Matches 1 - 50 out of 1800 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
7619314 Integrated circuit package system including die stacking  
An integrated circuit package system includes providing a leadframe, forming an aperture within the leadframe, mounting an integrated circuit package over or under the aperture, and mounting a die...
7619307 Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package  
A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or...
7619303 Integrated circuit package  
An integrated circuit package is described that includes two dice. The active surface of each die includes a plurality of I/O pads. The active surface of the first die is positioned adjacent first...
7619302 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules  
Two DBC wafers have patterned first conductive surfaces which receive a semiconductor die in sandwich fashion. Lead frame terminally extending into the package interior and are connected to the die...
7615853 Chip-stacked package structure having leadframe with multi-piece bus bar  
The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing...
7615852 Semiconductor component in a housing with mechanically inforcing flat conductor webs  
The standard housing ( 27 ) of a semiconductor component ( 21 ), preferably a power semiconductor component features a plurality of external leads ( 1 - 5 ). Between adjacent external leads ( 2 - 3...
7615851 Integrated circuit package system  
An integrated circuit package system comprised by providing a leadframe including leads configured to provide electrical contact between an integrated circuit chip and an external electrical...
7612439 Semiconductor package having improved thermal performance  
A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation...
7612435 Method of packaging integrated circuits  
A method of packaging an integrated circuit die having a plurality of I/O pads is described. The method includes positioning the die within a die attach area of a first leadframe that includes a...
7612434 Electronic device having wiring substrate and lead frame  
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first...
7608914 Integrated circuit package with electrically isolated leads  
In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned...
7608482 Integrated circuit package with molded insulation  
A variety of improved arrangements and processes for packaging integrated circuits are described. More particularly, methods of encapsulating dice in lead frame based IC packages are described that...
7605451 RF power transistor having an encapsulated chip package  
In various embodiments, semiconductor components and methods to manufacture semiconductor components are disclosed. In one embodiment, a method to manufacture semiconductor components includes...
7602051 Thermally conductive resin sheet and power module using the same  
A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic...
7602050 Integrated circuit packaging  
The disclosure provides integrated circuit packages including a lead frame having multiple I/O pads positioned proximate to the lead frame perimeter around a central ground paddle, an integrated...
7598608 Mounting substrate  
There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and...
7598606 Integrated circuit package system with die and package combination  
An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and...
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device  
A primary side circuit and a secondary side circuit are provided on first and second semiconductor substrates, respectively. A first capacitive insulator on the first substrate electrically...
7598603 Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink  
An electronic component has at least one semiconductor power switch with at least one anode and at least one control electrode positioned on a first surface and at least one cathode positioned on a...
7598601 Current sensor  
An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one...
7598600 Stackable power semiconductor package system  
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate...
7598599 Semiconductor package system with substrate having different bondable heights at lead finger tips  
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead...
7598598 Offset etched corner leads for semiconductor package  
A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines...
7595551 Semiconductor package for a large die  
A semiconductor package is provided. A semiconductor package has a die pad and a plurality of bonding fingers. A spacer is attached to the die pad, and a large die is attached to the spacer. The...
7595548 Physical quantity sensor and manufacturing method therefor  
A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a...
7595226 Method of packaging an integrated circuit die  
A structure ( 40 ) for holding an integrated circuit die ( 38 ) during packaging includes a support substrate ( 42 ), a release film ( 44 ) attached to the substrate ( 42 ), and a swelling agent (...
7592694 Chip package and method of manufacturing the same  
A chip package including a metal layer, a film-like circuit layer, a chip, a lead matrix and an encapsulant is provided. The film-like circuit layer disposed on the metal layer includes an...
7589404 Semiconductor device  
A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically...
7589399 Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device  
A semiconductor chip 23 is mounted on an island section 22 in a lead frame composed of a lead having the island section 22 , a ground-bonding lead section 28 and a lead 21 a each...
7586180 Semiconductor packaging device comprising a semiconductor chip including a MOSFET  
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
7586178 Alternative flip chip in leaded molded package design and method for manufacture  
A semiconductor package is disclosed. The package includes a leadframe structure comprising a die attach region and plurality of leads. A molding material is molded around at least a portion of the...
7582963 Vertically integrated system-in-a-package  
According to one embodiment of the invention, a method of forming a system-in-a-package includes providing a first substrate, coupling a first die to a top surface of the first substrate, coupling...
7582958 Semiconductor package  
A semiconductor package which includes a plurality of leads embedded in a ceramic body, a semiconductor device electrically coupled to the leads, and a molded housing encapsulating at least the...
7582957 Integrated circuit package system with encapsulation lock  
An integrated circuit package system is provided including forming a paddle having holes with a hole size in a range about tens to hundreds of micrometers, mounting a device over the paddle, and...
7582956 Flip chip in leaded molded package and method of manufacture thereof  
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when...
7582954 Optical leadless leadframe package  
Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first...
7582953 Package structure with leadframe on offset chip-stacked structure  
The present invention provides a package structure with lead-frame on stacked chips, comprising: a lead-frame, composed of a plurality of outer leads arranged in rows facing each other and a...
7579697 Arrangement for high frequency application  
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on...
7579682 Power semiconductor module  
A power semiconductor module has a ceramic substrate ( 9 ) which has on at least one side a patterned metallization ( 50 ) with a fineness of pattern of smaller than or equal to 800 μm, a first...
7579676 Leadless leadframe implemented in a leadframe-based BGA package  
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
7579674 Semiconductor package configuration with improved lead portion arrangement  
A semiconductor device with improved reliability is provided. The semiconductor device in a QFN package configuration has a semiconductor chip mounted on a tab, leads which are alternately arranged...
7576440 Semiconductor chip having bond pads and multi-chip package  
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
7576416 Chip package having with asymmetric molding and turbulent plate downset design  
A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having...
7569920 Electronic component having at least one vertical semiconductor power transistor  
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
7564123 Semiconductor package with fastened leads  
A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a...
7564122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant  
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the...
7560804 Integrated circuit package and method of making the same  
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
7560743 Electro-optical device, method of manufacturing the same, and image forming apparatus  
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
7557451 Electro-optical device and electronic apparatus  
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
7557432 Thermally enhanced power semiconductor package system  
The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and...
Matches 1 - 50 out of 1800 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >