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8183593 Semiconductor die with integrated electro-static discharge device  
A semiconductor die is described. This semiconductor die includes an electro-static discharge (ESD) device with a metal component coupled to an input-output (I/O) pad, and coupled to a ground...
8179695 Mirror image shielding structure  
A mirror image shielding structure is provided, which includes an electronic element and a ground shielding plane below the electronic element. The shape of the ground shielding plane is identical...
8178953 On-chip RF shields with front side redistribution lines  
A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip,...
8178956 Integrated circuit package system for shielding electromagnetic interference  
An integrated circuit package system includes: providing a substrate; coupling an integrated circuit to the substrate; mounting a shielding element around the integrated circuit; applying a...
8171441 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices  
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is...
8169059 On-chip RF shields with through substrate conductors  
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, the system on a chip includes an RF component disposed on a first part of a substrate, a...
8169052 Semiconductor device  
A metal electrode is disposed on each of a plurality of resistor groups which are made of polycrystalline silicon resistors and constitute a resistor circuit. The metal electrode is connected to an...
8164167 Integrated circuit structure and a method of forming the same  
An integrated circuit structure is disclosed. The integrated circuit structure includes a first package substrate including a radiating element, the radiating element having a radiating element...
8164159 Semiconductor resonators with electromagnetic and environmental shielding and methods of forming same  
A reference signal generator includes an integrated circuit substrate having a semiconductor resonator therein. The resonator includes an inductor extending adjacent a first surface of the...
8164150 Quantum dot illumination devices and methods of use  
The present disclosure relates to illumination devices and methods of generating light for extended periods of time without requiring an outside source of power, recharging, refueling or...
8166434 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices  
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is...
8161442 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices  
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is...
8138584 Method of forming a semiconductor package and structure thereof  
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination...
8138024 Package system for shielding semiconductor dies from electromagnetic interference  
A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive...
8138563 Circuit structures and methods with BEOL layers configured to block electromagnetic edge interference  
Back-end-of-line (BEOL) circuit structures and methods are provided for blocking externally-originating or internally-originating electromagnetic edge interference. One such BEOL circuit structure...
8130513 Radio-frequency package  
A radio-frequency package includes a radio-frequency device, a multilayer dielectric substrate, and an electromagnetic shield member. The multilayer dielectric substrate includes an internal...
8129824 Shielding for a semiconductor package  
A semiconductor device has a substrate. A first die is electrically attached to a first surface of the substrate. A shield spacer having a first and second surface is provided wherein the second...
8128419 Distributor device for use in communication and data systems technology  
The invention relates to a distributor device for use in communication and data systems technology, comprising at least one distributor connection module. Said distributor connection module...
8129266 Method of forming a shielded semiconductor device and structure therefor  
In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A...
8125058 Faraday cage for circuitry using substrates  
An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device. For example, the first...
8125788 Circuit module and radio communications equipment, and method for manufacturing circuit module  
An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board...
8125057 Magnetic shielding for integrated circuit  
A shielded integrated circuit structure including an integrated circuit having a plurality of functional elements thereon, and a tiled array comprising a plurality of shielding elements, each...
8122412 Shelding mesh design for an integrated circuit device  
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is...
8116099 Circuit board device, electronic device provided with the same, and GND connecting method  
Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An...
8115112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates  
Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and...
8115325 Semiconductor integrated circuit including plurality of bonding pads  
A semiconductor integrated circuit includes a plurality of bonding pads formed along an edge of a semiconductor substrate; a plurality of I/O cells arranged along the edge under the plurality of...
8115283 Reversible top/bottom MEMS package  
A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the...
8110902 Chip package and manufacturing method thereof  
A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can...
8110882 Semiconductor device with magnetic powder mixed therein and manufacturing method thereof  
A semiconductor device includes a semiconductor substrate on one side of which an integrated circuit and a plurality of connection pads connected to the integrated circuit are provided. An...
8110441 Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die  
A semiconductor device is made by mounting a plurality of semiconductor die to a substrate, depositing an encapsulant over the substrate and semiconductor die, forming a shielding layer over the...
8102032 System and method for compartmental shielding of stacked packages  
A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second...
8102033 Reduced soft error rate through metal fill and placement  
A method for reducing single event upsets in an integrated circuit includes the step of providing a plurality of levels within the integrated circuit, wherein the plurality of levels within the...
8102031 Security element for an integrated circuit, integrated circuit including the same, and method for securing an integrated circuit  
An integrated circuit including a substrate; a circuit pattern formed over the substrate; and one or more fences formed around edges of the circuit pattern, each of the one or more fences having a...
8101460 Semiconductor device and method of shielding semiconductor die from inter-device interference  
A plurality of stacked semiconductor wafers each contain a plurality of semiconductor die. The semiconductor die each have a conductive via formed through the die. A gap is created between the...
8102034 Semiconductor device and manufacturing method of the same  
With the use of a conductive shield formed on the top or bottom side of a semiconductor integrated circuit, an electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor...
8093691 System and method for RF shielding of a semiconductor package  
A semiconductor device has a substrate having a plurality of metal traces. At least one electronic component is electrically coupled to a first surface of the substrate. A mold compound is used for...
8084857 Method and article of manufacture for wire bonding with staggered differential wire bond pairs  
A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the...
8080880 Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads  
A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact...
8080864 Solution of power consumption reduction for inverter covered by metal case  
For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding...
8076757 Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference  
A semiconductor device has an IPD structure formed over a substrate. First and second electrical devices are mounted to a first surface of the IPD structure. An encapsulant is deposited over the...
8076758 Wafer structure  
A wafer structure includes a plurality of dies, an edge portion, a passivation layer, and a UV-blocking metal layer. Each of the dies having an integrated circuit formed thereon, and the circuit...
8072047 Integrated circuit package system with shield and tie bar  
An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield over the integrated circuit with the...
8074197 Shielding mesh design for an integrated circuit device  
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is...
8072048 Semiconductor apparatus  
Disclosed is a semiconductor apparatus that prevents diffusion of materials of a magnetic film during the process for manufacturing the semiconductor apparatus. The semiconductor apparatus...
8063469 On-chip radio frequency shield with interconnect metallization  
Structure and method for fabricating a system on chip with an on-chip RF shield including interconnect metallization is described. In one embodiment, the system on chip includes an RF circuitry...
8058712 Device having wire bond and redistribution layer  
A semiconductor device comprises a copper redistribution line, a copper inductor and aluminum wire bond pads and the integration of the resulting device with an integrated circuit on a single chip,...
8053872 Integrated shield for a no-lead semiconductor device package  
The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one...
8053873 IC having voltage regulated integrated Faraday shield  
An integrated circuit (IC) includes a substrate having a top semiconductor surface and a bottom surface, and integrated circuitry including an analog subcircuit and at least one digital subcircuit...
8049311 Electronic component and method for its production  
An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from...
8049119 Integrated circuit package having integrated faraday shield  
A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first...
Matches 1 - 50 out of 718 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >