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9159687 Solder bump for ball grid array  
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width...
9041173 Semiconductor device  
A semiconductor device includes a first conduction type semiconductor substrate, a first conduction type semiconductor deposition layer, a trench, second conduction type wells, a JFET region, a...
9041172 Semiconductor device for restraining creep-age phenomenon and fabricating method thereof  
The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof....
9041171 Programmable interposer with conductive particles  
An exemplary implementation of the present disclosure includes a programmable interposer having top and bottom interface electrodes and conductive particles interspersed within the programmable...
9035437 Packaged device comprising non-integer lead pitches and method of manufacturing the same  
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package...
9035440 Integrated circuit packaging system with a lead and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent to the package paddle; depositing a lead conductive cap on the lead,...
9035441 Semiconductor device  
A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated...
9035435 Magnetically coupled galvanically isolated communication using lead frame  
An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within encapsulation. The lead frame includes a first conductor having a first...
9035439 Apparatus, system and method for use in mounting electronic elements  
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said...
9029891 Wiring substrate, light emitting device, and manufacturing method of wiring substrate  
There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first...
9029993 Semiconductor device including semiconductor chip mounted on lead frame  
A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section...
9029990 Integrated circuit package  
An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected...
9029992 Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe  
In one embodiment, a semiconductor device includes a leadframe structure. A semiconductor die is attached to a die pad. Land connect bars are spaced apart from the die pad and a plurality of lands...
9029903 Light emitting diode package and method of manufacturing the same  
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips,...
9029991 Semiconductor packages with reduced solder voiding  
An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the...
9029894 Lead frame for optical semiconductor device and optical semiconductor device using the same  
The present invention relates to a lead frame for an optical semiconductor device including: a lead frame having a first plate part and a second plate part disposed so as to oppose to the first...
9024420 Power quad flat no-lead (PQFN) package  
Some exemplary embodiments of a multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections have been disclosed. One...
9018744 Semiconductor device having a clip contact  
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main surface opposite to the first main...
9018746 Solder flow impeding feature on a lead frame  
One embodiment is directed towards a packaged chip including a lead frame. At least one chip is mounted on the lead frame. At least one edge the lead frame has a solder flow impeding feature...
9018743 Semiconductor device  
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is...
9018745 Method for manufacturing semiconductor device, and semiconductor device  
A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of...
9013028 Integrated circuit package and method of making  
An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one...
9012268 Leadless packages and method of manufacturing same  
Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently...
9013030 Leadframe, semiconductor package including a leadframe and method for producing a leadframe  
A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach...
9006869 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Light emitting device package
 
A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting...
9006872 Semiconductor chip package having via hole and semiconductor module thereof  
In one embodiment, a semiconductor chip package includes an insulation frame having an opening part formed in a center thereof and a via hole formed around the opening part; a semiconductor chip...
9006871 Semiconductor device and method of manufacturing the same  
A trench portion (trench) is formed at each of four corner portions of a chip bonding region having a quadrangular planar shape smaller than an outer-shape size of a die pad included in a...
9006889 Flip chip packages with improved thermal performance  
Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal...
9006874 Lead frame with grooved lead finger  
A lead finger of a lead frame has a number of channels or grooves in a portion of its top surface that provide a locking mechanism for securing a bond wire to the lead finger. The bond wire may be...
9006873 Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device  
A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first semiconductor chip in the first cavity...
9001527 Electronic package structure  
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive...
9000474 Wiring substrate, light emitting device, and manufacturing method of wiring substrate  
There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring...
9000571 Surface-mounting light emitting diode device and method for manufacturing the same  
An SMT LED device includes an LED and a circuit board carrying the LED. The circuit board has two copper pads thereon, each being provided with a solder on an inner later side thereof which faces...
9000570 Semiconductor device with corner tie bars  
A Quad Flat Pack (QFP) type semiconductor device includes four corner tie bars that, instead of being trimmed, are used for power and/or ground connections, and alternatively, to control mold flow...
8994157 Circuit system in a package  
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame...
8994156 Semiconductor device packages with solder joint enhancement elements  
Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements...
8994161 Semiconductor device package and methods for producing same  
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate...
8994160 Resin-encapsulated semiconductor device and method of manufacturing the same  
A resin-encapsulated semiconductor device includes: a semiconductor element mounted on a die pad portion; a plurality of lead portions disposed so that distal end parts thereof are opposed to the...
8994159 Semiconductor device and manufacturing method thereof  
To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8994046 Light emitting diode device for clamping electrically conductive element  
A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame....
8987875 Balanced stress assembly for semiconductor devices  
An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the...
8987878 Substrateless power device packages  
A substrate-less composite power semiconductor device may include a thin substrate and a top metal layer located on a top surface of the substrate. A total thickness of the substrate and the...
8987879 Semiconductor device including a contact clip having protrusions and manufacturing thereof  
A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first contact area and a second contact area....
8987880 Chip module and a method for manufacturing a chip module  
In various embodiments, a chip module may include a first chip; and a leadframe with a first leadframe area and a second leadframe area, wherein the first leadframe area is electrically insulated...
8987882 Semiconductor device  
A semiconductor device is reduced in size. The semiconductor device includes a die pad, a plurality of leads arranged around the die pad, a memory chip and a power source IC chip mounted over the...
8987883 Semiconductor package with multiple conductive clips  
One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad,...
8987881 Hybrid lead frame and ball grid array package  
A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled...
8981418 LED device with structure for precisely locating LEDs thereon and method for manufacturing the same  
An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs...
8981541 Quad flat semiconductor device with additional contacts  
A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically...