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6700192 |
Leadframe and method of manufacturing a semiconductor device using the same
A leadframe used for a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a die-pad portion disposed in a center of an opening defined by a frame...
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6700189 |
Resin sealed semiconductor device
A semiconductor device in which a lead frame having inner connecting portions and outer connecting portions, a semiconductor chip having electrodes on the surface thereof, and metal wires for...
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6696952 |
Structures and assembly methods for radio-frequency-identification modules
Radio-frequency identification (RFID) devices are used in a variety of applications to facilitate the identification and tracking of people, objects, and animals. One problem with RFID devices or...
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6696749 |
Package structure having tapering support bars and leads
A package structure having tapering support bars and leads. The package structure has at least a lead frame, a die, a plurality of conductive wires and an encapsulating plastic body. The lead frame...
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6696753 |
Enhancement of wire bondability in semiconductor device package
A semiconductor device package includes a semiconductor device, a resin casing, a plurality of leads, and a plurality of bonding wires. The semiconductor device includes a plurality of bonding...
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6696752 |
Encapsulated semiconductor device with flash-proof structure
An encapsulated semiconductor device includes a lead frame formed with a flash-proof body. The flash-proof body includes a dam bar formed on atop surface of the lead frame and a tape adhered to a...
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6692992 |
Hardened Fe-Ni alloy for the manufacture of integrated circuit leaderframes and manufacturing process
A method of making a Fe-Ni strip whose chemical composition comprises, by weight: 36% ≦Ni+Co≦43%; 0%≦Co≦3%; 0.05%≦C≦0.4%; 0.2%≦Cr≦1.5%; 0.4%≦Mo≦3%; Cu≦3%; Si≦0.3%,...
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6690088 |
Integrated circuit package stacking structure
A stack of integrated circuits in thin small outline packages (TSOP's) is constructed with an air space in between adjacent packages. The TSOP's have a plurality of connection terminals extending...
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6686651 |
Multi-layer leadframe structure
A leadframe and a package including the leadframe are disclosed. At least one lead includes a nonconductive layer on the inner end segment of the lead set back from its inner end. An electrically...
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6686226 |
Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports...
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6686258 |
Method of trimming and singulating leaded semiconductor packages
When leaded semiconductor packages are formed, semiconductor dies are mounted onto lead frames of a panel, via adhesive tape to be later removed. Such frames are arranged in plural snips. Each...
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6686650 |
Non-contact data carrier and IC chip
The non-contact data carrier has a resin substrate, a metallic antenna coil on the resin substrate, and an IC chip connected to the antenna coil via a plurality of bumps. Each bump of the IC chip...
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6680545 |
Semiconductor devices
In plastics-encapsulated semiconductor devices, for example surface-mount power devices, aluminium corrosion due to ingress or generation of moisture within the encapsulation ( 150 ) is avoided by...
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6680524 |
Semiconductor device and method for fabricating the same
A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; and a resin encapsulant. The wiring electrode is formed on the wiring substrate....
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6680531 |
Multi-chip semiconductor package
A multi-chip semiconductor package is proposed, in which a lead frame is formed with a chip carrier that consists of at least one supporting frame and a plurality of downwardly extending portions...
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6677666 |
Lead frame for fabricating surface mount type semiconductor devices with high reliability
A lead frame and a semiconductor device fabricated by using the same. The lead frame comprises: first and second band shaped members disposed parallel to each other; a plurality of island portions...
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6677663 |
End grid array semiconductor package
A lead end grid array semiconductor package comprises a leadframe having a plurality of leads. The leads extend outwardly from a chip paddle and have an outer end that defines an outer perimeter of...
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6677180 |
Method for manufacturing a low-profile semiconductor device
A method for manufacturing a semiconductor device includes the steps of forming a first conductive bump on a substrate, forming a second conductive bump on a semiconductor chip, forming a plurality...
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6677662 |
Clamp and heat block assembly for wire bonding a semiconductor package assembly
A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip...
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6677665 |
Dual-die integrated circuit package
A dual-die integrated circuit package is provided, which can be used to pack two semiconductor dies in the same package unit. These two semiconductor dies are of the type having an array of bonding...
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6674156 |
Multiple row fine pitch leadless leadframe package with use of half-etch process
A leadless leadframe panel comprising a partially etched top surface of a substrate panel that forms recessed regions that define a portion of a first and a second set of tie bars and a portion of...
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6674154 |
Lead frame with multiple rows of external terminals
A lead frame includes a die pad, a suspension lead and a plurality of leads. The group of leads include at least three kinds of leads, including first, second and third leads. While the first lead...
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6667546 |
Ball grid array semiconductor package and substrate without power ring or ground ring
A ball grid array semiconductor package is proposed, wherein at least a chip is mounted on a substrate, and signal pads on the chip are electrically connected to signal fingers on the substrate by...
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6667547 |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
A lead frame for a high power semiconductor device die has three external lead conductors, the outer two of which are reentrantly bent outwardly from the center of the lead frame. When the lead...
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6664614 |
Lead frame and bottom lead semiconductor package using the lead frame
A lead frame includes a pair of guide rails separated at a predetermined space; at least one dam bar for connecting the pair of guide rails; a die paddle for mounting a semiconductor chip between...
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6664615 |
Method and apparatus for lead-frame based grid array IC packaging
Integrated circuit (IC) package structures and IC package fabrication techniques are provided. The IC package substrate is formed from a metal sheet that is patterned to form a substrate with pads...
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6664618 |
Tape carrier package having stacked semiconductor elements, and short and long leads
A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base...
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6661083 |
Plastic semiconductor package
A lead frame for a surface mount semiconductor chip package includes a die attach paddle and leads, the die attach paddle having down bond attachment sites on an upper surface of the paddle near a...
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6658734 |
Method of manufacturing a circuit member for a resin-sealed semiconductor device
There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and...
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6661087 |
Lead frame and flip chip semiconductor package with the same
A lead frame and a flip chip semiconductor package having the lead frame are proposed, in which a die pad of the lead frame is elevated with a height difference relative to leads of the lead frame,...
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6657288 |
Compression layer on the lead frame to reduce stress defects
An LOC die assembly includes a die dielectrically adhered to the underside of a lead frame. The active surface of the die underlying the attached lead frame is coated with a polymeric material such...
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6657246 |
MRAM with an effective noise countermeasure
In a magnetic random access memory having a memory device portion ( 33,34,35 ) using magnetic material, a high-frequency current suppressor ( 26 ) is arranged in the vicinity of the magnetic...
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6657298 |
Integrated circuit chip package having an internal lead
A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having...
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6657286 |
Microelectronic assembly formation with lead displacement
Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the...
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6657287 |
Leadframe assembly
A leadframe having component receiving projections, such as electrical connectors, adapted to receive a component thereon, such as a ferrite filter, and having means for securing the position of...
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6653724 |
Chip on board package for optical mice and lens cover for the same
Disclosed herein is a chip on board lead package for optical mice and lens cover for the same. A semiconductor chip on board package for optical mice has a board, a semiconductor chip, at least one...
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6650004 |
Semiconductor device
A semiconductor device (S 1 ) includes a semiconductor chip ( 5 ), a chip-mounting internal lead ( 1 ) mounting the semiconductor chip ( 5 ), chip-connecting leads ( 2, 3 ) electrically connected...
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6646339 |
Thin and heat radiant semiconductor package and method for manufacturing
A semiconductor package which is improved in thinness and heat radiation and a method for making the same. The package includes a semiconductor chip electrically connected to leads of a leadframe...
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6646329 |
Power chip scale package
A packaging arrangement for a semiconductor device including a leadframe and a die coupled thereto. The die is coupled to the leadframe such that its back surface (drain area) is coplanar with...
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6646330 |
Lead frame for semiconductor device, process for producing the same and semiconductor device using the same
The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at...
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6642609 |
Leadframe for a semiconductor device having leads with land electrodes
In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is...
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6639306 |
Semiconductor package having a die pad with downward-extended tabs
A semiconductor package having a lead frame formed with a die pad and a plurality of conductive leads, wherein the die pad is formed with a plurality of tabs to impede the resin flow below the die...
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6639305 |
Single layer surface mount package
A single layer surface mount package suitable for use with a high frequency microelectronic device includes a lead frame partially embedded in a dielectric material and a lid. The dielectric...
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6636429 |
EMI reduction in power modules through the use of integrated capacitors on the substrate level
A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference (“EMI”). In one embodiment, capacitance is...
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6633077 |
Semiconductor device and method for manufacturing the same
On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted....
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6633055 |
Electronic fuse structure and method of manufacturing
A gap conductor structure for an integrated electronic circuit that may function as an electronic fuse device or as a low capacitance inter level signal line is integrated as part of the...
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6630729 |
Low-profile semiconductor package with strengthening structure
A semiconductor package and a fabricating method thereof are proposed. The semiconductor package includes a semiconductor chip; a plurality of leads surrounding the chip and formed with a plurality...
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6630730 |
Semiconductor device assemblies including interposers with dams protruding therefrom
A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the...
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6630732 |
Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same
A semiconductor device package is formed with a lead frame including a plurality of lead members positioned in an array, and a semiconductor die is secured to the lead frame. At least one pair of...
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6630733 |
Integrated circuit package electrical enhancement
A configuration for a conventional lead frame for conserving limited leads and for allowing the location of bond pads anywhere on the periphery of the semiconductor device and for reducing the cost...
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