Matches 1 - 50 out of 612 1 2 3 4 5 6 7 8 9 10 11 12 13 >
Match Document Document Title
7420216 Reflection type light-emitting diode device  
A reflection type light-emitting diode device of a kind capable of emitting rays of light to the outside after having been reflected by a reflecting surface includes a recessed casing ( 22 ) having...
7410830 Leadless plastic chip carrier and method of fabricating same  
A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe...
7408242 Carrier with reinforced leads that are to be connected to a chip  
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and...
7400029 LED illumination system  
The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This...
7382000 Semiconductor device  
A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3 . Connecting lead 4 has a thermally radiative...
7378732 Semiconductor package  
A plurality of semiconductor packages is collectively fabricated on a wafer in a batch process and the wafer is then diced to obtain discrete semiconductor packages. The semiconductor package is a...
7372146 Semiconductor module  
A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by...
7365923 Heat sink tab for optical sub-assembly  
The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The...
7361986 Heat stud for stacked chip package  
A semiconductor package assembly is presented. The assembly comprises a first chip and a second chip. The back surfaces of the first and the second chips are thermally attached through a die attach...
7361978 Laser diode packaging  
A laser diode package includes a heat sink, a laser diode, and an electrically nonconductive (i.e. insulative) substrate. The laser diode has an emitting surface and a reflective surface opposing...
7361940 Leadframe and packaged light emitting diode  
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced...
7342304 Semiconductor package with heat dissipating structure  
A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat...
7335534 Semiconductor component and method of manufacture  
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating...
7330353 Modular heat sink fin modules for CPU  
A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of...
7329949 Packaged microelectronic devices and methods for packaging microelectronic devices  
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a...
7327581 Circuit device  
A circuit device includes plural semiconductor circuit devices that are formed on independent substrates, respectively, and communicate with each other. Each of the semiconductor circuit devices...
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package  
An integrated circuit package is disclosed. The package comprises a plurality of leads, each lead having a first face and a second face opposite to the first face. The package also comprises a die...
7321161 LED package assembly with datum reference feature  
An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat...
7310238 Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board  
The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof. A thin film embedded capacitance...
7309911 Method and stacked memory structure for implementing enhanced cooling of memory devices  
A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is...
7304418 Light source apparatus with light-emitting chip which generates light and heat  
A light source apparatus includes a light emitting chip which generates light and heat when energized via a first electrode and a second electrode, wherein the first electrode is a base on which...
7298046 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7298028 Printed circuit board for thermal dissipation and electronic device using the same  
A printed circuit board (PCB) for a package substrate of a multi-package module (MPM). The PCB comprises a substrate and a heat sink thereon. The heat sink comprises a first portion under the...
7294912 Semiconductor device  
A semiconductor device is composed of a heat sink, an IC chip mounted and fixed on a specific face of the heat sink, a lead frame electrically connected to the IC chip and a sealing mold resin...
7288839 Apparatus and methods for cooling semiconductor integrated circuit package structures  
Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal...
7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device  
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
7259446 Heat sink packaging assembly for electronic components  
A packaging assembly ( 100 ) includes a plurality of dissimilar die ( 102, 104, 106 ) bonded to a base board ( 110 ) and ground coupled to a heat sink ( 108 ) through an opening ( 132 ). A mating...
7259445 Thermal enhanced package for block mold assembly  
A heat spreader ( 20 ) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor ( 24 ) is advantageously placed over a group of...
7254033 Method and apparatus for heat dissipation  
Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
7247932 Chip package with capacitor  
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor...
7247930 Power management integrated circuit  
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a power management die bonded to the CPU die in a three dimensional packaging layout.
7247929 Molded semiconductor device with heat conducting members  
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat...
7245022 Semiconductor module with improved interposer structure and method for forming the same  
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an...
7245004 Semiconductor device  
A semiconductor device mountable on a wiring board with the bottom surface being opposed to the wiring board including a semiconductor chip; a mold resin encapsulating the semiconductor chip; a...
7242028 Light emitting diode light source  
A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes...
7233056 Chip scale package with heat spreader  
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames....
7230320 Electronic circuit device with reduced breaking and cracking  
In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness...
7224057 Thermal enhance package with universal heat spreader  
A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically...
7224047 Semiconductor device package with reduced leakage  
A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of...
7221042 Leadframe designs for integrated circuit plastic packages  
The specification describes a plastic cavity package design for high power transistor packages in which the leadframe is formed of a composite of materials. This allows the portions of the...
7211891 Electronic heat pump device, laser component, optical pickup and electronic equipment  
There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device...
7208833 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate  
An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor...
7202561 Semiconductor package with heat dissipating structure and method of manufacturing the same  
A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a...
7200007 Power stack  
A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows....
7199454 Optoelectronic semiconductor component  
A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead...
7196427 Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element  
Two or more semiconductor packages are stacked with an intervening element that is positioned between within an area surrounded by conductive bumps of a bottom surface of the overlying package....
7196417 Method of manufacturing a low expansion material and semiconductor device using the low expansion material  
A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated...
7196416 Electronic device and method of manufacturing same  
The electronic device ( 100 ) is a chip-on-chip construction on a lead frame ( 10 ) comprising a heat sink ( 13 ) in an encapsulation ( 80 ). The first chip ( 20 ) and the second chip ( 30 ) are...
7196403 Semiconductor package with heat spreader  
A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a...
7183642 Electronic package with thermally-enhanced lid  
Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the...
Matches 1 - 50 out of 612 1 2 3 4 5 6 7 8 9 10 11 12 13 >