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6861750 |
Ball grid array package with multiple interposers
Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second...
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6861733 |
Lead frame wire bonding clamp member
A clamp member or device includes a clamping portion with a rigid portion from which extend a number of independently flexible clamp fingers for contacting and clamping lead frame leads. The...
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6861732 |
Power source circuit device
In a conventional power circuit device, such as a power MOSFET monolithic integrated circuit device and a compound device, since five lead pins are lead out from the packaging with even intervals,...
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6861737 |
Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same
A semiconductor package device has a circuit board with upper and lower conductive metal patterns respectively formed on upper and lower surfaces of the circuit board, a cavity centrally formed in...
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6861734 |
Resin-molded semiconductor device
In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is...
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6861736 |
Leadframe-based semiconductor package for multi-media card
A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the...
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6858467 |
Method for fabricating semiconductor packages with stacked dice and leadframes
A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and...
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6858939 |
Integrated circuit diagonal wiring architectures with zag conductors
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections,...
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6858920 |
Semiconductor device with stacked semiconductor elements
In a semiconductor device 1 , a substrate 3 carries the first semiconductor element 2 a and the second semiconductor element 2 b . The first semiconductor element 2 a has a plurality of...
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6853058 |
Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member
A semiconductor package assembly is disclosed having a semiconductor die receiving member configured to accept a semiconductor die in either the flip-chip or the wirebond orientations. First...
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6853086 |
Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
A method of manufacture of a semiconductor device comprises a step of providing an adhesive ( 30 ) between a semiconductor chip ( 20 ) and a substrate ( 10 ), a step of positioning electrodes ( 22...
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6852567 |
Method of assembling a semiconductor device package
A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact...
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6853057 |
Lead frame for a plastic encapsulated semiconductor device
In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads...
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6853056 |
Semiconductor device having a base metal lead frame
Disclosed is a semiconductor device which has a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a...
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6853063 |
Semiconductor device and communication terminal using thereof
Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on...
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6849933 |
Semiconductor mounting device and method of manufacturing the same
A semiconductor device of a high heat radiation type having improved reliability is disclosed. The semiconductor device comprises a semiconductor chip with plural bonding pads formed thereon,...
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6849952 |
Semiconductor device and its manufacturing method
A non-lead type, stacked-type semiconductor device includes a sealing body of insulative resin, a tab, leads, each having one surface exposed on a mounting surface of the sealing body, a first...
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6849930 |
Semiconductor device with uneven metal plate to improve adhesion to molding compound
The present invention provides a semiconductor device whose reliability is improved by improving the adhesion strength of a metal plate or connecting chip, said plurality of electrodes and a lead...
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6847100 |
High speed IC package configuration
Devices and methods are provided for reducing lead inductance in integrated circuit (IC) packages. An integrated circuit package configuration is provided for high speed applications where the...
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6847099 |
Offset etched corner leads for semiconductor package
A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines...
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6845556 |
Techniques for reworking circuit boards with ni/au finish
Circuit board reworking techniques involve removing original solder from the metallic pad, removing an outer portion of the metallic pad to expose an inner portion of the metallic pad, and applying...
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6844615 |
Leadframe package for semiconductor devices
A semiconductor package comprising a leadframe which includes a die paddle having an opening formed therein. In addition to the die paddle, the leadframe includes a plurality of leads, at least one...
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6841857 |
Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip
An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic...
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6841856 |
Insert conductor for use in a generator and having structure for preventing deformation
An insert conductor that makes it possible to provide a brush holder that does not have wire portions unnecessarily to the outside and which permits reduced manufacturing cost. The insert conductor...
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6841863 |
Ball grid array package with stacked center pad chips and method for manufacturing the same
Disclosed is a ball grid array package with stacked center pad chips, which realizes a BGA package with stacked chips using center pad type semiconductor chips, and a method for manufacturing the...
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6841853 |
Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns
A semiconductor device including a semiconductor chip having an electric circuit on a surface thereof, and an electrode pad formed on the surface of the semiconductor chip and which is electrically...
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6838752 |
Semiconductor package with recessed leadframe and a recessed leadframe
A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around...
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6838757 |
Preplating of semiconductor small outline no-lead leadframes
For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a...
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6838751 |
Multi-row leadframe
A leadframe ( 20 ) for a semiconductor device includes a paddle ring ( 22 ) having an inner perimeter ( 24 ), an outer perimeter ( 26 ), and a cavity ( 28 ) located within the inner perimeter ( 24...
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6838756 |
Chip-packaging substrate
A chip-packaging substrate. The substrate is capable of reducing damage during packaging, shrinking its connecting portions so that the length of any of the gap slots between the packaging portion...
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6838754 |
Multi-chip package
A multi-chip package (MCP) that incorporates a leadframe pad arranged and configured to allow the active surface of a first chip to be mounted on a lower surface of the leadframe pad and a second...
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6838753 |
Lead-frame strip and method of manufacturing semiconductor packages using the same
Provided are a lead frame strip and a method of fabricating a semiconductor package using the same. The lead frame strip includes at least one lead frame panel in which a plurality of unit lead...
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6836004 |
Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame
A lead frame comprises a plurality of frame assemblies. Each framework assembly includes a framework, a suspension lead, a die pad, a plurality of inner leads and outer leads, a first tie bar and a...
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6836007 |
Semiconductor package including stacked semiconductor chips
A semiconductor package includes an upper substrate having an opening portion, a solder ball for connection between substrates arranged on the lower side of the upper substrate, a lower substrate...
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6836008 |
Semiconductor packages with leadframe grid arrays and components
A semiconductor assembly includes a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as...
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6836002 |
Semiconductor device
A re-wiring layer is provided on a circuit-formed surface of an IC chip, in an area other than where external lead electrodes. In the process for forming a circuit of the IC chip, the re-wiring...
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6833607 |
Resin-molded semiconductor device that includes at least one additional electronic part
A resin-molded semiconductor device capable of preventing an adhesive from flowing out along conductive paths from where electronic parts are attached on the conductive paths when the electronic...
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6833608 |
Semiconductor device and packaging system therefore
Two different switches with two different signal input schemes are fabricated by mounting the same semiconductor chip on the same lead pattern. Two of the leads of the lead pattern provides space...
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6831372 |
Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same
Electronic devices with a semiconductor chip and leadframes with device positions and methods for producing the same are encompassed by the invention. The electronic devices include a semiconductor...
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6831352 |
Semiconductor package for high frequency performance
An improved lead frame structure for use in a semiconductor package, including: a plurality of leads; a paddle structure electrically isolated from the leads, the paddle structure including at...
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6828663 |
Method of packaging a device with a lead frame, and an apparatus formed therefrom
A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an...
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6828002 |
Substrate strip with sides having flanges and recesses
The present invention relates to a substrate strip with sides having flanges and recesses. The substrate strip is obtained by cutting a panel where a plurality of substrate strips can be arrayed....
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6828661 |
Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same
A lead frame has a die pad portion supported internally of a framework portion by suspension leads and a plurality of leads each having one end connected to the framework portion and the other end...
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6828660 |
Semiconductor device with double nickel-plated leadframe
A leadframe for use in the assembly of integrated circuit (IC) chips, which has first and second surfaces and a base metal structure ( 606 ) with an adherent layer ( 607 ) of nickel having a rough,...
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6828662 |
Semiconductor device
A semiconductor device includes an IC chip, a frame on which the IC chip is mounted, a conductive plate disposed beneath and spaced from the frame, a first external terminal and a second external...
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6828659 |
Semiconductor device having a die pad supported by a die pad supporter
A semiconductor package includes a semiconductor chip which is mounted on a die pad which is smaller than the semiconductor chip, a die pad supporter which supports the die pad, the die pad...
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6825549 |
Electronic component with external flat conductors and a method for producing the electronic component
An electronic component with external flat conductors and a method producing the component includes placing the external flat conductors as waveguides with a defined characteristic impedance on an...
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6825550 |
Board-on-chip packages with conductive foil on the chip surface
The invention encompasses a board-on-chip package comprising an insulative substrate having circuitry thereon and an opening therethrough. A semiconductive-material-comprising die is adhered to the...
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6826637 |
Implementing for buffering devices in circuit layout to ensure same arriving time for clock signal from source root to output bonding pads
An implementing method for buffering devices is provided, so as to dispose the buffering devices on a chip. The chip includes a signal source root and the number X of output bonding pads, in which...
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6825548 |
Semiconductor device
It is to be made possible to eliminate unevenness of the inductances of bonding wires and to reduce the size of semiconductor devices. Over the surface of a semiconductor device in whose MISFET...
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