module and method for producing same
A high-voltage module comprises a housing ( 9 ) which accommodates at least one structural component ( 4, 5 ) that is fastened on a metal-ceramics substrate from a ceramic layer ( 1 ) comprising a...
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7075175 |
Systems and methods for testing packaged dies
A main die and a stacked die are included in the same component package. A transmission gate ( 370 ) is implemented on the main die, and can be enabled to receive leakage current in a connection (...
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7075172 |
Lead-frame for semiconductor devices
A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and...
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7071569 |
Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection
An electrical package and manufacturing method thereof is provided. A high stiffness, high electrical conductivity, low coefficient of thermal expansion and high thermal conductivity support...
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7071544 |
Wafer level assembly package
A wafer level package mainly comprises a semiconductor wafer and a plurality of bonding pads disposed on the active surface of the wafer. It is characterized in that there is a protection layer...
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7067907 |
Semiconductor package having angulated interconnect surfaces
Improved electro-mechanical connections between a packaged semiconductor die ( 12 ) and a printed circuit board ( 60 ) with reduced standoff height and pitch are created by the use of a non-planar...
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7064423 |
IC module and IC card
Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a...
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7064003 |
Memory package
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated...
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7064421 |
Wire bonding package
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed...
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7061082 |
Semiconductor die with attached heat sink and transfer mold
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
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7061092 |
High-density modularity for ICS
A high-density multi-chip module and method for construction thereof, wherein a plurality of integrated circuit dice with at least one row of generally central bond pads is bonded in a staggered...
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7061106 |
Structure of image sensor module and a method for manufacturing of wafer level package
The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a...
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7061081 |
Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room...
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7053488 |
Micro-mirror package
A micro-mirror package comprising a substrate, a bottom substrate, a cover substrate, a semiconductor chip, a first adhesive, a second adhesive, a plurality of wires and a lid is provided. The...
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7053473 |
Compact integrated circuit package
A method for making a semiconductor device includes mounting a die on a die-mounting substrate, providing an interposer on the substrate, forming a conductive strip that is laid on the interposer...
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7053470 |
Multi-chip package having repairable embedded memories on a system chip with an EEPROM chip storing repair information
A die with embedded memory is packaged together in a same dual-chip package with an EEPROM die. Defects in the embedded memory can be repaired using redundant rows or columns. A built-in self-test...
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7054162 |
Security module system, apparatus and process
A system, method and apparatus for protecting circuit components from unauthorized access. The circuit components to be protected are disposed on a first layer of a substrate with a plurality of...
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7049689 |
Chip on glass package
A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom...
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7045884 |
Semiconductor device package
A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at...
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7045459 |
Thin film encapsulation of MEMS devices
A method of manufacturing a miniature electromechanical system (MEMS) device includes the steps of forming a moving member on a first substrate such that a first sacrificial layer is disposed...
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7045883 |
Thermally enhanced chip scale lead on chip semiconductor package and method of making same
A thermally enhanced, chip-scale, Lead-on Chip (“LOC”) semiconductor packages includes a substrate having a plurality of metal lead fingers in it. A semiconductor chip having an active surface...
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7042074 |
Power semiconductor module and method for producing it
A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with...
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7042082 |
Method and apparatus for a backsided and recessed optical package connection
A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer,...
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7042072 |
Semiconductor package and method of manufacturing the same which reduces warpage
A semiconductor package and method of producing the same has a semiconductor die having a first face and a second face. A coating material is coupled to the second face of the semiconductor die. A...
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7042073 |
Semiconductor device and manufacturing method thereof
Of three chips ( 2 A), ( 2 B), and ( 2 C) mounted on a main surface of a package substrate ( 1 ) in a multi-chip module (MCM), a chip ( 2 A) with a DRAM formed thereon and a chip ( 2 B) with a...
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7039263 |
Electrooptic assembly
An electrooptic assembly including a microelectronic package and an optical substrate, wherein the optical substrate includes a coupler and a waveguide. An electrooptic element is disposed to...
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7038257 |
System and method for providing scalability in an integrated circuit
The invention provides a system and method for providing scalability in an integrated circuit (IC) having a package coupled to a die through package balls. The die includes a plurality of...
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7038321 |
Method of attaching a flip chip device and circuit assembly formed thereby
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a...
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7034384 |
Integrated circuit adapted for ECO and FIB debug
An integrated circuit adapted for ECO and FIB debug comprises: a substrate, a spare cell, a top-layer output terminal pad and a top-layer output terminal pad. The spare cell is disposed in...
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7034373 |
Wide band cross point switch using MEMS technology
A multilayer switching assembly for switching high frequency signals has MEMS structures on a ceramic substrate having a top surface 500 , a bottom surface and a plurality of insulating layers (...
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