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5534732 Single twist layout and method for paired line conductors of integrated circuits  
An interconnection array layout and method are provided for a plurality of paired line conductors of a given length extending principally parallel. A single crossing region traverses the paired...
5530285 Low-impedance surface-mount device  
A SMD with an RF semiconductor chip (1) encapsulated in a plastic housing is provided. The device has at least one active RF component or an integrated RF circuit with terminal locations, these...
5528074 Microwave semiconductor device and integrated circuit including microwave semiconductor devices  
A semiconductor device includes a substrate having a microwave semiconductor element, a microwave transmission line disposed on the substrate and electrically connected to the microwave...
5495125 Molded semiconductor device  
It is an object of the present invention to provide a molded semiconductor device which allows its package to be mounted on an external circuit even if the width of the conductor of a...
5477085 Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits  
The present invention provides a bonding structure between a dielectric substrate made of a dielectric material and a packaging substrate made of a heat conductive material involved in microwave...
5477083 Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon  
A chip carrier for a semiconductor chip, the chip having a specified thickness and lateral configuration and size. A conductive holder of the carrier has a main surface including a chip mounting...
5459343 Back gate FET microwave switch  
A semiconductor device which includes a channel region of predetermined conductivity type having a pair of opposing surfaces (11 or 33) , a control element of opposite conductivity type disposed...
5449953 Monolithic microwave integrated circuit on high resistivity silicon  
A silicon-based monolithic microwave integrated circuit architecture is described. This architecture, called MICROX™, is a combination of silicon material growth and wafer processing technologies....
5428247 Down-bonded lead-on-chip type semiconductor device  
Disclosed is a semiconductor device wherein the down bonding and the mounting of multi-pin is made possible. A conductive member adhered to the bottom surface of the semiconductor element. The...
5406118 Semiconductor integrated circuit having a long bus line  
A semiconductor chip includes a long bus line for transmitting digital signals. The semiconductor chip includes transmission lines for transmitting signals between the bus line and other lines. An...
5406125 Semiconductor device having a metalized via hole  
A semiconductor device having a metalized via hole used when mounting and connecting semiconductor chips, such as microwave chips, digital chips, analog chips and the like, on a top portion of a...
5387888 High frequency ceramic multi-layer substrate  
A high frequency ceramic multi-layer substrate includes a stripline embedded between two dielectric layers having ground electrodes at the top surface and at the bottom surface thereof and an...
5376909 Device packaging  
This is a package [10] for an rf device [11] operable with a characteristic impedance providing a plurality of terminals [12-19] and [101] for effecting circuit connections to the device, the...
5373187 Package body for integrated circuit  
A package body for an integrated circuit is provided with a substrate having a mounting portion for mounting the integrated circuit. A terminal member for high speed signal input-output is...
5371405 High-frequency high-power transistor  
An improved high-frequency high-power transistor includes a transistor chip and capacitors forming an RF shunting internal matching circuit. The capacitors are connected with RF shunting wires to...
5357138 Coaxial wiring pattern structure in a multilayered wiring board  
In a thick multilayered wiring board, a coaxial signal wiring pattern is surrounded by upper and lower horizontal grounded conductive layers and vertical grounded conductive layers and the...
5355102 HDI impedance matched microwave circuit assembly  
Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching,...
5338897 Coaxial shield for a semiconductor device  
In a semiconductor device, an on chip coaxial cable reduces noise from adversely affecting a signal transmitted by a signal conductor. The signal conductor lies within and is isolated from a...
5338970 Multi-layered integrated circuit package with improved high frequency performance  
A multi-layered package is disclosed that employs novel shielding techniques to improve high frequency performance of the package. Shield vias are placed near conductive vias to create a two-wire...
5332918 Ultra-high-speed photoconductive devices using semi-insulating layers  
An ultra-high-speed photoconductive device is described which comprises a homoepitaxial semi-insulating III-V layer, or body, upon which ohmic/conductive contacts, or strips, separated by a small...
5309015 Clock wiring and semiconductor integrated circuit device having the same  
In a clock wiring of a semiconductor integrated circuit device or a printed wiring, a shield clock wiring to be connected with the same drive source as a drive source to be connected with the...
5307237 Integrated circuit packaging with improved heat transfer and reduced signal degradation  
An integrated circuit packaging system with an integrated circuit die mounted onto a substrate having a top side ground plane between the integrated circuit and the substrate, a bottom side ground...
5266912 Inherently impedance matched multiple integrated circuit module  
A multichip module (MCM) is formed with external connections on coaxial pins. This provides an impedance between a ground connection and a signal connection which is substantially equal per unit...
5214845 Method for producing high speed integrated circuits  
This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or...
5212403 Integrated circuit device having an ic chip mounted on the wiring substrate and having suitable mutual connections between internal circuits  
This invention discloses an integrated circuit device including an integrated circuit chip having logic circuits formed therein and a wiring substrate for mounting thereon the integrated circuit...
5185650 High-speed signal transmission line path structure for semiconductor integrated circuit devices  
A high-speed semiconductor integrated circuit device has a main circuit section formed on a substrate, and a capacitance section formed on the substrate to surround the main circuit section. The...
5184210 Structure for controlling impedance and cross-talk in a printed circuit substrate  
An arrangement for interconnecting high density signals of integrated circuits includes an electronic circuit on a multilayered substrate which includes at least three layers. These layers...
5182631 Film carrier for RF IC  
A waveguide film carrier includes an insulating flexible substrate, RF, bias supply and ground electrodes formed on the insulating flexible substrate, and conductive leads connected to the...
5173767 Integrated circuit housing composed of three coated, dielectric plates  
Integrated circuit housing composed of three coated dielectric plates. The integrated circuit housing with the three coated dielectric plates has a signal plane, a supply voltage plane and ground...
5162896 IC package for high-speed semiconductor integrated circuit device  
A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown....
5136357 Low-noise, area-efficient, high-frequency clock signal distribution line structure  
An area-efficient, low-noise transmission line structure for use in integrated circuits, which may be used to carry a high-frequency AC signal from a source location to one or more destination...
5089878 Low impedance packaging  
A package for an integrated circuit is disclosed. The package includes a lead frame with an overlying dielectric layer. One or more conductive coupons are placed on the dielectric layer and act as...
5086329 Planar gallium arsenide NPNP microwave switch  
A microwave switch is provided for controlling the transmission of microw energy in a microstrip transmission line structure. The microwave switch comprises an electrically conducting ground plane...
5072133 Method and apparatus for increasing resistance of bipolar buried layer integrated circuit devices to single-event upsets  
Bipolar transistors fabricated in separate buried layers of an integrated circuit chip are electrically isolated with a built-in potential barrier established by doping the buried layer with a...
5065226 Laser diode module  
A laser diode module includes a rectangular box-shaped metal casing having a bottom (B), an even number of guide pins (1-14) being led through the bottom (B) in a standardized DIL order. In...
5027192 Fast power semiconductor circuit  
In a fast power semiconductor circuit with a gate turn-off component in the form of a large-area semiconductor substrate (9) and a drive circuit, which is connected to gate and cathode of the...
5012321 Interconnection device between the cells of a pre-implanted hyperfrequency integrated circuit  
The invention concerns pre-implanted circuits in a rapid semiconductor such as GaAs, comprising a network of cells formed of active and passive components. The cells are supplied but are not...
5012319 Integrated electronic assembly comprising a transmission line  
Integrated electronic assemblies according to the invention, typically semiconductor IC chips, comprise an air gap transmission line. The line has high propagation speed and low dispersion, and...
4989930 Optoelectronics package  
A novel optoelectronics package includes an optical semiconductor, an electronic cooling element carrying the optical semiconductor and electrically connected to one of the terminals thereof, a...
4978910 Electrooptic apparatus for the measurement of ultrashort electrical signals  
An electrooptic measuring apparatus having both high voltage sensitivity and femtosecond time resolution includes coplanar transmission lines fabricated on a semi-insulating multiple quantum well...
4953001 Semiconductor device package and packaging method  
A semiconductor device package is provided to enclose a microstrip transmission line having a ground plane separated from a strip conductor by a dielectric and a semiconductor device having an...
4916515 Microwave circuit integrating  
A microwave integrated circuit includes a silicon chip having a pair of diffused junctions. A pair of gold leads 0.3 mils thick are in contact with respective ones of the diffused junctions...
4905071 Monolithic series-shunt diode switch  
A switching circuit comprising a substrate of semiconductor material, a first switching device (e.g., a diode) formed in a first region of the substrate, a second switching device (e.g., a diode)...
4897622 Single sideband waveguide modulator  
A novel single sideband electro-optic modulator includes a planar waveguide structure allowing only circularly polarized optical and microwaves to propagate therein with equal phase velocities...
4896194 Semiconductor device having an integrated circuit formed on a compound semiconductor layer  
A semiconductor device includes a Si substrate, a compound semiconductor layer selectively formed on one main surface of the Si substrate, a hole formed in the Si substrate to expose a portion of...
4891686 Semiconductor packaging with ground plane conductor arrangement  
Packaging techniques are described which provide electrical, thermal, and mechanical advantages. A low-profile semiconductor package is described in which the leads are flat and are present in the...
4891687 Multi-layer molded plastic IC package  
A multi-layered molded plastic package for encapsulating an integrated circuit is described. The package includes a carrier having a double-layered metal plate which are separated by an adhesive...
4890155 Package for mounting a semiconductor chip of ultra-high frequency  
A semiconductor chip, which operates in a range of ultra-high frequency, is mounted on a package including an insulation layer on which input and output conductive patterns are formed. A metalized...
4887148 Pin grid array package structure  
A pin grid array package structure includes a package body member (12), a wiring board (14) having a central portion for receiving a semiconductor chip (18), a tape lead circuit (16), and a cover...
4879588 Integrated circuit package  
An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and...