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9035432 Component having through-hole plating, and method for its production  
A method for producing a component having a semiconductor substrate with through-hole plating is provided, the through-plating being surrounded by a recess, and the semiconductor substrate having...
9029992 Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe  
In one embodiment, a semiconductor device includes a leadframe structure. A semiconductor die is attached to a die pad. Land connect bars are spaced apart from the die pad and a plurality of lands...
9018537 Surface-mountable electronic device  
A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion....
9012947 Light emitting diode package and method of manufacturing the same  
A light emitting diode (LED) package is provided. According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate; a light emitting...
9006871 Semiconductor device and method of manufacturing the same  
A trench portion (trench) is formed at each of four corner portions of a chip bonding region having a quadrangular planar shape smaller than an outer-shape size of a die pad included in a...
8994155 Packaging devices, methods of manufacture thereof, and packaging methods  
Packaging devices, methods of manufacture thereof, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging device includes a substrate including an integrated...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8981548 Integrated circuit package system with relief  
An integrated circuit package system including: providing a die pad with a top, sides, and a bottom, the bottom having a relief with a flat surface and defining a wall and a center pad; mounting a...
8963188 Light emitting diode package and method of manufacturing the same  
A light emitting diode (LED) package is provided. The LED package includes a printed circuit board (PCB), an electrode pad, an LED, a wire, and first and second moldings. The electrode pad and the...
8956921 Method of molding semiconductor package  
A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid...
8952506 Through silicon via structure  
A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is...
8945992 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package  
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the...
8941223 MEMS device package with conductive shell  
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The...
8928157 Encapsulation techniques for leadless semiconductor packages  
An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a...
8921164 Semiconductor integrated device assembly process  
A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second...
8884413 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture  
A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the...
8872316 Manufacturing method of semiconductor device and semiconductor device  
To enhance the reliability of a semiconductor device. The semiconductor device includes die pads, over which a first semiconductor chip and a second semiconductor chip are mounted respectively, a...
8853730 Light emitting device and manufacturing method thereof  
A light emitting device comprises a substrate including a top surface that is flat, a light emitting diode on the substrate, a lead frame formed on the flat top surface of the substrate. The lead...
8852986 Integrated circuit package system employing resilient member mold system technology  
An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess...
8836091 Lead frame for semiconductor package with enhanced stress relief  
A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead...
8836092 Semiconductor device with thermal dissipation lead frame  
A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a...
8802508 Semiconductor device package  
Forming a packaged semiconductor device includes placing a semiconductor die attached to a carrier into a mold cavity having an injection port, wherein the semiconductor die has an encapsulant...
8796828 Compliant interconnects in wafers  
A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through...
8778739 Lead frame and method of manufacturing the same, and semiconductor device and method of manufacturing the same  
A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one...
8779565 Integrated circuit mounting system with paddle interlock and method of manufacture thereof  
A method of manufacture of an integrated circuit mounting system includes: providing a die paddle with a component side having a die mount area and a recess with more than one geometric shape;...
8754535 Semiconductor device with a semiconductor chip connected in a flip chip manner  
A semiconductor device (1,21) includes a solid state device (2,22), a semiconductor chip (3) that has a functional surface (3a) on which a functional element (4) is formed and that is bonded on a...
8749073 Wiring board, method of manufacturing the same, and semiconductor device  
A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the...
8742559 Manufacturing method of semiconductor device, and semiconductor device  
To suppress the reduction in reliability of a resin-sealed semiconductor device. A first cap (member) and a second cap (member) with a cavity (space formation portion) are superimposed and bonded...
8736042 Delamination resistant device package having raised bond surface and mold locking aperture  
A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe...
8729681 Package structure and LED package structure  
A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular...
8716847 Inserts for directing molding compound flow and semiconductor die assemblies  
Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected...
8680636 Package-type solid-state imaging apparatus with exhausting means  
A solid-state imaging apparatus is provided. A solid-state imaging device chip is enclosed in a package having an optically transparent member. An adhesive layer is formed on an internal surface...
8664752 Semiconductor die package and method for making the same  
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an...
8643156 Lead frame for assembling semiconductor device  
A lead frame has a flag, a peripheral frame, and main tie bars coupling the flag to the peripheral frame. At least one cross tie bar extends between two of the main tie bars and an inner row of...
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely  
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead...
8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof  
A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle...
8624364 Integrated circuit packaging system with encapsulation connector and method of manufacture thereof  
An integrated circuit packaging system includes: a base integrated circuit package having a base integrated circuit on a base substrate thereof; a base barrier on the base substrate adjacent a...
8587099 Leadframe having selective planishing  
A metal leadframe strip (500) for semiconductor devices is described. The leadframe strip has a plurality of sites (510) for assembling semiconductor chips. The sites alternate with zones (520)...
8575646 Creating an LED package with optical elements by using controlled wetting  
A method of producing a LED package through controlled wetting.
8575765 Semiconductor package having underfill agent dispersion  
A semiconductor package includes: a semiconductor element mounted on a one-sided plane of a wiring board; an underfill agent dropped so as to be filled between the semiconductor element and the...
8564107 Lead frame and method for manufacturing the same  
A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a...
8525307 Semiconductor device, lead frame assembly, and method for fabricating the same  
A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and...
8519521 Electronic device including a packaging substrate having a trench  
An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection...
8486733 Package having light-emitting element and fabrication method thereof  
A package having a light-emitting element includes a substrate having a light-emitting element disposed thereon, an insulating layer formed on the substrate and having an opening for exposing the...
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side...
8466009 Method of fabricating a semiconductor package with mold lock opening  
A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock...
8441127 Bump-on-trace structures with wide and narrow portions  
A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a...
8432025 Semiconductor device and plurality of dams  
The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side...
8426951 Multi-chip package having frame interposer  
A multi-chip package is provided. The multi-chip package may include a frame interposer, a first chip stack with n number of semiconductor chips on a first surface of the frame interposer, and a...
8420955 Lead pin for package substrate  
A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external...

Matches 1 - 50 out of 438 1 2 3 4 5 6 7 8 9 >