Matches 151 - 200 out of 285 < 1 2 3 4 5 6 >
Match Document Document Title
5777374 Integrated circuit interconnect structure with back reflection suppressing electronic "speed bumps"  
A polysilicon interconnect is formed on a microelectronic circuit substrate for conducting signals from a driver to a non-polycrystalline silicon contact which has higher impedance than the...
5777540 Encapsulated fuse having a conductive polymer and non-cured deoxidant  
A simplified method of manufacturing an electrothermal fuse includes the steps of screening conductive epoxy onto fuse link termination pads, placing a metal alloy fuse link into the conductive...
5760464 Semiconductor device  
A semiconductor device has a semiconductor chip with a plurality of pads, an inner lead which is connected to a plurality of pads by a plurality of bonding wires and which has a broken part...
5747868 Laser fusible link structure for semiconductor devices  
An improved laser fusible link structure for semiconductor devices (200) and method of manufacturing thereof (10) is disclosed. A first conductive layer is patterned to create a laser fuse (202)...
5729048 Cmos ic device suppressing spike noise  
A CMOS IC device operating at a frequency of 300 MHz or higher includes a power supply wiring for interconnecting one of circuit elements and a power supply pad, and a phase-shifting split wiring...
5729041 Protective film for fuse window passivation for semiconductor integrated circuit applications  
An integrated circuit includes a conductive fusible link that may be blown by heating with laser irradiation, The integrate circuit comprises a silicon substrate; a first insulating layer; a...
5723898 Array protection devices and method  
The present disclosure sets forth an improved integrated circuit in which circuit elements, adjacent to a fuse, are protected by barriers positioned adjacent the fuse. In the improved integrated...
5698894 Double mask hermetic passivation structure  
A passivation structure is formed using two passivation layers and a protective overcoat layer using two masking steps. The first passivation layer is formed over the wafer and openings are...
5698895 Silicon segment programming method and apparatus  
The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned...
5691566 Tapered three-wire line vertical connections  
An electrical connection is provided between a 3-wire transmission line buried in a dielectric substrate and corresponding first, second and third conductive pads formed on a substrate surface. The...
5672905 Semiconductor fuse and method  
A semiconductor fuse and method for fabricating the same An insulating layer is provided and a trench formed therein. A fusible link is then formed across the insulating layer and trench and...
5670815 Layout for noise reduction on a reference voltage  
A layout portion (20) has a first portion (25), and a second portion (55). In the first portion (25), a reference voltage line (27) is disposed between two V DD power supply lines (26, 30) for a...
5663590 Product of process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps  
A process and resulting product are described for forming an integrated circuit structure with horizontal fuses on an insulation layer formed over other portions of the integrated circuit structure...
5652459 Moisture guard ring for integrated circuit applications  
An improved structure and method for forming an integrated circuit guard ring which prevents contamination/moisture from diffusing through a fuse opening, in the insulating layer(s), to device...
5648661 Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies  
Unsingulated dies on a wafer may be individually electronically selected using various "electronic mechanisms" on the wafer. Conductive lines extend on the wafer from the electronic mechanism to...
5623160 Signal-routing or interconnect substrate, structure and apparatus  
Method and apparatus for interconnecting integrated circuits (ICs) are described. The invented lattice preferably is formed in a plural-layer structure whereby each required interconnect signal has...
5606197 High capacitance capacitor in an integrated function block or an integrated circuit  
A method for creating a MOS-type capacitor structure in function blocks or integrated circuits. Each block or cell is provided with capacitors for decoupling purposes under the board metal supply...
5598029 Power supply wiring for semiconductor device  
Ground lines 2 are disposed so as to sandwich a power supply line 1. A gate oxide film 3 and a gate 4 are formed below the power supply line 1. An n-type area 8 is formed adjacent to the end of the...
5572050 Fuse-triggered antifuse  
A programmable integrated circuit for forming conductive links includes a heat-generating programming structure through which current flows upon application of a programming voltage to heat the...
5528072 Integrated circuit having a laser connection of a conductor to a doped region of the integrated circuit  
The conductor 15 to be connected to the doped region 12 of the substrate 11 has an edge 15a at which the laser beam 20 is aimed, regulated such as to definitively create a zone of low electrical...
5477079 Power source noise suppressing type semiconductor device  
A power source noise suppressing type semiconductor device has: a semiconductor chip formed therein with a first circuit and a second circuit, the semiconductor chip having a plurality of pads on...
5465004 Programmable semiconductor integrated circuits having fusible links  
The size of a fusible link (22 C F ) created from part of a metal layer (22) is controlled by an oxidation performed in a deposition chamber that is also used for depositing a dielectric layer (30)...
5459342 Field programmable gate array with spare circuit block  
A field programmable gate array, comprises: a plurality of circuit blocks each having logic circuits; at least one spare circuit block having logic circuits; a set of interconnections including at...
5420455 Array fuse damage protection devices and fabrication method  
The present disclosure sets forth an improved integrated circuit in which circuit elements, adjacent to a fuse, are protected by barriers positioned adjacent the fuse. In the improved integrated...
5410163 Semi-conductor integrated circuit device including connection and disconnection mechanisms to connect and disconnect monitor circuit and semiconductor integrated circuit from each other  
A monitor circuit provided in a chip in which a semiconductor integrated circuit is formed. Connection mechanisms and disconnection mechanisms are connected in series in wirings connected to the...
5389814 Electrically blowable fuse structure for organic insulators  
An electrically blowable fuse structure usable with organic insulators in microelectronic parts is provided. The fuse structure is made of a first heat resistant member, a fusing element and a...
5331195 Fuse construction of a semiconductor device  
At least one fusing electrode charging electrode portion is connected to an intermediate portion of a fuse body of a fuse that has the fuse body and connecting end electrode portions provided at...
5329152 Ablative etch resistant coating for laser personalization of integrated circuits  
A programmable integrated circuit for prototyping applications including a first patterned metal layer, an insulation layer formed over the first metal layer and a second patterned metal layer...
5309024 Multilayer package  
The present invention provides a multilayer ceramic package, which comprises a conductive layer, formed like a square layer, applying a power voltage V DD or a ground voltage V SS to a...
5306949 Transistor module having external lead terminal with transient voltage suppression  
In an external lead terminal 5 of a transistor module, an intermediate terminal portion 6 and an external lead terminal 8 are conductively connected to each other via a U-shaped intermediate...
5303199 Redundant memory device having a memory cell and electrically breakable circuit having the same dielectric film  
An easily circuit-programmable semiconductor device which comprises a dynamic random access memory (DRAM) unit, a redundancy circuit and a connection between them, the DRAM unit having as a...
5299151 Method for writing into semiconductor memory  
A method is provided for writing into a semiconductor memory which includes a MOS transistor formed on a semiconductor substrate and an anti-fuse formed of an insulating film and an upper electrode...
5264725 Low-current polysilicon fuse  
A submicron-width fuse element is disclosed that protects peripheral DRAM chip devices from low current failures below the range of metal fuse elements. In a specific application, the fuse elements...
5260597 Routing structure for a customizable integrated circuit  
A selectably customizable semiconductor device including a first metal layer disposed in a first plane and including first elongate strips extending parallel to a first axis, a second metal layer...
5256899 Integrated circuit fuse link having an exothermic charge adjacent the fuse portion  
A fuse link includes a fuse portion and a exothermic charge adjacent the fuse portion for blowing the fuse portion upon application of a triggering current to the fuse link.
5200364 Packaged integrated circuit with encapsulated electronic devices  
An integrated circuit device is disclosed. The device includes a first leadframe power supply bus and a second leadframe power supply bus that each have portions separate from and adjacent to one...
5144412 Process for manufacturing plastic pin grid arrays and the product produced thereby  
A pin grid array package is provided. An array of terminal pins pass through apertures formed in an interconnect tape. The terminal pins are electrically connected to circuit traces formed on...
5070392 Integrated circuit having laser-alterable metallization layer  
An integrated circuit and a method of altering such an integrated circuit (e.g., during final testing of the circuit) are such that the method can be used to program a circuit, wire around...
5068706 Semiconductor device with fuse function  
A semiconductor device includes a radiation plate, first and second conductive patterns formed on one surface of the radiation plate, a first semiconductor element fixed on and connected to the...
5053383 Method of reducing critical current density of oxide superconductors by radiation damage  
The critical current density J c of a superconductive oxide film can be tailored, without substantial change in the critical temperature T c (R0), by introduction of radiation damage into the...
5043792 Integrated circuit having wiring strips for propagating in-phase signals  
An integrated circuit is fabricated on a semiconductor substrate and comprises a plurality of component circuits having first and second circuits respectively serving as signal sources and a third...
5040049 Semiconductor device and method of manufacturing a semiconductor device  
The invention relates to a semiconductor device comprising a silicon body (1) provided with a conductor pattern (4, 5) consisting of a contact layer (4) and an aluminium layer (5). Contact layers...
5027174 Semiconductor integrated circuit device with improved resistance against electrostatic noise  
A semiconductor integrated circuit device has an internal circuit formed on a semiconductor substrate and a first conductive layer connected to an electrode pad for communicating signals with the...
5017510 Method of making a scalable fuse link element  
A fuse link (50) is formed using a method which offers greater scalability of the general conductor system used to wire the device. An oxide mask (36) having the shape of a desired fuse link is...
5011791 Fusible link with built-in redundancy  
A fusible link is fabricated using sidewall spacer technology. The fusible link of the present requires low fusing power because a fusible link having a small cross-sectional area is obtainable. A...
5006918 Floating orthogonal line structure for X-Y wiring planes  
Far-end noise caused by coupling between active and quiet signal lines of wiring planes of an integrated circuit chip or chip carrier is reduced by providing floating crossing lines in wiring...
5003371 Fuse-melting device  
The melting of a fuse of a CMOS type integrated circuit is caused by using the existence of a stray thyristor created in the neighborhood of the boundaries of pads made in a substrate. This stray...
4994902 Semiconductor devices and electronic system incorporating them  
An electronic system having a first and a second semiconductor device acting as a microprocessor and a coprocessor, respectively, disposed linearly on a mounting board. The external pins common to...
4993954 Device for interconnection between and integrated circuit and an electrical circuit  
An object of the invention is a device for interconnection between an integrated circuit and an electrical circuit, such as a printed circuit. This device has, depending on the desired...
4970686 Semiconductor memory cells and semiconductor memory device employing the semiconductor memory cells  
A spare memory cell comprises a read FET (Field Effect Transistor), a fusing FET and a current fuse. The FETs are connected in series between a read data line and a low voltage source. The fuse is...
Matches 151 - 200 out of 285 < 1 2 3 4 5 6 >