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6569757 Methods for forming co-axial interconnect lines in a CMOS process for high speed applications  
A method of forming a co-axial interconnect line in a dielectric layer is provided. The method includes defining a trench in the dielectric layer and then forming a shield metallization layer...
6552422 Data carrier with an integrated electronic component and with a transmission coil which comprises turn portions arranged directly against said component  
In a data carrier (1) with an integrated electronic component (3) and with a transmission coil (12), short turn portions (21, 22, 23, 24, and 25) of the transmission coil (12) are formed by...
6545348 Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip  
A first interconnection pattern having a comb shape is formed around a semiconductor chip on a package body. A second interconnection pattern having a comb shape is formed around the first...
6534725 High-frequency circuit board and semiconductor device using the high-frequency circuit board  
A high-frequency switch includes: a high-frequency circuit board including an MIC substrate, a microstrip line disposed on a front surface of the MIC substrate, and a signal wiring layer and a...
6525410 Integrated circuit wireless tagging  
A semiconductor device comprising an integrated circuit and an information unit, said unit being electrically separate from said integrated circuit; an integrated antenna electrically connected...
6501166 Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance  
Conductive planes in a power delivery region of a microelectronic package substrate are stitched to correlated conductive planes in a signal region of the substrate. The conductive planes occupy...
6459343 Integrated circuit interconnect system forming a multi-pole filter  
In an interconnect system for providing access to a common I/O terminal for multiple circuit devices such as drivers, receivers and electrostatic discharge (ESD) protection devices implemented on...
6455932 Ceramic package for semiconductor device  
A semiconductor chip is mounted on a bottom plate, on which a side wall surrounding the semiconductor chip is formed. At a position where a lead passes through the side wall, an inner surface of...
6452254 Optical package with dual interconnect capability  
An electronic package is adapted to be coupled in a single-ended configuration and in a differential configuration. The package provides a characteristic impedance of approximately 50 ohms when...
6452267 Selective flip chip underfill processing for high speed signal isolation  
An integrated circuit device includes electrical conductors providing electrical communication between a substrate and a silicon chip. The silicon chip has first electronics and second...
6448591 Metallization line layout  
The present invention relates to metallization line layouts that minimize focus offset sensitivity by a substantial elimination of thin isolated metallization line segments that are inadequately...
6441471 Wiring substrate for high frequency applications  
A high frequency wiring substrate comprises surface transmission line conductors formed on upper and lower surfaces of a dielectric substrate and surrounded by respective surface ground...
6441470 Technique to minimize crosstalk in electronic packages  
The present invention is a technique to minimize crosstalk in multilayer IC packages. According to one or more embodiments of the present invention, signal routing layers are separated by planes...
6437426 Semiconductor integrated circuit having an improved grounding structure  
In a semiconductor integrated circuit, a ground plane conductor 3 is formed in a substrate 9 to oppose to a conducting line 2 formed on the substrate, so as to form a microstrip line. A decoupling...
6433408 Highly integrated circuit including transmission lines which have excellent characteristics  
An integrated circuit is composed of a substrate, a first conductor formed on the substrate, an insulating film formed on the first conductor and the substrate, a second conductor formed on the...
6426686 Microwave circuit packages having a reduced number of vias in the substrate  
A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal...
6423981 Low-loss elementary standard structure for the calibration of an integrated circuit probe  
The invention relates to an elementary standard structure for the determining of the RF characteristics of an RF integrated circuit probe, comprising at least two contact pads deposited on a...
6420778 Differential electrical transmission line structures employing crosstalk compensation and related methods  
A multilayer circuit structure characterized by reduced crosstalk includes first and second superposed planar dielectric layers. On the first layer, first and second conductor lines are formed,...
6388338 Plastic package for an integrated electronic semiconductor device  
The invention relates to a plastic package for an integrated electronic semiconductor device to be encapsulated within a plastic body, the plastic bodyes formed using the step of molding said...
6384701 Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks  
A microwave and millimeter wave device includes: a dielectric substrate including at least one signal line, a passive circuit and a first grounding conductor portion which are formed on a surface...
6380623 Microcircuit assembly having dual-path grounding and negative self-bias  
A microwave-frequency microcircuit assembly includes an integrated circuit structure having a circuit ground. A support structure includes a grounded metallic carrier, and a dielectric substrate...
6356173 High-frequency module coupled via aperture in a ground plane  
A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices...
6346741 Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same  
An integrated circuit structures formed by chemical mechanical polishing (CMP) process, which comprises a conductive pathway recessed in a dielectric substrate, wherein the conductive pathway...
6344667 Wiring board with reduced radiation of undesired electromagnetic waves  
On an insulated substrate, subwires are provided along both sides of a main wire, and further, an inverse signal of a signal input to the main wire is input to the subwires, and in addition, the...
6323533 Semiconductor device with an operating frequency larger than 50 MHz comprising a body composed of a soft ferrite material  
A semiconductor device (1) with an operating frequency above 50 MHz comprises a body (2) composed of a soft ferrite material, which body (2) has a surface (3) to which a semiconductor element (4),...
6319616 Scaled interconnect anodization for high frequency applications  
A method of forming a conductive line structure is provided. An adhesion layer is formed on a substrate surface. A seed layer is formed on the adhesion layer. A conductor is formed on the seed...
6310401 Substrate for high-voltage modules  
A metallic-ceramic substrate having a ceramic layer and metal layers on both sides of the ceramic layer is provided with a high-impedance layer at the surface of the ceramic layer. The...
6297700 RF power transistor having cascaded cells with phase matching between cells  
The power delivered by an RF power transistor having cascaded cells or unit elements is improved by reducing the phase imbalance between elements and thereby reducing transverse effects between...
6294827 Hybrid microwave-frequency integrated circuit  
In a microwave hybrid integrated circuit a metallized recess (8) is formed on the back or face side of a board (1) of the metallization of which recess serves as a bottom plate (6) of a capacitor...
6285269 High-frequency semiconductor device having microwave transmission line being formed by a gate electrode source electrode and a dielectric layer in between  
A drain electrode and a source electrode are provided for an intrinsic device section on a GaAs substrate with a gate electrode placed therebetween. Almost all or substantial parts of the GaAs...
6271579 High-frequency passband microelectronics package  
A high-frequency passband microelectronic package suitable for housing a high-frequency (e.g.,GHz range) electronic device operating at frequencies within the passband is disclosed herein. The...
6255730 Integrated low cost thick film RF module  
An integrated low cost thick film RF module and method for making same. An improved thick film dielectric is employed to build three-dimensional, high frequency structures. This new dielectric can...
6249013 Microwave-millimeter wave circuit device and method for manufacturing the same  
A microwave-millimeter wave circuit device with a coplanar wiring includes a dielectric substrate having a dielectric region, a ground conductor connecting wiring and circuit elements formed on...
6246108 Integrated circuit package including lead frame with electrically isolated alignment feature  
An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially...
6242796 Wiring structure of semiconductor memory device and formation method thereof  
Disclosed is a coaxial tube wiring structure (and method of making) of a semiconductor memory device for shielding a conductive film that transmits a signal. The coaxial tube structure includes: a...
6235997 LSI package with equal length transmission Lines  
An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which...
6225690 Plastic ball grid array package with strip line configuration  
A semiconductor package is disclosed. According to one embodiment, the package comprises a substrate having a top surface with traces thereon and a bottom surface with solder balls thereon, the...
6201459 Transmission line with voltage controlled impedance and length  
Transmission lines have variable characteristic impedance and length which may also be integrated with modulators and switches. The external electrical voltage controls the number of loads...
6201454 Compensation structure for a bond wire at high frequency operation  
An improved frequency response for a bond wire (1) at high frequency operation is realized by using a matching element (13) including a meander line (9) structure. The frequency response is...
6181004 Digital signal processing assembly and test method  
A printed circuit module supports host processors and memories. The module permits easy upgrades and repairs of the semiconductor devices without requiring modification of the motherboard. The...
6172412 High frequency microelectronics package  
A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity...
6133621 Integrated shielded electric connection  
A shielded electrical connection of the integrated type comprises a connection element and a shielding element. The connection element includes a first substantially planar structure of a first...
6130478 Polymer stud grid array for microwave circuit arrangements  
A polymer stud grid array for microwave circuits is proposed which includes an injection-molded, three-dimensional substrate that is fabricated from an electrically insulating polymer. The...
6118350 Bus through termination circuit  
A system of resistive end termination and transmission line routing is disclosed for matching the impedance of an IC load to that of a signal source and a transmission line. Each integrated...
6118357 Wireless MMIC chip packaging for microwave and millimeterwave frequencies  
A wireless MMIC chip packaging scheme where the MMIC chip (38) is maintained right side up. The MMIC chip (38) is positioned within a cavity (40) of a fixture (42), where a backside metal layer...
6097097 Semiconductor device face-down bonded with pillars  
A face-down-bonded semiconductor device having: a semiconductor substrate having a semiconductor electric/electronic circuit formed on the surface of the semiconductor substrate, the circuit...
6094114 Slotline-to-slotline mounted flip chip  
A high frequency circuit structure including a base substrate having a planar face, a first base slotline mounted on the base substrate face and consisting of first and second, spaced-apart...
6091150 Integrated circuitry comprising electrically insulative material over interconnect line tops, sidewalls and bottoms  
A semiconductor processing method of forming an electrically conductive interconnect line having an electrical conductive covering predominately coextensive therewith, includes, a) providing an...
6075423 Controlling signal trace characteristic impedance via a conductive epoxy layer  
A conductive ground layer provides a low cost method of reducing, controlling, or tailoring printed circuit board (PCB), for example, a motherboard, trace impedance and/or size, cross-talk, and...
6060968 Device with circuit element and transmission line formed by a dielectric between facing conductor strips  
A device for processing electromagnetic waves in the microwave range, with a body provided with a circuit element which is electrically connected to a strip-type transmission line which comprises...