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7579676 |
Leadless leadframe implemented in a leadframe-based BGA package
A leadless leadframe has a plurality of bottom leads and a plurality of top soldering pads formed in different layers. After encapsulation and before solder ball placement, a half-etching process...
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7579682 |
Power semiconductor module
A power semiconductor module has a ceramic substrate ( 9 ) which has on at least one side a patterned metallization ( 50 ) with a fineness of pattern of smaller than or equal to 800 μm, a first...
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7579697 |
Arrangement for high frequency application
A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on...
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7576416 |
Chip package having with asymmetric molding and turbulent plate downset design
A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having...
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7576440 |
Semiconductor chip having bond pads and multi-chip package
A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is...
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7569920 |
Electronic component having at least one vertical semiconductor power transistor
An electronic component includes a vertical semiconductor power transistor and a further semiconductor device arranged on the transistor to form a stack. The first vertical semiconductor power...
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7564122 |
Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the...
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7564123 |
Semiconductor package with fastened leads
A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a...
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7560804 |
Integrated circuit package and method of making the same
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an...
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7560743 |
Electro-optical device, method of manufacturing the same, and image forming apparatus
An electro-optical device in which a plurality of light-emitting elements including a first electrode layer, a second electrode layer, and a light-emitting functional layer emitting light in...
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7557432 |
Thermally enhanced power semiconductor package system
The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and...
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7557451 |
Electro-optical device and electronic apparatus
An electro-optical device includes a substrate that holds an electro-optical material; and a flexible substrate that is connected to the substrate. The flexible substrate has a first connecting...
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7554182 |
Semiconductor device and package, and method of manufacturer therefor
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the...
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7550828 |
Leadframe package for MEMS microphone assembly
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic...
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7550827 |
Conductor frame for an electronic component and method for the production thereof
Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention...
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7547960 |
Structure of a lead-frame matrix of photoelectron devices
A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the...
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7541668 |
Package frame and semiconductor package using the same
Provided are a lead frame and a semiconductor package which allows reliable attachment of a small-sized semiconductor chip requiring a large number of leads to a board while providing high heat...
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7541221 |
Integrated circuit package system with leadfinger support
An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7541666 |
Semiconductor package having dimpled plate interconnections
A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of...
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7541665 |
Lead frame for a magnetic sensor
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon...
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7541664 |
Lead frame and semiconductor device having the lead frame
Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of...
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7535085 |
Semiconductor package having improved adhesiveness and ground bonding
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in...
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7535087 |
Semiconductor device with lead frames
By disposing a rear surface of a first island 12 and a top surface of a second island 13 so as to at least partially overlap each other, a first semiconductor chip on the first island and a...
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7535086 |
Integrated circuit package-on-package stacking system
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and...
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7535084 |
Multi-chip package with a single die pad
A multi-chip package with a single die pad is provided. The multi-chip package includes a leadframe having a die pad and a plurality of leads surrounding the die pad. Each of the leads includes an...
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7535083 |
Lead frame for surface mount-type piezoelectric vibrator
A lead frame has a pair of side frames each having a plurality of positioning holes and spaced apart from each other in a width direction of the lead frame. At least one section bar extends between...
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7531844 |
Light emitting element
A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light...
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7528013 |
Method for fabricating high performance leadframe in electronic package
Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current...
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7528460 |
Semiconductor device sealed with electrical insulation sealing member
A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component...
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7528469 |
Semiconductor equipment having multiple semiconductor devices and multiple lead frames
Semiconductor equipment includes: a first lead frame having a first semiconductor device; a second lead frame having a second semiconductor device; a thermal resistor for preventing heat transfer...
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7524701 |
Chip-scale package
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
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7524696 |
Sensor including lead frame and method of forming sensor including lead frame
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
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7525183 |
Surface mount multichip devices
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead...
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7525179 |
Lead frame structure with aperture or groove for flip chip in a leaded molded package
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die...
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7521778 |
Semiconductor device and method of manufacturing the same
There is provided a semiconductor device 100 by which flexibility in interconnection design may be improved. The semiconductor device 100 includes: a lead frame 102 provided with an island ...
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7521810 |
Chip stack package and manufacturing method thereof
A chip stack package may include a package substrate, a plurality of semiconductor chips mounted on the package substrate, bonding wires electrically connecting the semiconductor chips to the...
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7521781 |
Integrated circuit package system with mold clamp line critical area having widened conductive traces
An integrated circuit package system includes providing a substrate having a first plurality of conductive traces having a first width. An integrated circuit die is attached to the substrate. A...
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7511371 |
Multiple die integrated circuit package
A multiple die package for integrated circuits is disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and vias formed...
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7511364 |
Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same
A semiconductor device assembly includes a semiconductor device and a lead frame having lead fingers for connection to the semiconductor device. The lead frame may include floating no connect (NC)...
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7511361 |
DFN semiconductor package having reduced electrical resistance
A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the...
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7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability
A leadframe with a structure made of a base metal ( 105 ), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The...
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7508012 |
Electronic component and method for its assembly
An electronic component and method for its assembly is disclosed. In one embodiment, the electronic component comprises at least two semiconductor components and a circuit carrier comprising a die...
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7508054 |
Semiconductor device and a method of manufacturing the same
Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a...
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7504713 |
Plastic semiconductor packages having improved metal land-locking features
A semiconductor device having a plastic package with a linear array of metal lands ( 202, 212 ) with parallel perimeter portions ( 203 a, 213 a ). Pairs of adjacent lands have their facing...
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7504712 |
Electronic device with selective nickel palladium gold plated leadframe and method of making the same
An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold...
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7504733 |
Semiconductor die package
A clip-less packaged semiconductor device includes at least one semiconductor die having bottom and top surfaces each having at least one electrode. A leadframe comprising a sheet of conductive...
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7504714 |
Chip package with asymmetric molding
A chip package with asymmetric molding including a lead frame, a chip, an adhesive layer, bonding wires and an encapsulant, is provided. The lead frame includes a frame body and at least a...
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7504281 |
Substrate based unmolded package
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach...
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7504049 |
Electrode device for organic device, electronic device having electrode device for organic device, and method of forming electrode device for organic device
To provide an electrode for an organic device which can realize a hole injection function and/or an electron injection function from a totally different point of view from metal donor doping. A...
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