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7619307 |
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or...
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7618848 |
Integrated circuit package system with supported stacked die
An integrated circuit package system provides a leadframe having a short lead finger, a long lead finger, and a support bar. A first die is placed in the leadframe. An adhesive is attached to the...
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7618845 |
Fabrication of an integrated circuit package
A QFN integrated circuit is mounted on a leadframe having multiple lead lands and resin material encapsulates the integrated circuit leaving the lead lands exposed. Subsequently a sawing operation...
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7615853 |
Chip-stacked package structure having leadframe with multi-piece bus bar
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
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7615851 |
Integrated circuit package system
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
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7612457 |
Semiconductor device including a stress buffer
An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in...
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7612439 |
Semiconductor package having improved thermal performance
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
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7612438 |
Active matrix substrate with height control member
An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on...
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7612436 |
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support...
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7608916 |
Aluminum leadframes for semiconductor QFN/SON devices
A post-mold plated semiconductor device has an aluminum leadframe ( 105 ) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A...
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7608914 |
Integrated circuit package with electrically isolated leads
In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned...
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7605452 |
Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting...
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7605451 |
RF power transistor having an encapsulated chip package
In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes...
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7602053 |
Leadframe of a leadless flip-chip package and method for manufacturing the same
A leadframe of a leadless flip-chip package includes a plurality of inner leads, a nonconductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a...
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7602052 |
Semiconductor device
To prevent a semiconductor device which can be made to be small even though a big-sized chip is used and in which a MOSFET having a low on-resistance can be formed, a semiconductor device according...
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7602050 |
Integrated circuit packaging
The disclosure provides integrated circuit packages including a lead frame having multiple I/O pads positioned proximate to the lead frame perimeter around a central ground paddle, an integrated...
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7601560 |
Method for producing an electronic circuit
The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips ( 46 ) with essentially the same structure are mounted on a surface ( 13 )...
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7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
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7598600 |
Stackable power semiconductor package system
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate...
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7598598 |
Offset etched corner leads for semiconductor package
A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines...
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7595549 |
Surface mount semiconductor device
A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion...
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7595548 |
Physical quantity sensor and manufacturing method therefor
A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a...
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7595547 |
Semiconductor die package including cup-shaped leadframe
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the...
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7595468 |
Passive thermal solution for hand-held devices
The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal...
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7595226 |
Method of packaging an integrated circuit die
A structure ( 40 ) for holding an integrated circuit die ( 38 ) during packaging includes a support substrate ( 42 ), a release film ( 44 ) attached to the substrate ( 42 ), and a swelling agent (...
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7592636 |
Radiation-emitting semiconductor component and method for the production thereof
A radiation-emitting semiconductor component having a radiation-transmissive substrate ( 1 ), on the underside of which a radiation-generating layer ( 2 ) is arranged, in which the substrate ( 1 )...
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7589404 |
Semiconductor device
A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically...
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7589403 |
Lead structure for a semiconductor component and method for producing the same
A lead structure for a semiconductor component includes: external leads for external connections outside a plastic housing composition, internal leads for electrical connections within the plastic...
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7588999 |
Method of forming a leaded molded array package
In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals...
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7586178 |
Alternative flip chip in leaded molded package design and method for manufacture
A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the...
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7582958 |
Semiconductor package
A semiconductor package which includes a plurality of leads embedded in a ceramic body, a semiconductor device electrically coupled to the leads, and a molded housing encapsulating at least the...
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7582957 |
Integrated circuit package system with encapsulation lock
An integrated circuit package system is provided including forming a paddle having holes with a hole size in a range about tens to hundreds of micrometers, mounting a device over the paddle, and...
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7582953 |
Package structure with leadframe on offset chip-stacked structure
The present invention provides a package structure with lead-frame on stacked chips, comprising: a lead-frame, composed of a plurality of outer leads arranged in rows facing each other and a...
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7579677 |
Semiconductor device and method for manufacturing thereof
In a power semiconductor device, a joint between the power semiconductor element and frame plated with Ni is composed of a laminated structure comprising, from the power semiconductor element side,...
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7579676 |
Leadless leadframe implemented in a leadframe-based BGA package
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
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7576416 |
Chip package having with asymmetric molding and turbulent plate downset design
A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having...
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7575957 |
Leadless semiconductor package and method for manufacturing the same
A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner...
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7569918 |
Semiconductor package-on-package system including integrated passive components
A semiconductor system ( 300 ) has one or more packaged active subsystems ( 310, 330 ); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on...
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7566954 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages
In a bonding configuration for a semiconductor device package, the bonding angles of the bonding wires are maintained within acceptable limits, without causing an increase in the chip die size, and...
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7566159 |
Side-emitting LED package with improved heat dissipation
A light source and a method for making the same are disclosed. The light source includes a lead frame, an integrated circuit chip and a body. The lead frame has first and second sections. The first...
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7560311 |
Robust leaded molded packages and methods for forming the same
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach...
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7554210 |
Semiconductor device with semiconductor chip mounted in package
A semiconductor device including a semiconductor chip having first and second principal surfaces is disclosed. The semiconductor chip includes a first electrode formed on the first principal...
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7554183 |
Semiconductor device
A semiconductor device having a plurality of semiconductor chips mounted on lead frames is miniaturized by reducing its planar size and thickness. By disposing a rear surface of a first island and...
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7554182 |
Semiconductor device and package, and method of manufacturer therefor
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the...
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7554181 |
Semiconductor device with non-overlapping chip mounting sections
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
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7554180 |
Package having exposed integrated circuit device
A package ( 10 ) includes an integrated circuit device ( 12 ) having an electrically active surface ( 16 ) and an opposing backside surface ( 14 ). A dielectric molding resin ( 26 ) at least...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7550829 |
Electronic package and semiconductor device using the same
A package for an electronic component including a chip mounting area mounting a semiconductor chip in a hollow part of a metal plate and a plurality of connection electrodes to be connected to a...
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7550828 |
Leadframe package for MEMS microphone assembly
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic...
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7550827 |
Conductor frame for an electronic component and method for the production thereof
Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention...
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