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9041152 Inductor with magnetic material  
In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die...
9041168 Overmolded semiconductor package with wirebonds for electromagnetic shielding  
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the...
9018080 Wafer processing method  
A wafer processing method of dividing a wafer along a plurality of crossing streets formed on the wafer to obtain individual chips. The wafer processing method includes a modified layer forming...
9018741 Semiconductor package and manufacturing method thereof  
A semiconductor package is presented which has a suitable structure for effectively shielding electromagnetic wave interference (EMI) in a cavity area to which a semiconductor chip is attached....
9013882 High-frequency module  
A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding,...
9006868 Encapsulation of an MEMS component and a method for producing said component  
The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on...
9000582 Power semiconductor module and power conversion device  
A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connected to the power semiconductor element; a case in which the circuit body is...
9000587 Wafer-level thin chip integration  
A wafer-level package device and techniques for fabricating the device are described that include embedding a silicon chip onto an active device wafer or a passive device wafer, where the embedded...
9000453 Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same  
Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic...
8994152 Metal shield for integrated circuits  
A metal shield structure is provided for an integrated circuit (IC) having at least a first metal contact coupled to a fixed potential and a second metal contact. A first passivation layer is...
8994188 Interconnect structures for substrate  
A device for use with integrated circuits is provided. The device includes a substrate having a through-substrate via formed therethrough. Dielectric layers are formed over at least one side of...
8987872 Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages  
One feature pertains to a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate. At least one integrated circuit is coupled to a...
8987839 Ground shield structure and semiconductor device  
Various embodiments provide ground shield structures, semiconductor devices, and methods for forming the same. An exemplary structure can include a substrate and a dielectric layer disposed on the...
8987871 Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture  
A cap for a microelectromechanical system device includes a first layer of, e.g., Bismaleimide Triazine (BT) resin material in which a through-aperture is formed, laminated to a second layer of BT...
8981579 Impedance controlled packages with metal sheet or 2-layer rdl  
A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a...
8981537 Reversible top/bottom MEMS package  
A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the...
8981238 Electronic device  
An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component...
8975620 Organic semiconductor device and manufacturing method thereof  
An organic semiconductor device includes a carrier, a source, a drain, an organic semiconductor single-crystalline channel layer, an organic insulation layer and a gate. The source and the drain...
8963299 Semiconductor package and fabrication method thereof  
A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side...
8963285 Semiconductor device and method of manufacturing thereof  
A semiconductor device includes a semiconductor substrate having a first main surface in which a recess is formed. Further, the semiconductor device includes an electrical interconnect structure...
8963298 EMI shielding package structure and method for fabricating the same  
An EMI shielding package structure includes a substrate unit having a first surface with a die mounting area and a second surfaces opposite to the first surface, metallic pillars formed on the...
8951812 Vertically oriented semiconductor device and shielding structure thereof  
The present disclosure involves a semiconductor device. The semiconductor device includes a substrate. The semiconductor device includes an electronic device positioned over the substrate. The...
8952489 Semiconductor package and method for fabricating the same  
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled...
8952505 Semiconductor device  
According to one embodiment, a semiconductor device includes a circuit substrate, a semiconductor element, a sealing resin layer, and a conductive shielding layer. The circuit substrate includes...
8952504 Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)  
Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer...
8952503 Organic module EMI shielding structures and methods  
Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a...
8946873 Redistribution structures for microfeature workpieces  
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry...
8946874 IC in-process solution to reduce thermal neutrons soft error rate  
Integrated Circuits and methods for reducing thermal neutron soft error rate (SER) of a digital circuit are provided by doping a protection layer on top of the metal layer and in physical contact...
8946749 Semiconductor light emitting device  
A semiconductor light emitting device includes a substrate having a wiring pattern formed thereon, and a semiconductor light emitting element mounted on one main surface of the substrate and...
8941250 Electronic component package fabrication method and structure  
A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution...
8941230 Semiconductor package and manufacturing method  
A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the...
8937371 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV  
A semiconductor device has an interconnect structure with a cavity formed partially through the interconnect structure. A first semiconductor die is mounted in the cavity. A first TSV is formed...
8937370 Memory device and fabricating method thereof  
The present disclosure provides a memory device and a fabricating method thereof. The memory device includes a substrate including a first metal layer formed therein, the first metal layer having...
8933544 Integrated circuit stack with integrated electromagnetic interference shielding  
An integrated circuit system includes a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer...
8928128 Semiconductor package with integrated electromagnetic shielding  
There are disclosed herein various implementations of a shield interposer situated between a top active die and a bottom active die for shielding the active dies from electromagnetic noise. One...
8928127 Noise decoupling structure with through-substrate vias  
A device includes a substrate having a front surface and a back surface; an integrated circuit device at the front surface of the substrate; and a metal plate on the back surface of the substrate,...
8916420 Chip package and manufacturing method thereof  
An embodiment provides a chip package including a substrate, a cavity extending downward from an upper surface of the substrate, a metal layer overlying the substrate and conformally covering a...
8909942 MRAM-based security for data storage systems  
A secure data storage system includes a mechanism that can be activated to inhibit access to stored data. In one embodiment, access to stored data can be prevented without having to erase or...
8907460 Semiconductor device  
To suppress the noise caused by an inductor leaks to the outside, and also to be configured such that magnetic field intensity change reaches the inductor. An inductor surrounds an internal...
8907459 Three-dimensional semiconductor integrated circuit device and method of fabricating the same  
A three-dimensional semiconductor integrated circuit device is provided. A first semiconductor chip includes a solid-state circuit and is smaller than a base, and is stacked on the base. The first...
8901688 High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same  
A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces...
8901631 Vertical transistor in semiconductor device and method for fabricating the same  
Provided is a method for fabricating a semiconductor device, including the following steps. A substrate having a plurality of pillars is provided, wherein a plurality of trenches are formed around...
8896105 Microelectronic devices and methods for manufacturing microelectronic devices  
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a method includes constructing a radiation sensitive component in and/or on a...
8895357 Integrated circuit and method of manufacturing the same  
Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a...
8890294 Stack semiconductor package and manufacturing the same  
To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the...
8890265 Semiconductor device and microphone  
A package is formed by vertically stacking a cover and a substrate. A microphone chip is mounted at the top surface of a concave portion provided to the cover, and a circuit element is mounted on...
8891241 Electronic assembly  
An electronic assembly includes a heat generating element, a heat dissipation fin set and a filter circuit board. The filter circuit board is disposed between the heat generating element and the...
8884407 Devices for providing an electrical connection  
A device includes a tube extending in a longitudinal direction and a hollow channel arranged in the tube. An end part of the tube is formed such that first electromagnetic radiation paths...
8884408 ***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***
Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
 
Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer...
8878321 Magnetoresistive element and producing method thereof  
According to one embodiment, a magnetoresistive element comprises a first magnetic layer, in which a magnetization direction is variable and is perpendicular to a film surface, a tunnel barrier...