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7417309 |
Circuit device and portable device with symmetrical arrangement
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first...
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7414303 |
Lead on chip semiconductor package
The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the...
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7414302 |
Flashless lead frame with horizontal singulation
A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have...
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7414300 |
Molded semiconductor package
A molded semiconductor package has a lead frame to which an LSI is bonded, inner lead frames located on opposing sides of the lead frame, and wires. Each wire is connected between the LSI and a...
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7413934 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
A semiconductor device has a leadframe with a structure made of a base metal ( 105 ), wherein the structure consists of a chip mount pad ( 302 ) and a plurality of lead segments ( 303 ). Covering...
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7411278 |
Package device with electromagnetic interference shield
The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of...
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7408245 |
IC package encapsulating a chip under asymmetric single-side leads
A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a...
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7408242 |
Carrier with reinforced leads that are to be connected to a chip
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and...
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7408243 |
High temperature package flip-chip bonding to ceramic
A sensor package apparatus and method are disclosed in which a sensor die is provided and based on a substrate. An integrated circuit is generally associated with the sensor die. A leadframe is...
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7408244 |
Semiconductor package and stack arrangement thereof
A semiconductor package includes a semiconductor chip electrically connected to a plurality of leads arranged at the periphery of the semiconductor chip wherein each of the leads is bent to have a...
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7408248 |
Lead frame for semiconductor device
A lead frame for semiconductor device is provided with an inner lead part and an outer lead part. A composite plating layer is provided on the entire plane of a base material constituting the lead...
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7408251 |
Semiconductor packaging device comprising a semiconductor chip including a MOSFET
A thin semiconductor device difficult to cause breakage of a semiconductor chip is disclosed. The semiconductor device comprises a sealing member, a semiconductor chip positioned within the sealing...
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7405487 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
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7405483 |
Electronic assembly and circuit board
A circuit board assembled with an electronic package having a first and a second inner leads is provided. The first inner lead has a first and a second ends. The circuit board includes an...
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7402462 |
Folded frame carrier for MOSFET BGA
A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35 . Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded...
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7402898 |
Semiconductor package, method for fabricating the same, and semiconductor device
A semiconductor device includes a semiconductor chip, leads for sending and receiving signals between the semiconductor chip and an external device, fine metal wires, an encapsulant for sealing the...
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7399658 |
Pre-molded leadframe and method therefor
A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in...
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7397114 |
Semiconductor integrated circuit device and method of manufacturing the same
A semiconductor integrated circuit device is provided which includes a wire having a diameter equal to or less than 30 μm, and a connected member molded by a resin. The connected member includes a...
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7397112 |
Semiconductor package and lead frame therefor
A lead frame adapted to a semiconductor package, which is enclosed in a molded resin body and is connected with a board, is formed by processing a thin metal plate so as to include a stage for...
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7397113 |
Semiconductor device
A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically...
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7397137 |
Direct FET device for high frequency application
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on...
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7391100 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
A semiconductor integrated circuit package having a leadframe ( 108 ) that includes a leadframe pad ( 103 a ) disposed under a die ( 100 ) and a bonding metal area ( 101 a ) that is disposed over...
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7388280 |
Package stacking lead frame system
The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a...
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7388283 |
Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe
An optical navigation device includes an integrated package. The integrated package includes a planar leadframe, a light source die mounted on the leadframe, and a sensor die mounted on the...
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7385279 |
Semiconductor device and a method of manufacturing the same
A semiconductor device and method having high output and having reduced external resistance is reduced and improved radiating performance. A MOSFET ( 70 ) has a connecting portion for electrically...
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7378743 |
Circuit board and electronic assembly
A circuit board suitable for being electrically connected to a chip package is provided. The chip package has a chip pad and a plurality of inner leads. The circuit board includes at least one...
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7378723 |
Method and apparatus for decoupling conductive portions of a microelectronic device package
A method and apparatus for decoupling conductive portions of a microelectronic device package. In one embodiment, the package can include a microelectronic substrate and a conductive member...
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7378721 |
Chip on lead frame for small package speed sensor
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds...
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7378299 |
Leadless semiconductor package and manufacturing method thereof
A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of...
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7375418 |
Interposer stacking system and method
The present invention provides a system and method for selectively stacking and interconnecting leaded packaged integrated circuit devices with connections between the feet of leads of an upper IC...
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7375982 |
Thin film deposition as an active conductor and method therefor
A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In...
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7375415 |
Die package with asymmetric leadframe connection
A leadframe for a semiconductor package is disclosed including electrical leads which extend from one side of the leadframe to an opposite side of the leadframe, where electrical connection may be...
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7375416 |
Leadframe enhancement and method of producing a multi-row semiconductor package
A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion...
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7371616 |
Clipless and wireless semiconductor die package and method for making the same
A method for making a semiconductor die package is disclosed. In some embodiments, the method includes using a leadframe structure including at least one lead structure having a lead surface. A...
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7372133 |
Microelectronic package having a stiffening element and method of making same
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer...
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7372129 |
Two die semiconductor assembly and system including same
A semiconductor die assembly includes a substantially planar lead frame including a die paddle and a plurality of lead fingers, a first semiconductor die secured by an active surface thereof to the...
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7372137 |
Semiconductor device and manufacturing method thereof
A semiconductor device includes a lower substrate having wiring patterns formed of a plurality of wirings, semiconductor chips located above the lower substrate and electrically connected to the...
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7368807 |
Low cost method to produce high volume lead frames
A method ( 300 ) for fabricating a lead frame ( 100 ), comprising forming a plurality of external leads ( 122 ) in a lead frame material ( 108 ), plating a metal ( 222 ) on all surfaces of the lead...
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7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer...
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7365417 |
Overhang integrated circuit package system
An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the...
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7364947 |
Method for cutting lead terminal of package type electronic component
In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse...
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7361977 |
Semiconductor assembly and packaging for high current and low inductance
A device comprising a semiconductor chip ( 110 ) having a side edge ( 111 ) and a plurality of metal bond pads ( 120, 121 ) near the edge; the pads are aligned to form rows ( 130, 131 ) parallel to...
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7361533 |
Stacked embedded leadframe
A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of...
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7361976 |
Data carrier with a module with a reinforcement strip
In a lead-frame configuration ( 60 ), a module ( 70 ) and a data carrier ( 72 ), two connecting plates ( 12, 13 ) of the module ( 70 ), which are each intended for connection to a connecting...
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7361983 |
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
In a semiconductor device ( 1 ), semiconductor elements ( 2 ) and ( 3 ) are mounted on a lead frame ( 5 ) having leads ( 4 ). The semiconductor elements ( 2 ) and ( 3 ) are connected with the leads...
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7358598 |
Process for fabricating a semiconductor package and semiconductor package with leadframe
A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that...
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7352054 |
Semiconductor device having conducting portion of upper and lower conductive layers
A semiconductor device includes a base plate, at least one first conductive layer carried by the base plate, and a semiconductor constructing body formed on or above the base plate, and having a...
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7351612 |
Method for fabricating quad flat non-leaded package
The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a...
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7348659 |
Semiconductor device and method of manufacturing thereof
A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin...
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7345357 |
High density chip scale leadframe package and method of manufacturing the package
An integrated circuit package having a die pad with a first face and a second face, a plurality of inner leads, and a plurality of sides between the first face and the second face. The plurality of...
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