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7605450 High frequency arrangement  
A high frequency arrangement is provided that includes an integrated high frequency circuit, a first bond pad, which is electrically connected by a first electrical supply line, in particular a...
7602049 Capacitive techniques to reduce noise in high speed interconnections  
Improved methods and structures are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. Embodiments of an electronic device...
7595546 Printed circuit board  
Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions....
7592879 Integrated circuit with at least one integrated transmission line  
An integrated circuit is disclosed that includes at least one integrated transmission line for the transmission of a high-frequency differential signal with a number of at least two...
7569916 Separable network interconnect systems and assemblies  
Microelectronic assemblies interconnected using a separable network interface and electronic systems using the microelectronic assemblies to physically separate high performance signals and lower...
7550854 Integrated interconnect arrangement  
An explanation is given of an integrated interconnect arrangement having a plurality of interconnects that cross over one another at two crossover sections. By virtue of this measure, it is...
7547558 Method for manufacturing semiconductor device  
An Al2O3 film for covering a ferroelectric capacitor is formed by a sputtering process. The thickness of the Al2O3 film is preferably optimized according to amount of remanent polarization and...
7504711 Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof  
A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip...
7495318 Apparatus and method for improving AC coupling on circuit boards  
The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit...
7483286 Semiconductor memory device with high permeability lines interposed between adjacent transmission lines  
A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically...
7470937 Optical module  
An optical module comprises: a stem; a protruding portion on a surface of the stem; an optical semiconductor device mounted on the protruding portion; a power supply terminal penetrating through...
7468560 Semiconductor device with micro connecting elements and method for producing the same  
A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for...
7457337 Optical module having case grounding using bypass capacitor  
According to embodiments of the present invention, an optical transponder includes a transmitter optical subassembly (TOSA). In one embodiment, the electrical ground of the TOSA may be DC-isolated...
7411279 Component interconnect with substrate shielding  
An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along...
7391099 Optical modulator module  
A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted...
7375414 High permeability layered films to reduce noise in high speed interconnects  
This invention provides a structure and method for improved transmission line operation on integrated circuits. One method of the invention includes forming transmission lines in an integrated...
7365415 High frequency semiconductor device  
A semiconductor device has a mounting substrate and a semiconductor package mounted on the mounting substrate. The mounting substrate has a substrate body, input/output line conductors on the...
7361975 Semiconductor integrated circuit having reduced cross-talk noise  
A semiconductor integrated circuit, includes a shielded wire line and a shielding wire line provided for the shielded wire line and divided into a plurality of segments in a longitudinal direction...
7352059 Low loss interconnect structure for use in microelectronic circuits  
A low loss on-die interconnect structure includes first and second differential signal lines on one of the metal layers of a microelectronic die. One or more traces may also be provided on another...
7335968 High permeability composite films to reduce noise in high speed interconnects  
A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive...
7321167 Flex tape architecture for integrated circuit signal ingress/egress  
In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is...
7312528 Semiconductor device having antenna connection electrodes  
A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of...
7298046 Semiconductor package having non-ceramic based window frame  
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
7286029 Passive devices formed in grooves on a substrate and a method of manufacture  
A method for constructing passive devices on a substrate and a device is provided that is fabricated in accordance with the a method. The method includes the steps of: forming a plurality of...
7244977 Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device  
A semiconductor memory device includes a vertical MISFET having a source region, a channel forming region, a drain region, and a gate electrode formed on a sidewall of the channel forming region...
7239013 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device  
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a...
7239002 Integrated circuit device  
In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided...
7230319 Electronic substrate  
A substrate for mounting a device is disclosed. The substrate includes at least one transition for providing an RF connection to a lead of the device, the lead extending from a device input to an...
7215007 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards  
Apparatus for suppressing noise and electromagnetic coupling in the printed circuit board of an electronic device includes an upper conductive plate and an array of conductive coplanar patches...
7206515 Single-ended/differential wired radio frequency interface  
A package to encapsulate an optical component includes a RF interface to receive high frequency signals from an external source. The RF interface pins that can be configured as one or more...
7187061 Use of a down-bond as a controlled inductor in integrated circuit applications  
A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a...
7187062 Coupler detector  
The present invention is a coupler built on a semiconductor substrate, e.g. GaAs. Semiconductor processing allows for small trace and space rules. The tighter design rules provide for tighter...
7161244 Microwave device for dissipating or attenuating power  
The present invention relates to a microwave device for at least one of dissipating and attenuating power, the device comprising: an insulating substrate;at least one conductive strip of a...
7161450 Microwave transmission line having dielectric film layers providing negative space charge effects  
A microwave transmission line includes a substrate of high-resistivity silicon, a first dielectric film and a second dielectric film successively formed on the principal surface of the substrate...
7142822 Package device for accommodating a radio frequency circuit  
A compact package whose inner walls can be located near a radio frequency circuit without changing the characteristics of the radio frequency circuit has a planar circuit on the bottom of the...
7132740 Semiconductor package with conductor impedance selected during assembly  
A semiconductor package having a plurality of conductors arrayed in two (or more) parallel planes, and an available ground conductor. Conductors in the auxiliary or second plane substantially...
7112870 Semiconductor integrated circuit device including dummy patterns located to reduce dishing  
A large area dummy pattern DL is formed in a layer underneath a target T2 region formed in a scribe region SR of a wafer. A small area dummy pattern in a lower layer and a small area dummy pattern...
7109531 High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment  
A high frequency switch, has a transmitting terminal, a receiving terminal, an antenna terminal, a first diode having an anode electrically connected to the transmitting terminal and a cathode...
7109569 Dual referenced microstrip  
Structures and methods are provided for dual referenced microstrip structures having low reference discontinuities between a microstrip trace referenced to a primary reference plane as compared to...
7105928 Copper wiring with high temperature superconductor (HTS) layer  
Semiconductor devices and methods of forming the semiconductor devices using an HTS (High Temperature Superconductor) layer in combination with a typical diffusion layer between the dielectric...
7087983 Manufacturing methods of semiconductor devices and a solid state image pickup device  
A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by...
7042067 Transmission line with integrated connection pads for circuit elements  
An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary...
7030477 Optical semiconductor device  
A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front...
7030470 Using chip lamination to couple an integrated circuit with a microstrip transmission line  
One embodiment of the present invention provides a system that operatively couples an integrated circuit with a microstrip transmission line through chip lamination. The system includes a first...
7015569 Method and apparatus for implementing a co-axial wire in a semiconductor chip  
A coaxial shield for a semiconductor chip includes: a top vertical shield wire formed in a top metal layer of a semiconductor chip wherein the top vertical shield wire has a selected length for...
7015869 High frequency antenna disposed on the surface of a three dimensional substrate  
The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a...
7012337 Semiconductor device including a photosensitive resin covering at least a portion of a substrate having a via hole  
A semiconductor device includes a substrate with a via hole. An electrode is formed on a surface of the substrate so that a portion of the electrode extends through the via hole. A photosensitive...
7002215 Floating entrance guard for preventing electrical short circuits  
Methods and apparatuses are provided for protecting an interconnect line in a microelectromechanical system. The interconnect line is disposed over a substrate for conducting electrical signals,...
6998709 RFIC die-package configuration  
A RFIC includes a die and a package. The die contains a radio frequency (RF) input/output (I/O) section, an RF-to-baseband conversion section, and a baseband processing section. The package...
6995457 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board  
A wiring structure including a transmission line structure capable of simplifying a manufacturing process is obtained. This wiring structure comprises a first trench formed on a first insulator...