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4297722 Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island  
A transistor device which is suitable for a high-frequency and high-power transistor is disclosed. The transistor device comprises a first ceramic plate and a second ceramic plate mounted on the...
4292643 High cut-off frequency planar Schottky diode having a plurality of finger-like projections arranged in parallel in a transmission line  
A planar Schottky diode is disclosed which is inserted into a transmission line without disruption of characteristic impedance. The diode comprises a plurality of parallel finger-like projections...
4276558 Hermetically sealed active microwave integrated circuit  
An active microwave amplifier element is hermetically sealed on the opposite side of a dielectric substrate from the side in which input and output signals are transmitted. The active element is...
4266239 Semiconductor device having improved high frequency characteristics  
A semiconductor device in which a conducting shielding member is disposed over the space between the input and output terminal metal layers and over the semiconductor chip bonded to the output...
4259684 Packages for microwave integrated circuits  
This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which...
4238763 Solid state microwave devices with small active contact and large passive contact  
This disclosure relates to two-terminal solid state microwave devices, such as transferred electron and avalanche effect devices, comprising a high-conductivity semiconductor substrate formed over...
4213141 Hybrid transistor  
A semiconductor device which provides in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match...
4193083 Package for push-pull semiconductor devices  
A semiconductor package for containing two individual devices such that they may be externally connected in a pushpull relationship. Two transistors, each having an input and output pad are formed...
4150393 High frequency semiconductor package  
A low parasitic microwave transistor package is provided including a metal header formed from a base member and having a cylindrical center portion; a metallized ceramic insulator formed in an...
4147998 Beam lead rod assembly  
A beam lead rod assembly for incorporation into an electromagnetic wave coaxial transmission line structure. The rod assembly comprises a beam lead holder and a beam lead device. The holder...
4092664 Carrier for mounting a semiconductor chip  
An assembly and method for mounting a transistor chip on a carrier with lead attachment allows a circuit to approach the limitations of the transistor chip rather than to be limited by the...
4023198 High frequency, high power semiconductor package  
A semiconductor packaging configuration is described in which a heat sink is bonded to a semiconductor chip or die and a conductor is bonded to the die and a metalized ceramic insulating body for...
RE29218 Packaged semiconductor device for microwave use  
A packaged semiconductor device for use at ultra-high frequencies is characterized by improved high frequency characteristics as a result of reduced stay capacitance and reduced energy loss. The...
3982271 Heat spreader and low parasitic transistor mounting  
An apparatus for heat spreading and low parasitic transistor mounting in high power microstrip circuit applications. An electrically and thermally conductive strip is conductively affixed to the...
3956820 Method of manufacturing a semiconductor device having a lead bonded to a surface thereof  
An improved method of manufacturing a semi-conductor device having a lead bonded to a surface thereof, wherein the device is fabricated by removing a section of a substrate which surrounds a...
3946428 Encapsulation package for a semiconductor element  
A semiconductor package device characterized by improved operation at ultra-high frequencies and by improved heat dissipation, includes an auxiliary metal stud mounted on a metal substrate. A...
3936864 Microwave transistor package  
A microwave transistor package which will accommodate large transistor chips as well as provide sufficient space for the addition of tuning capacitors or other circuits. The lead length inside of...
3913040 Microstrip carrier for high frequency semiconductor devices  
An L-shaped thermally conductive substrate is adapted to be mounted in a microwave stripline circuit structure. Two semiconductor elements are mounted on the substrate, one on each leg of the...
3909699 Low impedance transmission line for bypassing radio frequency energy around high voltage rectifier stacks  
A low impedance transmission line consisting of substantially coextensive, thin conductive straps which overlap one another, and are connected to respective opposite terminals of a high voltage...
3908188 Heat sink for microstrip circuit  
An individual heat sink for a solid state element such as a diode encased in a standard package of the type in which one of the diode terminals is a conductive cap and the other a conductive...
3908185 High frequency semiconductor device having improved metallized patterns  
An apertured top ceramic member is mounted on a bottom ceramic member, the latter member having a first metallized area thereon on which a semiconductor chip is mounted and a second surrounding...
3898594 Microwave semiconductor device package  
A package or mounting structure for hermetically sealing and supporting a microwave semiconductor device adapted for use with stripline transmission lines. A multilayer structure is assembled upon...
3857115 SEMICONDUCTOR DEVICE MOUNTING ARRANGEMENTS  
An arrangement for mounting a semiconductor device in a waveguide run consists of a conducting block having an aperture between two of its faces, in which the device to be mounted is positioned....
3838443 MICROWAVE POWER TRANSISTOR CHIP CARRIER  
A low-cost mounting assembly for a microwave power transistor chip used in hybrid circuits, which minimizes package parasitics while allowing adequate heat transfer from the transistor chip to a...
3825805 TRANSISTOR CARRIER FOR MICROWAVE STRIPLINE CIRCUIT  
A transistor carrier adapted to be mounted in a microwave transmission line including a metal substrate which is adapted to be connected to the ground plane of the transmission line and a pair of...
3801938 PACKAGE FOR MICROWAVE SEMICONDUCTOR DEVICE  
A package for holding a microwave semiconductor device adapted for use with strip transmission line. A multilayer structure is assembled upon a conductive header, the elements of the multilayer...
3786375 PACKAGE FOR MOUNTING SEMICONDUCTOR DEVICE IN MICROSTRIP LINE  
In a microstrip line, a package for mounting a required semiconductor device between a pair of blocks of dielectric material disposed on a first conductive plate to be spaced apart a predetermined...
3784884 LOW PARASITIC MICROWAVE PACKAGE  
A low parasitic microwave transistor package is provided with a pair of parallel rectangular bonding rails extending from the metal header. A first insulating body having a metal film thereon is...
3784883 TRANSISTOR PACKAGE  
In a transistor packaging having an input, an output and a common lead, the common lead includes a pair of terminal strip portions disposed on opposite sides of the transistor die. An array of...
3774123 BROAD BAND MICROSTRIP N-POLE M-THROW PIN DIODE SWITCH HAVING PREDETERMINED SPACING BETWEEN POLE AND THROW CONDUCTORS  
The bandwidth characteristic of a microstrip N-pole M-throw switch is improved by providing the spacing, which is between a printed pole conductor and a printed throw conductor thereof and across...
3767979 MICROWAVE HERMETIC TRANSISTOR PACKAGE  
A ceramic stripline structure having an input stripline and an output stripline is mounted upon an electrically and thermally conductive base structure for attachment to a heat sink. A hollow...
3753056 MICROWAVE SEMICONDUCTOR DEVICE  
Semiconductor devices, such as transistors or diodes, which dissipate appreciable heat, may be mounted on an insert having high thermal conductivity in a discrete component configuration. This...
3740672 SEMICONDUCTOR CARRIER FOR MICROWAVE APPLICATIONS  
A semiconductor carrier, having microstrip transmission means designed integrally into the carrier structure, includes a ground plane member of electrical and thermally conductive material having...
3733525 RF MICROWAVE AMPLIFIER AND CARRIER  
A power transistor and carrier advantageous for RF power (e.g. microwave) amplifier applications with improved linearity in class AB operation. The carrier comprises a channel-shaped member having...
3731160 MICROWAVE SEMICONDUCTOR DEVICE ASSEMBLY  
A semiconductor device assembly includes a semiconductor element mounted on a pedestal of a mounting plate. The mounting plate is secured between a pair of flanges, and co-axial terminals extend...
3715631 RADIO-FREQUENCY LINE  
A radio-frequency line suitable for use as an electrical supply lead to semiconductor components, comprising a semiconductor body containing at least one semiconductor component and a strip line...
3711778 MICROWAVE MICROCIRCUIT  
A high frequency or microwave microcircuit device is disclosed having application as an integrated circuit element for electromagnetic signal frequency conversion performing, for example,...
3698082 COMPLEX CIRCUIT ARRAY METHOD  
A method for fabricating an integrated circuit array supporting substrate having coaxial transmission lines formed about a core means in proper position for electrically connecting integrated...
3697901 MICROSTRIP CIRCUITS WHEREIN NON-MAGNETIC INSULATING SUBSTRATE AND MAGNETIC INSERT HAVE SAME CRYSTALLINE STRUCTURE  
Microwave integrated circuits are designed as microstrip patterns on insulating non magnetic substrates with the same crystalline structure as magnetic materials operating in the same frequency...
3697831 SERIES ELECTRICAL, PARALLEL THERMAL GUNN DEVICES  
A plurality of Gunn devices are electrically connected in series and therly connected in parallel and include a layer of active semiconductive material, a first plurality of electrical contacts...
3683241 RADIO FREQUENCY TRANSISTOR PACKAGE  
A transistor die is mounted over a pair of mutually opposed ceramic filled microstrip lines having a common ground plane, one of these strip lines being an input strip line and the other being an...
3673470 HOUSING FOR TRANSISTORS HAVING UNSOLDERED CONNECTIONS FOR OPERATING AT VERY HIGH FREQUENCIES  
The device enables a transistor to be removed from a circuit without its connections having to be unsoldered or soldered again, and comprises a middle part bearing the transistor, one of whose...
3670218 MONOLITHIC HETEROEPITAXIAL MICROWAVE TUNNEL DIE  
A monolithic heteroepitaxial microwave tunnel diode with a vertical tunnel junction is manufactured from an insulating substrate on which a layer of p-type semiconductor material has been grown. A...
3651434 MICROWAVE PACKAGE FOR HOLDING A MICROWAVE DEVICE, PARTICULARLY FOR STRIP TRANSMISSION LINE USE, WITH REDUCED INPUT-OUTPUT COUPLING  
An hermetically sealed microwave package for holding a transistor or other microwave device has a multiplane terminal arrangement which facilitates use with strip transmission line. Input and...
3628105 HIGH-FREQUENCY INTEGRATED CIRCUIT DEVICE PROVIDING IMPEDANCE MATCHING THROUGH ITS EXTERNAL LEADS  
A semiconductor integrated circuit means comprising a semiconductor substrate having a plurality of circuit elements formed therein and a package enclosing said substrate, wherein the wires for...
3614546 SHIELDED SEMICONDUCTOR DEVICE  
A dual-in-line type device comprises an elongated, rectangular envelope. Emerging from each of two opposed, elongated sides of the envelope is a row of leads. Disposed along the other elongated...
3611146 INTEGRATED MICROWAVE RADIATOR AND GENERATOR  
A hybrid integrated microwave radiator includes a negative resistance semiconductor element mounted on a dipole radiator. The hybrid integrated circuit provides an impedance-transforming network...
3609573 BALANCED AMPLIFIER  
A balanced transistor amplifier is disposed on a slab of electrically and thermally conductive material. Two transistors are fixed in thermal contact with the slab. A 3 db. quadrature coupler...
3609473 A TWO-LAYER METALLIZED HIGH FREQUENCY TRANSISTOR EMPLOYING EXTENDED CONTACTS TO SHIELD INPUT TERMINAL FROM OUTPUT TERMINAL AND MOUNTED IN A COAXIAL CABLE  
The base and emitter contacts to a high frequency transistor are formed of two separate layers of metallization separated by an intervening dielectric. Either the base or the emitter lead is...
3598761 CONDUCTOR COMPOSITIONS FOR MICROCIRCUITRY