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7605450 |
High frequency arrangement
A high frequency arrangement is provided that includes an integrated high frequency circuit, a first bond pad, which is electrically connected by a first electrical supply line, in particular a...
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7602049 |
Capacitive techniques to reduce noise in high speed interconnections
Improved methods and structures are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. Embodiments of an electronic device...
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7595546 |
Printed circuit board
Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions....
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7592879 |
Integrated circuit with at least one integrated transmission line
An integrated circuit is disclosed that includes at least one integrated transmission line for the transmission of a high-frequency differential signal with a number of at least two...
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7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7569916 |
Separable network interconnect systems and assemblies
Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower...
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7550854 |
Integrated interconnect arrangement
An explanation is given of an integrated interconnect arrangement having a plurality of interconnects that cross over one another at two crossover sections. By virtue of this measure, it is...
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7547558 |
Method for manufacturing semiconductor device
An Al 2 O 3 film for covering a ferroelectric capacitor is formed by a sputtering process. The thickness of the Al 2 O 3 film is preferably optimized according to amount of remanent polarization...
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7504711 |
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip...
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7495318 |
Apparatus and method for improving AC coupling on circuit boards
The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit...
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7483286 |
Semiconductor memory device with high permeability lines interposed between adjacent transmission lines
A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically...
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7470937 |
Optical module
An optical module comprises: a stem; a protruding portion on a surface of the stem; an optical semiconductor device mounted on the protruding portion; a power supply terminal penetrating through...
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7468560 |
Semiconductor device with micro connecting elements and method for producing the same
A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the...
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7457337 |
Optical module having case grounding using bypass capacitor
According to embodiments of the present invention, an optical transponder includes a transmitter optical subassembly (TOSA). In one embodiment, the electrical ground of the TOSA may be DC-isolated...
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7411279 |
Component interconnect with substrate shielding
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a...
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7391099 |
Optical modulator module
A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted...
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7375414 |
High permeability layered films to reduce noise in high speed interconnects
This invention provides a structure and method for improved transmission line operation on integrated circuits. One method of the invention includes forming transmission lines in an integrated...
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7365415 |
High frequency semiconductor device
A semiconductor device has a mounting substrate and a semiconductor package mounted on the mounting substrate. The mounting substrate has a substrate body, input/output line conductors on the upper...
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7361975 |
Semiconductor integrated circuit having reduced cross-talk noise
A semiconductor integrated circuit, includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction...
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7352059 |
Low loss interconnect structure for use in microelectronic circuits
A low loss on-die interconnect structure includes first and second differential signal lines on one of the metal layers of a microelectronic die. One or more traces may also be provided on another...
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7335968 |
High permeability composite films to reduce noise in high speed interconnects
A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive...
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7321167 |
Flex tape architecture for integrated circuit signal ingress/egress
In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is...
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7312528 |
Semiconductor device having antenna connection electrodes
A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of...
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7298046 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
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7286029 |
Passive devices formed in grooves on a substrate and a method of manufacture
A method for constructing passive devices on a substrate and a device is provided that is fabricated in accordance with the a method. The method includes the steps of: forming a plurality of...
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7244977 |
Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device
A semiconductor memory device includes a vertical MISFET having a source region, a channel forming region, a drain region, and a gate electrode formed on a sidewall of the channel forming region...
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7239013 |
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor...
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7239002 |
Integrated circuit device
In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided...
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7230319 |
Electronic substrate
A substrate for mounting a device is disclosed. The substrate includes at least one transition for providing an RF connection to a lead of the device, the lead extending from a device input to an...
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7215007 |
Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
Apparatus for suppressing noise and electromagnetic coupling in the printed circuit board of an electronic device includes an upper conductive plate and an array of conductive coplanar patches...
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7206515 |
Single-ended/differential wired radio frequency interface
A package to encapsulate an optical component includes a RF interface to receive high frequency signals from an external source. The RF interface pins that can be configured as one or more...
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7187061 |
Use of a down-bond as a controlled inductor in integrated circuit applications
A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality...
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7187062 |
Coupler detector
The present invention is a coupler built on a semiconductor substrate, e.g. GaAs. Semiconductor processing allows for small trace and space rules. The tighter design rules provide for tighter...
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7161450 |
Microwave transmission line having dielectric film layers providing negative space charge effects
A microwave transmission line includes a substrate of high-resistivity silicon, a first dielectric film and a second dielectric film successively formed on the principal surface of the substrate...
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7161244 |
Microwave device for dissipating or attenuating power
The present invention relates to a microwave device for at least one of dissipating and attenuating power, the device comprising:
an insulating substrate; at least one conductive strip of a...
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7149024 |
Optical modulator module
The present invention provides an optical modulator module comprising: a chip carrier; a semiconductor optical modulator for modulating light based on an electronic signal; a strip conductor...
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7148772 |
Coaxial waveguide microstructures having an active device and methods of formation thereof
Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an...
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7142822 |
Package device for accommodating a radio frequency circuit
A compact package whose inner walls can be located near a radio frequency circuit without changing the characteristics of the radio frequency circuit has a planar circuit on the bottom of the...
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7132740 |
Semiconductor package with conductor impedance selected during assembly
A semiconductor package having a plurality of conductors arrayed in two (or more) parallel planes, and an available ground conductor. Conductors in the auxiliary or second plane substantially...
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7112870 |
Semiconductor integrated circuit device including dummy patterns located to reduce dishing
A large area dummy pattern DL is formed in a layer underneath a target T 2 region formed in a scribe region SR of a wafer. A small area dummy pattern in a lower layer and a small area dummy...
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7109569 |
Dual referenced microstrip
Structures and methods are provided for dual referenced microstrip structures having low reference discontinuities between a microstrip trace referenced to a primary reference plane as compared to...
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7109531 |
High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment
A high frequency switch, has a transmitting terminal, a receiving terminal, an antenna terminal, a first diode having an anode electrically connected to the transmitting terminal and a cathode...
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7105928 |
Copper wiring with high temperature superconductor (HTS) layer
Semiconductor devices and methods of forming the semiconductor devices using an HTS (High Temperature Superconductor) layer in combination with a typical diffusion layer between the dielectric...
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7101778 |
Transmission lines for CMOS integrated circuits
Improved methods and structures are provided for impedance-controlled low-loss lines in CMOS integrated circuits. The present invention offers a reduction in signal delay. Moreover, the present...
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7087983 |
Manufacturing methods of semiconductor devices and a solid state image pickup device
A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by...
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7081661 |
High-frequency module and method for manufacturing the same
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal...
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7042067 |
Transmission line with integrated connection pads for circuit elements
An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary...
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7030470 |
Using chip lamination to couple an integrated circuit with a microstrip transmission line
One embodiment of the present invention provides a system that operatively couples an integrated circuit with a microstrip transmission line through chip lamination. The system includes a first...
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7030477 |
Optical semiconductor device
A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front...
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7015869 |
High frequency antenna disposed on the surface of a three dimensional substrate
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
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