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7042730 |
Non-isolated heatsink(s) for power modules
A power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body.
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7042068 |
Leadframe and semiconductor package made using the leadframe
Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A...
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7038305 |
Package for integrated circuit die
An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a...
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7038315 |
Semiconductor chip package
A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating...
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7033865 |
Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator...
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7033517 |
Method of fabricating a leadless plastic chip carrier
A leadless plastic chip carrier is fabricated by partially etching at least a first surface of a leadframe strip to partially define a die attach pad, a plurality of contact pads disposed around...
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7033866 |
Method for making dual gauge leadframe
A leadframe ( 20 ) for a semiconductor device includes a first leadframe portion ( 12 ) having a perimeter that defines a cavity ( 16 ) and a plurality of leads ( 14 ) extending inwardly from the...
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7030474 |
Plastic integrated circuit package and method and leadframe for making the package
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
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7030473 |
Substrate-based IC package
The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the...
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7029256 |
Leadframe and method for removing cleaning compound flash from mold vents
An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally...
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7030489 |
Multi-chip module having bonding wires and method of fabricating the same
Provided herein are multi-chip modules (MCMs) having bonding wires and fabrication methods thereof. The multi-chip module includes a substrate and a plurality of chips sequentially stacked. At...
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7031170 |
Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip...
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7030471 |
Semiconductor package containing an integrated-circuit chip supported by electrical connection leads
Semiconductor package containing an integrated-circuit chip, characterized in that it comprises a leadframe formed from spaced-apart electrical connection leads ( 5 ), the integrated-chip being...
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7026192 |
Terminal land frame and method for manufacturing the same
A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude...
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7023074 |
Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based...
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7023075 |
Teardrop shaped lead frames
A lead frame for use in solid state relays has a teardrop shaped frame. The frame has a small rounded portion connected to a large rounded portion. A power semiconductor is mounted in the large...
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7023076 |
Multiple chip semiconductor packages
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active...
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7019389 |
Lead frame and semiconductor package with the same
A lead frame and a semiconductor package with the lead frame are provided. The lead frame includes a die pad for mounting at least one semiconductor chip thereon; at least one grounding portion...
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7019391 |
NANO IC packaging
Systems and methods are disclosed to dissipate heat from a semiconductor substrate. A package for integrated circuit includes a chip having a plurality of chip pads adapted to receive the variety...
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7019387 |
Lead-frame connector and circuit module assembly
A lead-frame connector and circuit module assembly allows fabrication of a pin-connector type circuit module without a circuit board substrate and discrete connector. One or more integrated circuit...
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7019388 |
Semiconductor device
It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by...
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7015587 |
Stacked die package for semiconductor devices
A stacked multi-chip package is described in which a base die is electrically connected to both an interconnect structure (e.g., a lead frame or a substrate) and a stacked die. A first encapsulant...
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7015575 |
LSI package
According to LSI packages of the BGA type and the like, the number of source voltage supply terminals on an LSI package needs to be around the same as the number of power supply terminals on an LSI...
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7012321 |
Stacked semiconductor device including improved lead frame arrangement
A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and...
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7008825 |
Leadframe strip having enhanced testability
A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an...
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7009282 |
Packaged integrated circuit providing trace access to high-speed leads
A packaged integrated circuit for installation on a printed wiring board (PWB) or other type of circuit mounting structure, that allows for the routing of high-speed signals out from high-speed...
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7009283 |
Nonexposed heat sink for semiconductor package
A semiconductor package having a fully encapsulated heat sink is disclosed, along with leadframes for making the package. A semiconductor chip is mounted on a surface of the heat sink. The heat...
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7008826 |
Lead-frame-based semiconductor package and fabrication method thereof
A lead-frame-based semiconductor package and a fabrication method thereof are proposed. The semiconductor package includes: a lead frame having a plurality of first and second leads, wherein each...
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7009309 |
Semiconductor package device that includes an insulative housing with a protruding peripheral portion
A semiconductor package device includes an insulative housing, a semiconductor chip, and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side...
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7005728 |
Lead configuration for inline packages
A substrate for use in an inline IC package is designed such that its die attach pad and leads each have a number of protrusions and recesses. These protrusions and recesses create an irregular...
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7005748 |
Flip chip interface circuit of a semiconductor memory device
A flip chip interface circuit for combining two identical semiconductor chips on upper and lower surfaces of an assembling lead frame into one flip chip package includes at least first and second...
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7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating
A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing...
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7002239 |
Leadless leadframe packaging panel featuring peripheral dummy leads
Methods and apparatuses for providing leadless leadframes with dummy contact leads are disclosed. A leadframe is described that includes an enclosed frame having two lengthwise portions and two...
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6998701 |
Resin sealing-type semiconductor device and method for manufacturing the same
A resin sealing-type semiconductor device comprises a first semiconductor chip 15 with a large amount of heat generation, whose external electrode leading-out bonding pads 16 are wire-bonded to...
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6998702 |
Front edge chamfer feature for fully-molded memory cards
A memory card comprising a leadframe having a plurality of contacts. Electrically connected to the leadframe is at least one semiconductor die. A body at least partially encapsulates the leadframe...
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6998296 |
Electronic component and method for its production
The invention relates to an electronic component and to a method for its production. The electronic component has a semiconductor chip and a wiring board, and a plastic package. The plastic package...
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6995458 |
Cavity down no lead package
An IC package includes a leadframe disposed within a mold body. A paddle is situated substantially on a first mold body surface. An outer paddle surface is substantially exposed for dissipating...
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6995459 |
Semiconductor package with increased number of input and output pins
In accordance with the present invention, there is provided a semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and including at least...
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6995038 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device includes preparing a semiconductor wafer including a first main surface having a semiconductor device forming region and a peripheral region, and a...
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6992385 |
Semiconductor device, a method of manufacturing the same and an electronic device
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin...
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6989584 |
Semiconductor package device that includes a conductive trace with a routing line, a terminal and a lead
A semiconductor package device includes an insulative housing, a semiconductor chip and a conductive trace, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral...
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6989588 |
Semiconductor device including molded wireless exposed drain packaging
A semiconductor device including a leadframe and a die coupled thereto. A drain pad is coupled to the drain region of the die in a body that substantially envelopes the leadframe and the die. The...
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6984879 |
Clamp for pattern recognition
A lead frame such as a normal or inverted lead frame includes an unsymmetrical part such as a gate. A clamp, for clamping the lead frame during wire bonding, includes an observation hole. The...
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6984867 |
Magnetic memory device
A magnetic memory device having a packaged magnetic memory chip is disclosed, which comprises a package structure including a magnetic memory chip, and a magnetic guide of a high-permeability...
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6984877 |
Bumped chip carrier package using lead frame and method for manufacturing the same
A semiconductor package such as a bumped chip carrier (BCC) package has projections extending from a lower surface of a resin encapsulant. Each projection has a concave depression formed thereon....
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6984878 |
Leadless leadframe with an improved die pad for mold locking
A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side...
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6984880 |
Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the...
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6979888 |
LOC semiconductor assembled with room temperature adhesive
A semiconductor device assembly having a lead frame and a semiconductor die configured to be attached to each other is disclosed. An adhesive is applied at room temperature through a stencil to the...
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6979886 |
Short-prevented lead frame and method for fabricating semiconductor package with the same
A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at...
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6981090 |
Multiple use of microcontroller pad
A circuit arrangement permits a microcontroller wirebond pad to be configured to be an analog or digital input or output. The circuit arrangement uses any of a plurality of switching configurations...
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