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9059385 Light emitting device package  
A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting...
9041170 Multi-level semiconductor package  
A semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a first lead under the semiconductor...
9041188 Axial semiconductor package  
An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact...
9041047 Organic light emitting diode display and method for manufacturing the same  
An exemplary embodiment described technology relates generally to an organic light emitting diode (OLED) display and a manufacturing method thereof. The organic light emitting diode (OLED) display...
9040356 Semiconductor including cup-shaped leadframe packaging techniques  
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the...
9035435 Magnetically coupled galvanically isolated communication using lead frame  
An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within encapsulation. The lead frame includes a first conductor having a first...
9035438 Semiconductor device and method for manufacturing same  
The present specification relates to a semiconductor device in which a metal plate is attached onto a surface of a resin package, and provides a structure in which the metal plate is not easy to...
9035436 Semiconductor device  
A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the...
9029993 Semiconductor device including semiconductor chip mounted on lead frame  
A semiconductor device includes a lead frame, a semiconductor chip, a substrate, a plurality of chip parts, a plurality of wires, and a resin member. The lead frame includes a chip mounted section...
9030006 Integrated circuit package system with internal stacking module  
An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a...
9030003 Encapsulated semiconductor device and method for manufacturing the same  
An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a...
9029990 Integrated circuit package  
An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected...
9029992 Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe  
In one embodiment, a semiconductor device includes a leadframe structure. A semiconductor die is attached to a die pad. Land connect bars are spaced apart from the die pad and a plurality of lands...
9024418 Local interconnect structures for high density  
A local interconnect structure is provided that includes a gate-directed local interconnect coupled to an adjacent gate layer through a diffusion-directed local interconnect.
9024419 Method of manufacturing semiconductor device  
A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having...
9018746 Solder flow impeding feature on a lead frame  
One embodiment is directed towards a packaged chip including a lead frame. At least one chip is mounted on the lead frame. At least one edge the lead frame has a solder flow impeding feature...
9018742 Electronic device and a method for fabricating an electronic device  
An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the...
9013047 Semiconductor device  
A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element...
9013029 Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same  
A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on...
9013028 Integrated circuit package and method of making  
An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one...
9012268 Leadless packages and method of manufacturing same  
Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently...
9013030 Leadframe, semiconductor package including a leadframe and method for producing a leadframe  
A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach...
9006869 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Light emitting device package
 
A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting...
9006871 Semiconductor device and method of manufacturing the same  
A trench portion (trench) is formed at each of four corner portions of a chip bonding region having a quadrangular planar shape smaller than an outer-shape size of a die pad included in a...
9006873 Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device  
A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first semiconductor chip in the first cavity...
9000574 Semiconductor device for battery power voltage control  
A voltage generated in any of a plurality of semiconductor chips is supplied to another chip as a power supply voltage to realize a stable operation of a semiconductor device in which the...
9000589 Semiconductor device with redistributed contacts  
A surface mount semiconductor device is assembled by positioning an array of semiconductor dies with an array of metallic ground plane members between and beside the semiconductor dies. The arrays...
9001527 Electronic package structure  
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive...
8994154 Proximity sensor having light blocking structure in leadframe  
A semiconductor proximity sensor (100) has a flat leadframe (110) with a first (110a) and a second (110b) surface, the second surface being solderable; the leadframe includes a first (111) and a...
8994157 Circuit system in a package  
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame...
8994161 Semiconductor device package and methods for producing same  
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate...
8994160 Resin-encapsulated semiconductor device and method of manufacturing the same  
A resin-encapsulated semiconductor device includes: a semiconductor element mounted on a die pad portion; a plurality of lead portions disposed so that distal end parts thereof are opposed to the...
8994158 Semiconductor packages having lead frames  
Semiconductor packages having lead frames include a lead frame, which supports a semiconductor chip and is electrically connected to the semiconductor chip by bonding wires, and a molding layer...
8994046 Light emitting diode device for clamping electrically conductive element  
A light emitting diode (LED) device comprises a first lead frame, a second lead frame, a LED die and at least one bump. The LED die is fixed on and electrically connected to the first lead frame....
8987853 Light emitting device and method of manufacturing the light emitting device  
A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose...
8987063 Manufacturing method of semiconductor device  
A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad...
8987873 Super integrated circuit chip semiconductor device  
The CP555 Super Integrated Circuit Chip has a ceramic package casing made from (B4-C) Boron Carbide: a non-conducting ceramic material. The IC is connected to connector pins by microcircuits and a...
8982561 Lightweight audio system for automotive applications and method  
A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio...
8980690 Lead frame based semiconductor device with routing substrate  
A semiconductor device including a lead frame, a routing substrate disposed within the lead frame, and an active component mounted on the routing substrate. The active component has a plurality of...
8981401 Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same  
The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead...
8975732 Semiconductor device and method of manufacturing the same  
According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other...
8975733 Semiconductor device and a manufacturing method thereof  
There is provided a technology enabling the improvement of the reliability of a semiconductor device manufactured by physically fixing separately formed chip mounting portion and lead frame. A...
8970019 Semiconductor device with sealed semiconductor chip  
A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame...
8969926 Vertical GaN JFET with low gate-drain capacitance and high gate-source capacitance  
An embodiment of a vertical power device includes a III-nitride substrate, a drift region coupled to the III-nitride substrate and comprising a III-nitride material of a first conductivity type,...
8969135 Semiconductor device and method of assembling same  
A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a...
8970020 Semiconductor device  
Provided is a semiconductor device which includes a bonding wire, one end of which is connected to a bipolar device, the other end of which is connected to a conductive member, and the center of...
8969985 Semiconductor chip package and method  
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed...
8963301 Integrated circuit package and method of making the same  
Packages for an integrated circuit die and methods and lead frames for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wares, and an...
8962395 QFN package and manufacturing process thereof  
The present invention provides a Quad Flat Non-leaded (QFN) package, which comprises a chip, a lead frame, a plurality of composite bumps and an encapsulant. The chip has a plurality of pads, and...
8963310 Low cost hybrid high density package  
A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element...