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9041169 Semiconductor packaging container, semiconductor device, electronic device  
A semiconductor packaging container allowing to use in millimeter band is provided at a low cost. The inner SIG pads and the inner GND pads, capable of a direct connection with a signal terminal...
9030298 Thin semiconductor device and operation method of thin semiconductor device  
The present invention provides a thin semiconductor device in which its security such as prevention of counterfeit or information leakage is to be enhanced. One feature of the present invention is...
9024417 Integrated electronic components and methods of formation thereof  
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated...
8994115 Power device integration on a common substrate  
A semiconductor structure for facilitating an integration of power devices on a common substrate includes a first insulating layer formed on the substrate and an active region having a first...
8994150 Systems and methods for lowering interconnect capacitance  
Methods and apparatus for lowering the capacitance of an interconnect, are disclosed. An example apparatus may include an interconnect formed in at least one integrated circuit and configured to...
8987887 Interconnection device for electronic circuits, notably microwave electronic circuits  
An interconnection device for elements to be interconnected such as electronic modules or circuits, comprises at least one transmission line coupled to a ground line, the two lines being produced...
8970018 Differential excitation of ports to control chip-mode mediated crosstalk  
A differential port and a method of arranging the differential port are described. The method includes arranging a first electrode to receive a drive signal, and arranging a second electrode to...
8970017 High frequency monolithic microwave integrated circuit connection  
An apparatus having a bonding pad and a conductor is disclosed. The bonding pad may be formed in a conductive layer of an integrated circuit. The bonding pad generally has (i) a bond region, (ii)...
8963658 Micropstrip transmission line/coplanar waveguide (CPW) transistor structure  
A structure having a coplanar waveguide transistor; and a microwave section, coupled to the transistor, having: a strip conductor coplanar with the electrodes of the coplanar waveguide transistor...
8946873 Redistribution structures for microfeature workpieces  
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry...
8941244 Semiconductor device and manufacturing method thereof  
A semiconductor structure includes a molding compound, a conductive plug, and a cover. The conductive plug is in the molding compound. The cover is over a top meeting joint between the conductive...
8937374 Semiconductor package, method and mold for producing same, input and output terminals of semiconductor package  
A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically...
8912634 High frequency transition matching in an electronic package for millimeter wave semiconductor dies  
A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is...
8912581 3D transmission lines for semiconductors  
A transmission line structure for semiconductor RF and wireless circuits, and method for forming the same. The transmission line structure includes embodiments having a first die including a first...
8901719 Transition from a chip to a waveguide port  
The present invention relates to a transition from a chip to a waveguide port (47, 47′, 11), the chip (1, 1′, 62) having a first main side (3, 3′, 66) and a second main side (4, 4′, 67), where the...
8896121 Chip assembly system  
An assembly of semiconductor wafers/chips wherein the adjacent surfaces of the two wafers/chips comprise an insulating layer having opposite copper pads inserted therein. The insulating layer is...
8866306 Signal path and method of manufacturing a multiple-patterned semiconductor device  
A multiple-patterned semiconductor device and a method of manufacture are provided. The semiconductor device includes one or more layers with signal tracks. The signal tracks have a quality...
8865537 Differential excitation of ports to control chip-mode mediated crosstalk  
A differential port and a method of arranging the differential port are described. The method includes arranging a first electrode to receive a drive signal, and arranging a second electrode to...
8860191 On-chip transmission line structures with balanced phase delay  
A transmission wiring structure, associated design structure and associated method for forming the same. A structure is disclosed having: a plurality of wiring levels formed on a semiconductor...
8853815 Methods and apparatus for congestion-aware buffering using voltage isolation pathways for integrated circuit designs with multi-power domains  
A semiconductor apparatus is provided herein for buffering of nets routed through one or more areas associated with a first power domain that is different from a second power domain associated...
8829659 Integrated circuit  
An integrated circuit connection comprises a substrate, first and second transmission lines, a die, and a conductive ribbon. The first transmission line has a first end and is arranged on the...
8803324 Semiconductor devices and methods of manufacturing the same  
A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines.
8796697 Semiconductor device including transistor chips having oblique gate electrode fingers  
A semiconductor device includes: a package; an input matching circuit and an output matching circuit in the package; and transistor chips between the input matching circuit and the output matching...
8786061 Semiconductor device  
A semiconductor device includes a first semiconductor substrate and a second semiconductor substrate laminated with an insulating layer, a first transmission line formed on the first semiconductor...
8780584 Printed circuit board and electro application  
An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to...
8729680 Semiconductor device  
A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom...
8698311 Package substrate and semiconductor package including the same  
A package substrate may include an insulating substrate, a dummy pad, a signal pad and a plug. The dummy pad may be formed on an upper surface of the insulating substrate. The signal pad may be...
8680690 Bond wire arrangement for efficient signal transmission  
In one embodiment, a device includes a first IC having a differential signal driver and a first isolation circuit configured to provide differential signals transmitted by the differential signal...
8653649 Device housing package and mounting structure  
A device housing package includes a substrate having a device mounting region; a frame body having a through hole formed in part thereof, the frame body being disposed on the substrate so as to...
8638567 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...
8629536 High performance on-chip vertical coaxial cable, method of manufacture and design structure  
A high performance on-chip vertical coaxial cable structure, method of manufacturing and design structure thereof is provided. The coaxial cable structure includes an inner conductor and an...
8624297 Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density  
An integrated circuit substrate is designed and fabricated with a selectively applied transmission line reference plane metal layer to achieve signal path shielding and isolation, while avoiding...
8610269 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device  
[Problem] A semiconductor device which achieves a fine pitch, a high throughput and a high connection reliability, especially in flip-chip mounting is provided. A method for manufacturing the...
8592959 Semiconductor device mounted on a wiring board having a cap  
A semiconductor device includes a semiconductor element, a wiring board including a conductor portion formed on a first surface thereof on which the semiconductor element is mounted, the conductor...
8581113 Low cost high frequency device package and methods  
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead...
8575731 Semiconductor device with a balun  
A semiconductor integrated circuit device with a balun which is formed above a conductive semiconductor substrate and which includes a dielectric film, an unbalanced line for transmitting an...
8569869 Integrated circuit packaging system with encapsulation and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting...
8558356 Electrical Component  
A stable electrical component includes a carrier substrate and a chip (2) mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged...
8513783 Semiconductor device  
A semiconductor device (1) includes a wiring (10) and dummy conductor patterns (20). The wiring (10) is a wiring through which a current with a frequency of 5 GHz or higher flows. Near the wiring...
8487430 Multi-layer high-speed integrated circuit ball grid array package and process  
Examples of high-speed ball grid array packages and a process of forming a package are provided. A package may include contact pads disposed on a bottom surface, conductive balls, and a signal via...
8476687 Low impedance transmisson line  
Transmission lines employing transmission line units or elements within integrated circuits (ICs) are well-known. Typically, different heights for these transmission line units can vary the...
8461012 Device with ground plane for high frequency signal transmission and method therefor  
A method for forming a semiconductor structure includes forming an isolation region in a semiconductor substrate; forming a conductive layer over the isolation region; forming a first dielectric...
8436450 Differential internally matched wire-bond interface  
In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use...
8432706 Printed circuit board and electro application  
A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an...
8415776 Semiconductor device  
A semiconductor device (1) includes a wiring (10) and dummy conductor patterns (20). The wiring (10) is a wiring through which a current with a frequency of 5 GHz or higher flows. Near the wiring...
8410583 Security chip  
A security chip is disclosed. The security chip includes: a substrate; an integrated circuit disposed on the substrate, the integrated circuit including circuit elements, circuit interconnect...
8400778 Layout schemes and apparatus for multi-phase power switch-mode voltage regulator  
A multi-phase voltage regulator is disclosed where each phase is comprised of an array of high and low side transistors that are integrated onto a single substrate. Further, a system of mounting...
8378466 Wafer-level semiconductor device packages with electromagnetic interference shielding  
Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a...
8368185 Semiconductor device packages with electromagnetic interference shielding  
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a circuit substrate, an electronic device, an...
8325490 Circuit manufacturing and design techniques for reference plane voids with strip segment  
Manufacturing circuits with reference plane voids over vias with a strip segment interconnect permits routing critical signal paths over vias, while increasing via insertion capacitance only...