|
Match
|
Document |
Document Title |
|
|
7629674 |
Shielded package having shield fence
A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a...
|
|
|
7626247 |
Electronic package with integral electromagnetic radiation shield and methods related thereto
A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature,...
|
|
|
7622793 |
Flip chip shielded RF I/O land grid array package
A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings...
|
|
|
7622792 |
Semiconductor device and method of manufacturing the same
A conductive region electrically connected to a buffer coat film is formed on at least one corner of a semiconductor substrate, so that electricity charged on a package seal resin or a surface of...
|
|
|
7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
|
|
|
7615836 |
Magnetic self-assembly for integrated circuit packages
An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one...
|
|
|
7612396 |
Semiconductor device
A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the...
|
|
|
7608913 |
Noise isolation between circuit blocks in an integrated circuit chip
An integrated circuit includes a p-well block region having a high resistivity due to low doping concentration formed in a region of a substrate for providing noise isolation between a first...
|
|
|
7598597 |
Segmented magnetic shielding elements
A second shield layer, under the master shielding layer, is added to a segmented MRAM array. This additional shielding is patterned so as to provide one shield per bit slice. The placement of...
|
|
|
7598596 |
Methods and apparatus for a dual-metal magnetic shield structure
A shield structure for shielding an electromagnetic-field-susceptible region of a semiconductor component (e.g., a magnetoresistive random access memory, or “MRAM”) includes a stress-relief...
|
|
|
7598585 |
Structure for preventing leakage of a semiconductor device
A structure for preventing leakage of a semiconductor device is provided. The structure comprises a conductive layer, for shielding the features beneath thereof, located under a conductive line...
|
|
|
7592687 |
Device and method for preventing an integrated circuit from malfunctioning due to surge voltage
A device and method for preventing an integrated circuit from malfunctioning due to a surge voltage are provided. The device which is interposed between a node and a ground in the integrated...
|
|
|
7582964 |
Semiconductor package having non-ceramic based window frame
A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a...
|
|
|
7579672 |
Semiconductor package with electromagnetic shielding capabilities
A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate ( 101 ), a plurality of semiconductor dies ( 102 ), a plurality of...
|
|
|
7576415 |
EMI shielded semiconductor package
An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of...
|
|
|
7573124 |
Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same
A semiconductor packaging structure having electromagnetic shielding function is disclosed, in which the packaging structure includes a carrier and a semiconductor substrate disposed thereon. The...
|
|
|
7571408 |
Methods and apparatus for diagonal route shielding
An IC device and layout having one or more layers having route segments and at least some shield segments that are diagonal in orientation. Shield termination segments enclosing a route segment may...
|
|
|
7569915 |
Shielding arrangement to protect a circuit from stray magnetic fields
A shielding arrangement for protecting a circuit containing magnetically sensitive materials from external stray magnetic fields. A shield of a material having a relatively high permeability is...
|
|
|
7569458 |
Non-thermally annealed doped semiconductor material and methods related thereto
A method of non-thermal annealing of a silicon wafer comprising irradiating a doped silicon wafer with electromagnetic radiation in a wavelength or frequency range coinciding with lattice phonon...
|
|
|
7564121 |
Semiconductor device having shield structure
A semiconductor device of the present invention has a base plate, a digital circuit section provided on a side of an upper surface of the base plate and having a plurality of external connection...
|
|
|
7557431 |
Microwave surface mount hermetically sealed package and method of forming the same
A broadband surface mounting package includes a housing having a flat bottom wall forming parallel first and second surfaces. An integral wall forms, with the bottom wall, an enclosure having a top...
|
|
|
7557307 |
Electronic component and its manufacturing method
An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The...
|
|
|
7554178 |
Semiconductor device
A semiconductor device includes a semiconductor element, a first signal line connected with the semiconductor element, and a light-blocking region enclosing the semiconductor element, a first...
|
|
|
7550826 |
Field device incorporating circuit card assembly as environmental and EMI/RFI shield
A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit...
|
|
|
7545662 |
Method and system for magnetic shielding in semiconductor integrated circuit
A circuit with an inter-module radiation interference shielding mechanism is disclosed. The circuit includes a circuit module producing a radiation field. At least one radiation shielding module is...
|
|
|
7545025 |
Semiconductor device
Disclosed is a semiconductor device which includes a semiconductor chip and a base substrate. The semiconductor chip includes a semiconductor substrate, an interconnect layer and a high-frequency...
|
|
|
7538804 |
Solid state image pick-up device and image pick-up system
A solid state image pick-up device has shields for suppressing deterioration in a ratio of an output signal to output noises caused by crosstalks, suppressing deterioration in a ratio of the output...
|
|
|
7528468 |
Capacitor assembly with shielded connections and method for forming the same
A capacitor assembly ( 82 ) is formed on a substrate ( 20 ). The capacitor assembly a first conductive plate ( 38 ) and a second conductive plate ( 60 ) formed over the substrate such that the...
|
|
|
7528467 |
IC substrate with over voltage protection function
The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to...
|
|
|
7528443 |
Semiconductor device with recessed gate and shield electrode
A semiconductor device includes a substrate having a recess, a gate electrode in the recess in the substrate, and a source electrode and a drain electrode disposed on opposite sides of the gate...
|
|
|
7525192 |
Printed circuit board with quartz crystal oscillator
A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the...
|
|
|
7518230 |
Semiconductor chip and semiconductor device
A semiconductor chip according to the present invention is a semiconductor chip having a circuit forming region, in which an internal circuit including a function element is formed, on the middle...
|
|
|
7518218 |
Total ionizing dose suppression transistor architecture
A total ionizing dose suppression architecture for a transistor and a transistor circuit uses an “end cap” metal structure that is connected to the lowest potential voltage to overcome the...
|
|
|
7514765 |
Solution of power consumption reduction for inverter covered by metal case
For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding...
|
|
|
7508019 |
Semiconductor device
A semiconductor device includes a semiconductor element that is set up on a semiconductor layer, a light shielding wall that is set up around the semiconductor element, a hole that is set up on the...
|
|
|
7504710 |
Multilayer dielectric substrate and semiconductor package
A multilayer dielectric substrate that mounts a semiconductor device in a cavity formed on a substrate. The multilayer dielectric substrate includes an opening formed in a surface-layer grounding...
|
|
|
7501924 |
Self-shielding inductor
An oscillator circuit formed at least partially on an integrated circuit substrate includes a self-shielding inductor. The self-shielding inductor has a toroidal structure. A coil forms a structure...
|
|
|
7498664 |
Semiconductor package having increased resistance to electrostatic discharge
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield...
|
|
|
7498663 |
Semiconductor integrated circuit
In a semiconductor integrated circuit ( 100 ) having a shielding film ( 1 ) formed by a material different from at least either of a semiconductor substrate ( 4 ) and an interlayer insulating film...
|
|
|
7495317 |
Semiconductor package with ferrite shielding structure
A semiconductor device comprises at the wafer level one or more ferrite structures adapted to dampen high frequency noise potentially apparent at signal lines and termination points within the...
|
|
|
7489015 |
Magnetic shielding for magnetic random access memory
A memory assembly comprises a substrate that incorporates magnetic shielding, a magnetic random access memory die supported by the substrate, and an encapsulation matrix that includes magnetic...
|
|
|
7488903 |
Method for manufacturing circuit modules and circuit module
A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top...
|
|
|
7485976 |
Tamper resistant packaging and approach
A tamper-resistant packaging approach protects non-volatile memory. According to an example embodiment of the present invention, an array of magnetic memory elements ( 130 - 132 ) in an integrated...
|
|
|
7482678 |
Surface-mounted microwave package and corresponding mounting with a multilayer circuit
The invention relates to a microwave package delimiting an interior volume, comprising a Faraday cage formed by a conducting surface surrounding the interior volume, a connection point placed...
|
|
|
7479407 |
Digital and RF system and method therefor
A stacked die system ( 10 ) has a first die ( 16 ) having a first surface with active circuitry, a second die ( 18 ) having a first surface with active circuitry, and a conductive shield ( 28 )...
|
|
|
7470977 |
Modular board device, high frequency module, and method of manufacturing same
The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate ( 11 ) in which conductive pattern or patterns are...
|
|
|
7459769 |
Magnetic shield member, magnetic shield structure, and magnetic memory device
It is an object of the invention to relax magnetic saturation and realize a high-performance magnetic shield effect that is suitable for magnetic devices such as an MRAM. A magnetic shield member...
|
|
|
7456492 |
Semiconductor device having semiconductor element, insulation substrate and metal electrode
A semiconductor device includes: first and second metal electrodes having inner surfaces facing each other; a semiconductor element sandwiched between the electrodes; and first and second...
|
|
|
7449768 |
Electromagnetic wave shielding sheet
There is provided an electromagnetic wave shielding sheet which can effectively prevent an adhesive layer from being colored at the time of etching. The electromagnetic wave shielding sheet...
|
|
|
7445942 |
Process for manufacturing segmented MRAM array with patterned segmented magnetic shields
A second shield layer, under the master shielding layer, is added to a segmented MRAM array. This additional shielding is patterned so as to provide one shield per bit slice. The placement of...
|