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Document Title |
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7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
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7605462 |
Universal substrate for a semiconductor device having selectively activated fuses
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses...
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7598608 |
Mounting substrate
There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and...
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7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
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7582959 |
Driver module structure with flexible circuit board
A driver module structure includes a flexible circuit board ( 2 ) provided with a wiring pattern ( 7 ), a semiconductor device mounted on the flexible circuit board ( 2 ), and an electrically...
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7582955 |
Semiconductor device manufacturing method and manufacturing apparatus
A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is...
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7576433 |
Semiconductor memory device and manufacturing method thereof
A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an...
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7569917 |
Semiconductor device
A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the...
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7566964 |
Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect...
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7554198 |
Flexible joint methodology to attach a die on an organic substrate
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic...
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7550830 |
Stacked semiconductor package having fan-out structure through wire bonding
Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
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7521779 |
Roughened printed circuit board
A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of...
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7521276 |
Compliant terminal mountings with vented spaces and methods
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
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7514779 |
Multilayer build-up wiring board
Mesh holes 35 a and 59 a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50...
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7514774 |
Stacked multi-chip package with EMI shielding
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each...
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7514768 |
Package structure for a semiconductor device incorporating enhanced solder bump structure
A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering...
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7508061 |
Three-dimensional semiconductor module having multi-sided ground block
The present invention relates to a three-dimensional semiconductor module having at least one unit semiconductor device connected to the outer-facing side surfaces of a multi-side ground block. The...
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7508054 |
Semiconductor device and a method of manufacturing the same
Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a...
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7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability
A leadframe with a structure made of a base metal ( 105 ), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The...
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7504715 |
Packaging of a microchip device
The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically...
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7485951 |
Modularized die stacking system and method
An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in...
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7474007 |
Semiconductor package
A semiconductor package of this invention achieves higher wiring densities and increases the degree of freedom of the wiring design. The semiconductor package includes a first substrate having...
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7473988 |
Wiring board construction including embedded ceramic capacitors(s)
A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic...
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7473987 |
Semiconductor device
According to the present invention, there is provided a semiconductor device comprising:
a current driver which is connected to a power supply terminal, and supplies a predetermined current;...
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7465651 |
Integrated circuit packages with reduced stress on die and associated methods
Mechanical stresses are reduced between an electronic component having relatively low fracture toughness and a substrate having relatively greater fracture toughness. In an embodiment, the...
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7459779 |
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package
Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output...
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7449770 |
Substrate with slot
The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each...
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7446398 |
Bump pattern design for flip chip semiconductor package
A bump pattern design for flip chip semiconductor packages includes a pattern of contact pads formed on a package substrate. Each contact pad is adapted to receive a corresponding solder bump from...
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7443013 |
Flexible substrate for package of die
The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active...
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7442968 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same
A chip on film (COF) package comprising a test pad for testing the electrical function of a semiconductor chip and a method for manufacturing same are provided. The COF package comprises a...
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7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus
A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps....
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7408244 |
Semiconductor package and stack arrangement thereof
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a...
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7408242 |
Carrier with reinforced leads that are to be connected to a chip
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and...
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7408204 |
Flip-chip packaging structure for light emitting diode and method thereof
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting...
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7393754 |
Tape carrier type semiconductor device and method of producing the same
A tape carrier type semiconductor device comprising: a long flexible insulating tape; and a plurality of semiconductor devices sequentially arranged on one surface of the tape, wherein each...
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7388293 |
Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor material and an interposer portion provided...
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7385283 |
Three dimensional integrated circuit and method of making the same
A three dimensional integrated circuit structure includes at least first and second devices, each device comprising a substrate and a device layer formed over the substrate, the first and second...
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7385281 |
Semiconductor integrated circuit device
A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an...
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7382042 |
COF flexible printed wiring board and method of producing the wiring board
The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, and which exhibits no drop in bonding strength during panel bonding...
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7378723 |
Method and apparatus for decoupling conductive portions of a microelectronic device package
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
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7372139 |
Semiconductor chip package
A semiconductor chip package may include a substrate, which may have bonding pads formed thereon. A semiconductor chip mounted on the substrate may have chip pads, and electrical connections for...
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7372131 |
Routing element for use in semiconductor device assemblies
A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than...
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7372130 |
Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device...
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7368805 |
Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal...
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7362491 |
Heated glass panels and methods for making electrical contact with electro-conductive films
A heated glass panel assembly according to one embodiment of the invention may include a substrate having an electro-conductive film provided thereon. A conductor is positioned in contact with the...
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7358602 |
Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer
A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor...
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7354795 |
Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates
Packaging and encapsulation methods include use of a tape substrate with a mold gate that includes an aperture and a support element that extends over at least a portion of the aperture. The tape...
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