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9029850 Organic light-emitting display apparatus  
An organic light-emitting display apparatus includes a thin film transistor including an active layer, a gate electrode, source and drain electrodes, a first insulating layer between the active...
9029228 Direct and sequential formation of monolayers of boron nitride and graphene on substrates  
The invention generally related to a method for preparing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate. The layer of graphene may be formed in...
9006715 Electronic device  
A method of making an electronic device comprising a double bank well-defining structure, which method comprises: providing an electronic substrate; depositing a first insulating material on the...
8999167 Composite porous membrane and process for producing the same  
There is provided a composite porous membrane comprising a porous membrane comprised of an organic polymeric compound, and a supporting porous membrane adjacent to the porous membrane,...
8987902 Semiconductor device, semiconductor package, and method for manufacturing semiconductor device  
A semiconductor device includes a semiconductor substrate. The semiconductor substrate includes a first surface, a second surface, and a through hole that extends through the semiconductor...
8946864 Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same  
Systems and methods for preparing films comprising metal using sequential ion implantation, and films formed using same, are provided herein. A structure prepared using ion implantation may...
8912532 Patterning the emission colour in top-emissive OLEDs  
The invention relates to a top-emissive organic light-emitting diode (OLED) (10) arranged to emit light having different emission colors, comprising a multi-layered structure provided with a first...
8884310 Direct formation of graphene on semiconductor substrates  
The invention generally related to a method for preparing a layer of graphene directly on the surface of a semiconductor substrate. The method includes forming a carbon-containing layer on a front...
8872338 Trace routing within a semiconductor package substrate  
A semiconductor device includes a substrate configured with a plurality of conductive traces. The traces are configured to electrically couple to an integrated circuit (IC) die and at least one of...
8860014 Organic electroluminescent member and method for producing organic electroluminescent element  
An organic electroluminescent member comprising: a positive electrode and a negative electrode on a substrate: multiple organic layers which include at least a positive hole transport layer, a...
8847367 Organic electroluminescent device  
Provided are a hole-injecting material for an organic electroluminescent device (organic EL device) exhibiting high luminous efficiency at a low voltage and having greatly improved driving...
8836127 Interconnect with flexible dielectric layer  
An integrated circuit device has a dual damascene structure including a lower via portion and an upper line portion. The lower via portion is formed in a polyimide layer, and the upper line...
8796825 Materials, structures and methods for microelectronic packaging  
Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later...
8779561 LED backlight unit without printed circuit board and method of manufacturing the same  
Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light...
8742405 Light emitting unit, light emitting device, and lighting device  
The light-emitting unit has at least a first light-emitting element, a second light-emitting element, and a separation layer. The separation layer has a leg portion and a stage portion which...
8692263 Organic light emitting diode display and manufacturing method thereof  
A large size organic light emitting diode (OLED) display and manufacturing method thereof are disclosed. In one embodiment, the method includes i) forming a display unit including a plurality of...
8669653 Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor  
A semiconductor device includes: a wiring board which includes a first face and a second face and in which a conductor pattern and a through part are provided; an electronic component which...
8669666 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element  
An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation...
8592956 Resist underlayer film composition and patterning process using the same  
There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following...
8525174 Organic light emitting display device and method of manufacturing the same  
An organic light emitting display device constructed with an active layer of a thin film transistor formed on a substrate; a gate electrode including a first transparent conductive layer and a...
8513808 Semiconductor device having trench-isolated element formation region  
Provided is a technique capable of improving the reliability of a semiconductor device having a slit made over a main surface of a semiconductor substrate, so as to surround each element formation...
8481993 Semiconductor composite film, method for forming semiconductor composite film, thin film transistor, method for manufacturing thin film transistor, and electronic apparatus  
A semiconductor composite film includes a semiconductor thin film layer containing an organic semiconductor material, an insulating thin film layer formed from a polymer material phase-separated...
8455872 Electronic devices having plastic substrates  
A method of manufacturing a thin film electronic device comprises applying a first plastic coating (PI-1) directly to a rigid carrier substrate (40) and forming thin film electronic elements (44)...
8384209 Semiconductor device and method for manufacturing semiconductor device  
To reduce defects of a semiconductor device, such as defects in shape and characteristic due to external stress and electrostatic discharge. To provide a highly reliable semiconductor device. In...
8314435 Organic light emitting diode display  
An organic light emitting diode display is disclosed. The organic light emitting diode display includes a plurality of subpixels that emit light of at least three colors, the plurality of...
8269309 Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same  
In order to improve the reliability of a semiconductor device having a fuse formed by a Damascene technique, a barrier insulating film and an inter-layer insulating film are deposited over a...
8269317 Phosphorescent materials  
Compounds comprising a ligand having a quinoline or isoquinoline moiety and a phenyl moiety, e.g., (iso)pq ligands. In particular, the ligand is further substituted with electron donating groups....
8198624 Organic light emitting device  
An organic light emitting device is disclosed. The organic light emitting device includes a substrate, a display positioned on the substrate, and a dummy pattern positioned at an edge of the...
8138502 Light-emitting device and manufacturing method thereof  
To prevent a point defect and a line defect in forming a light-emitting device, thereby improving the yield. A light-emitting element and a driver circuit of the light-emitting element, which are...
8134149 Organic light emitting device  
The present invention has an object of providing a light emitting device including an OLED formed on a plastic substrate, which can prevent the degradation due to penetration of moisture or...
8129267 Alpha particle blocking wire structure and method fabricating same  
An alpha particle blocking structure and method of making the structure. The structure includes: a semiconductor substrate; a set of interlevel dielectric layers stacked from a lowermost...
8129272 Hidden plating traces  
A strengthened semiconductor die substrate and package are disclosed. The substrate may include contact fingers formed with nonlinear edges. Providing a nonlinear contour to the contact finger...
8129823 Materials, structures and methods for microelectronic packaging  
Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later...
8076681 White organic electroluminescent device  
A high-efficiency, white organic electroluminescent device has such a structure that its emission layer is obtained by laminating sub-emission layers of red, green, and blue, respectively. The...
8062774 Organic electroluminescence display and method of producing same  
There is provided an organic electroluminescence display includes a lower electrode formed on a substrate, a device separation film formed on the lower electrode, an organic compound layer formed...
8053861 Diffusion barrier layers  
Provided are methods and apparatuses for depositing barrier layers for blocking diffusion of conductive materials from conductive lines into dielectric materials in integrated circuits. The...
8026185 Method for manufacturing electronic circuit component  
An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1, which can manufacture an electronic circuit component...
8018057 Semiconductor device with resin layers and wirings and method for manufacturing the same  
A semiconductor device includes: a semiconductor substrate that has an integrated circuit and an electrode electrically connected to the integrated circuit; a first resin layer that is formed in a...
7999362 Method and apparatus for making semiconductor devices including a foil  
A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor...
7968966 Semiconductor device with fuse and a method of manufacturing the same  
In order to improve the reliability of a semiconductor device having a fuse formed by a Damascene technique, a barrier insulating film and an inter-layer insulating film are deposited over a...
7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same  
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of...
7960717 Electronic device and process for forming same  
An electronic device includes a substrate, a first organic electronic component overlying the substrate, wherein, from a plan view, the first organic electronic component defines a perimeter of a...
7955875 Forming light emitting devices including custom wavelength conversion structures  
Methods of forming a light emitting device include selectively forming a wavelength conversion structure on a light emitting element using stereolithography. Selectively forming the wavelength...
7952193 Method and apparatus for deploying a liquid metal thermal interface for chip cooling  
In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an...
7936075 Semiconductor device and semiconductor device manufacturing method  
The present invention provides a semiconductor device for which thermal stress at mounting is reduced and a reduction in reliability with regard to moisture absorption is prevented. The...
7919867 Chip structure and process for forming the same  
A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate....
7910674 Polymerized cycloolefins using transition metal catalyst and end products thereof  
Methods for the addition polymerization of cycloolefins using a cationic Group 10 metal complex and a weakly coordinating anion of the formula: [(R′)zM(L′)x(L″)y]b[WCA]d wherein [(R′)zM(L′)x(L″)y]...
7902642 Resin composition for sealing light-emitting device and lamp  
A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, an aliphatic hydrocarbon including one or...
7897433 Semiconductor chip with reinforcement layer and method of making the same  
Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip...
7884355 Polymer transistor  
A transistor including a semiconductive layer; and a gate dielectric layer comprising an insulating polymer, characterised in that the insulating polymer is crosslinked and comprises one or more...

Matches 1 - 50 out of 202 1 2 3 4 5 >