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RE43720 Integrated circuit device having stacked dies and impedance balanced transmission lines  
A multi-chip device which includes a plurality of integrated circuit die disposed one over another. Each integrated circuit die includes one or a plurality of bond pads. One or a plurality of...
8279025 Slow-wave coaxial transmission line having metal shield strips and dielectric strips with minimum dimensions  
An integrated circuit structure includes an interconnect structure over a semiconductor substrate and a coaxial transmission line. The coaxial transmission line includes a signal line, a top plate...
8274343 Stacked coplanar waveguides having signal and ground lines extending through plural layers  
An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the...
8258606 High frequency flip chip package structure of polymer substrate  
A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer...
8258014 Method of manufacturing a power transistor module and package with integrated bus bar  
According to an embodiment of a method of manufacturing a power transistor module, the method includes mechanically fastening a first terminal, a second terminal and at least two different DC bias...
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels  
An integrated circuit arrangement includes a substrate with a multiplicity of integrated semiconductor components arranged therein, the substrate having a wiring interconnect near to the...
8254136 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board  
A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a...
8178974 Microstrip structure including a signal line with a plurality of slit holes  
A semiconductor device comprising a signal transmission line of a microstrip structure, capable of increasing the characteristic impedance of the signal transmission line and reducing coupling...
8169276 Vertical transmission line structure that includes bump elements for flip-chip mounting  
A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission...
8143974 Coplanar waveguide having trenches covered by a passivation film and fabrication method thereof  
A coplanar waveguide includes a signal line formed on a major surface of a high-resistivity silicon substrate, a pair of ground conductors placed on opposite sides of the signal line, and a pair...
8130513 Radio-frequency package  
A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal...
8102036 Semiconductor device in which a semiconductor chip is sealed  
A semiconductor device having a GaAsFET and input and output matching circuits connected to the FET is provided. In the semiconductor device, a line, including a wire connection portion connected...
8080880 Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads  
A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact...
8067814 Semiconductor device and method of manufacturing the same  
In the present invention, a first circuit pattern 3 composing a semiconductor element is formed on the front side of a substrate 1, a first insulating layer 2 is formed on the first circuit...
8058953 Stacked coplanar waveguide having signal and ground lines extending through plural layers  
An integrated circuit structure includes a semiconductor substrate; an interconnect structure over the semiconductor substrate; a first dielectric layer over the semiconductor substrate and in the...
8013427 Wiring board and electrical signal transmission system  
A wiring board equipped with differential lines which compensate for differences in via lengths to minimize signal deterioration is disclosed. Two conductors are couple to different substrate...
8008193 Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor  
Provided is a manufacturing method for improving the reliability of a semiconductor device having a back electrode. After formation of semiconductor elements on the surface of a silicon substrate,...
7994630 Power transistor package with integrated bus bar  
According to one embodiment, a power transistor package includes an electrically conductive flange configured to be connected to a source of a power transistor device. The package further includes...
7989915 Vertical electrical device  
A vertical electrical device includes a region in a substrate extending from a surface of the substrate, the region having an inner wall and an outer wall circumscribing the inner wall. An inner...
7989929 Direct-connect signaling system  
A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal...
7986020 Optical communication module and flexible printed circuit board  
A flexible printed circuit board includes: a signal wiring pattern including: a transmission line for connecting an end of an optical device with an end of a signal generation circuit; and another...
7965521 Electromagnetic bandgap structure and printed circuit board  
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an...
7944026 Semiconductor device  
A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A...
7940143 Vertical transmission line structure that includes bump elements for flip-chip mounting  
A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission...
7935990 RF power amplifier and method for packaging the same  
A method and apparatus is provided for use in power amplifiers for reducing the peak voltage that transistors are subjected to. A power amplifier is provided with first and second switching...
7928539 Semiconductor device  
A semiconductor device (1) includes a wiring (10) and dummy conductor patterns (20). The wiring (10) is a wiring through which a current with a frequency of 5 GHz or higher flows. Near the wiring...
7856710 Method of manufacturing printed wiring board  
A method of manufacturing a printed wiring board including preparing a high-dielectric capacitor sheet including a ceramic high-dielectric layer sandwiched by upper and lower electrode sheets,...
7851895 Semiconductor structure and semiconductor manufacturing method  
A semiconductor structure comprising a first signal layer, a second signal layer, a wiring layer and at least one via is provided. The wiring layer is formed between the first signal layer and the...
7851918 Three-dimensional package module  
Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which...
7842546 Integrated circuit module and method of packaging same  
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the...
7838409 Structures and methods for an application of a flexible bridge  
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active...
7838990 High-frequency hermetically-sealed circuit package  
A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements,...
7838420 Method for forming a packaged semiconductor device  
A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to...
7821108 Systems and methods for lowering interconnect capacitance through adjustment of relative signal levels  
Methods and circuitry for lowering the capacitance of interconnects, particularly Through Wafer Interconnects (TWIs), using signal level adjustment are disclosed. Embodiments of the invention seek...
7787831 High-frequency switch  
A high-frequency switch is constructed by connecting a first diode and a second diode that function as switching elements, inductors, capacitors, and resistors. One end of the resistor is...
7777307 High-frequency signal transmission circuit device  
A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a...
7772694 Integrated circuit module and method of packaging same  
An integrated circuit (IC) module (20) includes a ground plane (22) having adjoining cutouts (30, 32). The cutout (32) defines a critical signal pathway (38). A device (24) is positioned in the...
7768117 Microelectronic package having interconnected redistribution paths  
A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further...
7755174 Integrated electronic components and methods of formation thereof  
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated...
7743482 Fabricating method of a semiconductor device  
A semiconductor device and fabricating method thereof are provided. A first substrate with an inductor cell and a through-electrode is connected to a second substrate having an RF device circuit...
7737536 Capacitive techniques to reduce noise in high speed interconnections  
Structures, in various embodiments, are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. In an embodiment, a transmission...
7730614 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Method of manufacturing printed wiring board
 
A method of manufacturing a printed wiring board including preparing a high-dielectric capacitor sheet including a ceramic high-dielectric layer sandwiched by upper and lower electrode sheets,...
7724558 Magnetic signal transmission line  
A magnetic signal transmission line includes a one-dimensional array of a plurality of single-magnetization domains each formed in a ferromagnetic body. The anisotropic energy of the...
7714411 Electro-optical device, method of manufacturing the same, and electronic apparatus  
An electro-optical device includes: a substrate; a plurality of wiring lines which is formed on the substrate; and an IC which is mounted on the substrate so as to be electrically connected to the...
7692305 Power feed device to power pins of electrical component  
A power feed device for an electrical component which improves the quality of transmission and reduces the mounting density of a printed circuit board in the power feed device or reduces the...
7671449 Structures and methods for an application of a flexible bridge  
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active...
7671450 Integrated circuit package for high-speed signals  
An integrated circuit package having a multi-segment transmission line transformer for impedance matching a packaged integrated circuit, such as a driver or receiver, to a printed circuit board...
7656036 Line component and semiconductor circuit using line component  
A semiconductor circuit in which low impedance characteristics required for a decoupling circuit are ensured up to a band of several hundreds of MHz or above in the situation where digital...
7649245 Structures and methods for a flexible bridge that enables high-bandwidth communication  
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active...
7646082 Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density  
A multi-layer circuit substrate and method having improved transmission line integrity and increased routing density uses a selectively applied transmission line reference plane metal layer to...