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6756660 |
Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame
A lead frame for a semiconductor device. The lead frame has opposite first and second sides bounded respectively by first and second parallel reference planes between which a thickness is defined....
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6756658 |
Making two lead surface mounting high power microleadframe semiconductor packages
A two-lead, surface-mounting, high-power micro-leadframe semiconductor package has the same outline, mounting, and electrical functionality as industry standard leadframe packages but provides a...
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6753596 |
Resin-sealed semiconductor device
A resin-sealed semiconductor device includes a metallic plate and a semiconductor element soldered thereto. The metallic plate has a semiconductor element mounting region formed on one surface...
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6753598 |
Transverse hybrid LOC package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6750546 |
Flip-chip leadframe package
A leadframe includes at least one peripheral lead secured to a paddle. A paddle solder bump pad and a peripheral solder bump pad are respectively situated on the at least one peripheral lead and...
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6750479 |
Semiconductor component and a method for identifying a semiconductor component
The invention concerns a semiconductor component and a method for identifying a semiconductor component that comprises at least one semiconductor substrate equipped with...
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6747341 |
Integrated circuit and laminated leadframe package
An integrated circuit ( 100 ) includes a semiconductor die ( 102, 103 ) and a semiconductor package ( 101 ) that has a leadframe ( 20, 40, 60, 80 ) for mounting the semiconductor die. The leadframe...
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6747342 |
Flip-chip packaging
A semiconductor die mounted between an X-lead frame and a support structure without bonding wires or straps. A power enhancement mode junction field effect transistor (JFET) die having a top...
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6747343 |
Aluminum leadframes with two nickel layers
A leadframe for use with integrated circuit chips comprising a leadframe base made of aluminum or aluminum alloy having a surface layer of zinc; a first layer of nickel on said zinc layer, said...
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6744120 |
Flexible interconnect substrate of a tape-shaped semiconductor device, semiconductor device and circuit board
A flexible interconnect substrate ( 1 ) comprises a tape-shaped base substrate ( 10 ) and a plurality of interconnect patterns ( 20 ) formed on the base substrate ( 10 ). The base substrate ( 10 )...
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6740961 |
Lead frame design for chip scale package
A universal lead frame for mounting dice to form integrated circuit packages is provided. The lead frame may be made from a metal sheet, which may be stamped or etched. The lead frame provides a...
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6737735 |
Semiconductor device wiring lead frame having resin flow control plates
A semiconductor device of the present invention has an island; a semiconductor pellet fixed onto the island; many inner leads extended to the island; a resin sealing the island, semiconductor...
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6735859 |
Method of manufacturing chip scale package
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice...
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6737733 |
Sealed semiconductor device and lead frame used for the same
In an LOC semiconductor device, a semiconductor chip is fixed on a die pad through a die pad material. A lead including an internal lead extending to the vicinity of a pad provided to the...
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6737737 |
Semiconductor package with chip supporting member
A semiconductor package with a chip supporting member is provided, including a lead frame having a die pad and a plurality of leads, and a chip supporting member mounted on a central portion of the...
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6737734 |
Structure and method for securing bussing leads
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extend over a surface of the semiconductor die are provided where the leads...
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6734419 |
Method for forming an image sensor package with vision die in lens housing
A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully...
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6730994 |
Interdigitated capacitor design for integrated circuit lead frames and methods
A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the...
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6727575 |
Semiconductor device
The semiconductor device comprises a lead frame including a die pad portion for mounting a semiconductor element thereon and a board mounting portion for mounting a circuit board thereon, and a...
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6727574 |
Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus
The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips...
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6724071 |
Molded plastic package with heat sink and enhanced electrical performance
A molded plastic package for semiconductor devices incorporating a heat sink, controlled impedance leads and separate power and ground rings is described. The lead frame of the package, separated...
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6724070 |
Fine pitch lead frame
A lead frame including a first set of leads in a first plane and a second set of leads in a second plane offset vertically from the second plane. The leads in the first and second planes are offset...
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6723585 |
Leadless package
A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages are disclosed. The described lead frames are generally arranged such that each device...
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6724067 |
Low stress thermal and electrical interconnects for heterojunction bipolar transistors
A thermal and electrical interconnect for heterojunction bipolar transistors is disclosed wherein the interconnect is essentially comprised of gold and in thermal and electrical contact with each...
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6724079 |
Wire bond-less electronic component for use with an external circuit and method of manufacture
A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate ( 110, 410...
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6719550 |
Apparatus for epoxy loc die attachment
A plurality of lead frames is supplied in a lead frame-by-frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an...
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6720646 |
Power converter with improved lead frame arrangement including stand-up portion
In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly...
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6717256 |
Mounting structure for semiconductor device having entirely flat leads
The semiconductor device (A) comprises a semiconductor chip ( 3 ), a protective package ( 4 ) covering the semiconductor chip ( 3 ), a first lead ( 1 ), and a second lead ( 2 ). The semiconductor...
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6717247 |
Tool and method for welding to IC frames
A device for forming an encapsulated end of a wire bonded to a metal surface. The device includes a clamp being an end surface of a bar is pressed against a surface of a plate. The end surface has...
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6716667 |
Semiconductor device manufacturing method, making negative pressure for fixing a chip on a substrate
A semiconductor chip is fixed on the main surface of a semiconductor substrate by establishing negative pressure compared to a atmospheric pressure, in a space between the chip and substrate.
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6717822 |
Lead-frame method and circuit module assembly including edge stiffener
An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may...
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6713869 |
Wiring pattern of semiconductor device
A semiconductor package of this invention comprises an electrode pad arranged on a semiconductor chip, a bonding wire, an end of which is coupled to the electrode pad, and a connection pad arranged...
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6713937 |
Minitab rectifier for alternators
A diode for use in an under-the-hood automotive application has a TO 220 outline and consists of a diode die on a two piece lead frame which has a thick section to which the bottom of the die is...
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6713852 |
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
A leadframe for use with integrated circuit chips comprising a base metal having a plated layer of nickel fully covering said base metal; a plated layer of pure tin on said nickel layer,...
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6710429 |
Semiconductor device and process for production thereof
A semiconductor device is provided with outer leads which show themselves in the bottom surface of the resin encapsulated body. This structure eliminates minute chipping and cracking near the resin...
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6710431 |
Semiconductor device and lead frame used therefor
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead...
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6710432 |
Integrated circuit package with low inductance ground path and improved thermal capability
An integrated circuit (IC) package is described. In all package embodiments, a very low inductance ground path is provided from the on-die ground pads to the PCB ground plane. This very low...
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6710430 |
Resin-encapsulated semiconductor device and method for manufacturing the same
A resin-encapsulated semiconductor device includes a die pad, a semiconductor chip mounted on the die pad, and a group of leads. The group of leads include at least three kinds of leads, including...
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6710439 |
Three-dimensional power semiconductor module and method of manufacturing the same
A power semiconductor module in which a main circuit terminal lead frame part and a control circuit lead frame part are bent toward a main circuit lead frame part, is provided. The power...
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6707138 |
Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe
A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first...
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6707136 |
Multi-layer lead frame for a semiconductor device
A multilayer lead frame for decoupling a power supply to a semiconductor die includes overlaying first and second lead frame bodies having an insulator disposed therebetween and at least one main...
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6703692 |
Leadframe with support members
A leadframe is disclosed. The leadframe comprises a frame characterized by a substantially rectangular outline, a die paddle with a receiving surface, and a plurality of support members that...
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6703695 |
Semiconductor device and method for producing the same
The semiconductor device is composed of a semiconductor die 1 , and a lead frame 7 equipped with a die paddle 2 for mounting the semiconductor die and lead terminals 3, 4, 5, 6 for external...
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6703696 |
Semiconductor package
A semiconductor package is comprised of a semiconductor device 4 mounted on a die-pad 3 , a wire 6 for electrically connecting some electrodes of the semiconductor device 4 and terminals 5 ...
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6703691 |
Quad flat non-leaded semiconductor package and method of fabricating the same
A QFN (Quad Flat Non-leaded) semiconductor packaging technology is proposed, which can be used to package a semiconductor chip of a central-pad type having at least one row of bond pads arranged...
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6703693 |
Apparatus for reversing lead frame
An apparatus for reversing upper and lower surfaces of a lead frame which passes through a silver-plating process in a lead frame manufacturing process includes at least one guide rail having a...
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6700210 |
Electronic assemblies containing bow resistant semiconductor packages
A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member...
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6700206 |
Stacked semiconductor package and method producing same
A semiconductor device package and method of fabricating same. The package includes a lead frame having a die paddle and a plurality of lead fingers. The active surface of a first semiconductor die...
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6700183 |
Low temperature die attaching material for BOC packages and products comprising such material
An apparatus and method is provided for forming a board-on-chip (BOC) package. An adhesive material including a carrier and microcapsules distributed in the carrier is used to bond a semiconductor...
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6700188 |
Low-pin-count chip package having concave die pad and/or connections pads
A low-pin-count chip package including a die pad for receiving a semiconductor chip and a plurality of connection pads electrically coupled to the semiconductor chip wherein the die pad and the...
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